JP7307105B2 - Crushing device for printed circuit board waste - Google Patents

Crushing device for printed circuit board waste Download PDF

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JP7307105B2
JP7307105B2 JP2021023124A JP2021023124A JP7307105B2 JP 7307105 B2 JP7307105 B2 JP 7307105B2 JP 2021023124 A JP2021023124 A JP 2021023124A JP 2021023124 A JP2021023124 A JP 2021023124A JP 7307105 B2 JP7307105 B2 JP 7307105B2
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printed circuit
circuit board
pulverizer
crusher
impact
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JP2021090963A (en
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秀行 森明
敬幸 木寺
和弘 野村
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JX Nippon Mining and Metals Corp
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

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  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Description

本発明は、プリント基板屑の粉砕装置に関する。 The present invention relates to an apparatus for crushing printed circuit board waste.

プリント基板、部品を搭載したプリント基板及びこれらの製造工程で発生する成形残から銅滓などの有価金属を回収する方法が提案されている。 Methods have been proposed for recovering valuable metals such as copper slag from printed circuit boards, printed circuit boards on which parts are mounted, and molding residues generated in the manufacturing processes thereof.

例えば、特許文献１には、処理対象物を粗粉砕し、続けて圧縮力やせん断力などの外力を加えて微粉砕し、微粉砕物を金属分などの比重の大きな物質を多く含む部分及び樹脂などの比重の小さな物質を多く含む部分の比重差を使用して分離し、さらに導電体を多く含む部分と、絶縁体を多く含む部分とに静電分離することにより、有価金属を回収する方法が開示されている。 For example, in Patent Document 1, an object to be treated is coarsely pulverized, and then finely pulverized by applying an external force such as a compressive force or a shearing force, and the finely pulverized product is a portion containing a large amount of a substance with a large specific gravity such as a metal content. Valuable metals are recovered by separating using the difference in the specific gravity of the portion containing a large amount of substances with a small specific gravity such as resin, and then electrostatically separating the portion containing a large amount of conductors and the portion containing a large amount of insulators. A method is disclosed.

特開平０７－２５１１５４号公報JP-A-07-251154

特許文献１に記載された技術では、処理対象物を微粉砕するのにローラミルを用いている。ローラミル等のせん断式の粉砕機では、有価金属と基板層とを十分に剥離することができず、有価金属の回収効率が低下するおそれがある。また、プリント基板屑を粉砕する装置においては、プリント基板屑と接触する部分が摩耗するおそれがある。 In the technique described in Patent Document 1, a roller mill is used to pulverize the object to be processed. In a shearing type pulverizer such as a roller mill, the valuable metal cannot be sufficiently separated from the substrate layer, and the recovery efficiency of the valuable metal may be lowered. In addition, in a device for crushing printed circuit board scraps, there is a risk that the parts that come into contact with the printed circuit board scraps will wear out.

本発明は上記の課題に鑑み、長期にわたってプリント基板屑からの有価金属の回収効率を高く維持することが可能なプリント基板屑の粉砕装置を提供することを目的とする。 SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an apparatus for crushing printed circuit board scraps capable of maintaining high recovery efficiency of valuable metals from printed circuit board scraps over a long period of time.

本発明に係るプリント基板屑の粉砕装置は、衝撃式粉砕機によりプリント基板屑を粉砕するプリント基板屑の粉砕装置において、前記衝撃式粉砕機は、第１のスクリーン径の第１の中間粉砕機と、前記第１のスクリーン径よりも小さい第２のスクリーン径の第２の中間粉砕機と、前記第２のスクリーン径よりも小さい第３のスクリーン径の最終粉砕機と、を含み、少なくとも前記第２の中間粉砕機及び前記最終粉砕機のスクリーンの孔を形成する縁部にＷＣ溶射処理が施されている。 A printed circuit board scrap pulverizer according to the present invention is a printed circuit board scrap pulverizer for pulverizing printed circuit board scrap by an impact pulverizer, wherein the impact pulverizer is a first intermediate pulverizer having a first screen diameter. and a second intermediate crusher with a second screen diameter smaller than the first screen diameter , and a final crusher with a third screen diameter smaller than the second screen diameter , at least the The perforated edges of the screens of the second intermediate crusher and the final crusher are WC thermal sprayed.

本発明に係るプリント基板屑の粉砕装置によれば、長期にわたってプリント基板屑からの有価金属の回収効率を高く維持することができる。 According to the apparatus for crushing printed circuit board scraps according to the present invention, it is possible to maintain high recovery efficiency of valuable metals from printed circuit board scraps over a long period of time.

廃プリント基板の処理工程を表す工程図である。FIG. 3 is a process diagram showing a process for treating waste printed circuit boards.

図１は、廃プリント基板の処理工程を表す工程図である。図１で例示するように、出発原料は廃プリント基板である。本実施形態において、廃プリント基板とは、電子部品等が実装されていないプリント基板を意味し、電子部品を実装する前のプリント基板（以後、ベタ基板と称する）、電子部品が実装された回路基板の製造工程において、打ち抜きにより発生するプリント基板の成形残（以後、枠基板と称する）、及び切断により発生するプリント基板の切れ端（以後、長尺基板と称する）を含む。 FIG. 1 is a process diagram showing a process for treating waste printed circuit boards. As illustrated in FIG. 1, the starting material is waste printed circuit boards. In this embodiment, a waste printed circuit board means a printed circuit board on which electronic components are not mounted, and a printed circuit board before mounting electronic components (hereinafter referred to as a solid board), a circuit on which electronic components are mounted, etc. In the board manufacturing process, it includes printed board leftovers generated by punching (hereinafter referred to as frame board) and pieces of printed board generated by cutting (hereinafter referred to as long board).

（予備粉砕）
予備粉砕では、例えば、スクリーン径５０ｍｍの一軸粉砕機を用いて、廃プリント基板を１次粉砕で使用する衝撃式粉砕機に投入可能なサイズ（例えば、縦及び横の長さが５０ｍｍ以下）にする。廃プリント基板のうち、そのサイズが既に１次粉砕で使用する衝撃式粉砕機に投入可能なサイズとなっているもの（例えば、長尺基板）については、予備粉砕は行われない。以後、１次粉砕で使用する衝撃式粉砕機に投入可能なサイズとなっている廃プリント基板をプリント基板屑と称する。 (Preliminary pulverization)
In the preliminary pulverization, for example, using a uniaxial pulverizer with a screen diameter of 50 mm, the waste printed circuit board is sized so that it can be put into the impact type pulverizer used in the primary pulverization (e.g., length and width are 50 mm or less). do. Of the waste printed circuit boards, pre-pulverization is not performed for those whose size has already reached a size that can be put into the impact pulverizer used in the primary pulverization (for example, long substrates). Hereinafter, waste printed circuit boards having a size that can be put into an impact crusher used for primary crushing are referred to as printed circuit board scraps.

（１次粉砕）
１次粉砕では、プリント基板屑を、例えば、スクリーン径１５ｍｍの衝撃式粉砕機（中間粉砕機）を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。また、１次粉砕を省略してもよい。ここで、衝撃式粉砕機が有するスクリーン及びプリント基板屑を粉砕する粉砕刃の表面には、硬質材料を用いた被膜処理がなされている。硬質材料は、例えばＷＣ（炭化タングステン）であり、被膜の厚さは０．１５～０．３０ｍｍであるものとし、被膜処理の際には、ＷＣ溶射を実施するものとする。なお、スクリーンのうち、プリント基板屑と多く接触しない側の面への皮膜処理は省略してもよいが、この場合にもスクリーンの孔を形成する縁部には皮膜処理を行うこととする。 (Primary pulverization)
In the primary pulverization, printed circuit board waste is pulverized using, for example, an impact pulverizer (intermediate pulverizer) with a screen diameter of 15 mm. The impact pulverizer is preferably a hammer mill. Also, the primary pulverization may be omitted. Here, the surface of the screen of the impact crusher and the crushing blade for crushing the printed circuit board waste is coated with a hard material. The hard material is, for example, WC (tungsten carbide), the thickness of the coating is 0.15 to 0.30 mm, and WC thermal spraying is performed during the coating process. Although the surface of the screen that does not come in contact with the printed circuit board dust much may be omitted, the edges of the screen where the holes are formed are also subjected to the film treatment.

（２次粉砕）
２次粉砕では、１次粉砕で粉砕したプリント基板屑を、例えば、スクリーン径９ｍｍの衝撃式粉砕機（中間粉砕機）を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。なお、この２次粉砕で用いる衝撃式粉砕機においても、スクリーン及びプリント基板屑を粉砕する粉砕刃の表面には、上記１次粉砕で用いる衝撃式粉砕機と同様、硬質材料を用いた被膜処理を行うものとする。 (Secondary pulverization)
In the secondary pulverization, the printed circuit board scraps pulverized in the primary pulverization are pulverized using, for example, an impact pulverizer (intermediate pulverizer) with a screen diameter of 9 mm. The impact pulverizer is preferably a hammer mill. In the impact-type crusher used for the secondary crushing, the surfaces of the crushing blades for crushing the screen and printed circuit board scraps are coated with a hard material as in the impact-type crusher used for the primary crushing. shall be performed.

（３次粉砕）
３次粉砕では、最終粉砕機を用いて、２次粉砕により得られた粉砕物を粉砕し、平均粒径（Ｄ５０）が２００μｍ～３６０μｍの粉体物にする。最終粉砕機は、衝撃粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミルであることがより好ましい。なお、高速ハンマーミルは、周速１００ｍ／ｓ以上のハンマーミルである。この場合、例えばスクリーン径２ｍｍのスクリーン、又は気流分級により平均粒径（Ｄ５０）が２００μｍ～３６０μｍの粉体物を得ることができる。なお、この３次粉砕で用いる最終粉砕機においても、スクリーン及びプリント基板屑を粉砕する粉砕刃の表面には、上記衝撃式粉砕機と同様、硬質材料を用いた被膜処理を行うものとする。 (Tertiary pulverization)
In the tertiary pulverization, a final pulverizer is used to pulverize the pulverized material obtained by the secondary pulverization into powder having an average particle size (D50) of 200 μm to 360 μm. The final crusher is preferably an impact crusher, more preferably a hammer mill or high speed hammer mill. In addition, a high-speed hammer mill is a hammer mill with a peripheral speed of 100 m/s or more. In this case, for example, a screen with a screen diameter of 2 mm or air classification can be used to obtain a powder having an average particle size (D50) of 200 μm to 360 μm. Also in the final pulverizer used for the tertiary pulverization, the surfaces of the pulverizing blades for pulverizing the screen and printed circuit board waste are coated with a hard material as in the impact type pulverizer.

（分離工程）
分離工程では、粉体物を、風力選別機により銅滓とそれ以外とに分離し、銅滓を回収する。風力選別機は、二種類以上の成分をそれらの比重差に基づいて分離するもので、バリアブルインパクタ、サイクロン、ミクロンセパレータ（商品名）等が挙げられる。 (Separation process)
In the separation step, the powdery material is separated into copper slag and others by an air force sorter, and the copper slag is recovered. A wind separator separates two or more components based on their specific gravities, and includes variable impactors, cyclones, micron separators (trade name), and the like.

（回収工程）
回収工程では、分離工程において排出された樹脂を含む成分から、バグフィルタなどの集塵装置を用いて樹脂を分離、回収する。このようにして得られた樹脂は、産業廃棄物の焼却炉等で処理することができる。 (Recovery process)
In the recovery step, the resin is separated and recovered from the resin-containing component discharged in the separation step using a dust collector such as a bag filter. The resin thus obtained can be disposed of in an industrial waste incinerator or the like.

本実施形態によれば、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ～３６０μｍの粉体物にすることで、有価金属と基板層とを十分に剥離することができる。これにより、基板層に付着したままの有価金属の量が低減されるので、有価金属の回収効率を向上させることができる。なお、衝撃式粉砕機はハンマーミルであることが好ましい。この場合、最終粉砕機前のハンマーミルのスクリーン径が８ｍｍ以上９ｍｍ以下であることが好ましい。また、最終粉砕機は衝撃式粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミル（周速１００ｍ／ｓ以上のハンマーミル）であることがより好ましい。 According to the present embodiment, the printed circuit board scrap is pulverized in one or two steps by an impact pulverizer, and the pulverized material after pulverizing the printed circuit board pulverizer is pulverized by the final pulverizer, and the average particle diameter (D50) is By using a powder having a size of 200 μm to 360 μm, the valuable metal and the substrate layer can be sufficiently separated. As a result, the amount of valuable metals remaining attached to the substrate layer is reduced, so that the recovery efficiency of valuable metals can be improved. Incidentally, the impact pulverizer is preferably a hammer mill. In this case, the screen diameter of the hammer mill before the final pulverizer is preferably 8 mm or more and 9 mm or less. The final pulverizer is preferably an impact pulverizer, more preferably a hammer mill or a high-speed hammer mill (hammer mill with a peripheral speed of 100 m/s or more).

また、本実施形態によれば、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により平均粒径（Ｄ５０）が２００μｍ～３６０μｍとなるよう粉砕し、最終粉砕機による粉砕によって得られた粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、有価金属を回収することで、有価金属の回収効率を向上させることができる。なお、有価金属は銅滓であることが好ましい。 Further, according to the present embodiment, the printed circuit board scrap is pulverized in one step or two stages with an impact pulverizer, and the pulverized product after pulverizing the printed circuit board pulverizer is subjected to a final pulverizer to an average particle size (D50) of 200 μm. Pulverize to 360 μm and separate the powder obtained by pulverizing with a final pulverizer into powder mainly composed of valuable metals and others with a wind sorter to recover valuable metals. , the recovery efficiency of valuable metals can be improved. The valuable metal is preferably copper slag.

また、本実施形態によれば、風力選別機により分類された樹脂分を主成分とする粉状物をバグフィルタにて回収することで、樹脂分を効率よく回収することができる。 Further, according to the present embodiment, the resin content can be efficiently recovered by recovering the powdery matter mainly composed of the resin content sorted by the wind sorter with the bag filter.

また、本実施形態によれば、衝撃式粉砕機（中間粉砕機及び最終粉砕機）の粉砕刃とスクリーンにＷＣ溶射処理を施すことで、粉砕刃やスクリーンの材質を変更しなくても、衝撃式粉砕機の粉砕刃とスクリーンの耐摩耗性を向上することができ、粉砕機とスクリーンの長寿命化を図ることができる。これにより、長期にわたって、有価金属の回収効率を高く維持することが可能となっている。なお、本発明者は、株式会社シンコーメタリコンによるＷＣ溶射処理（硬質材料はＷＣ／１２Ｃｏ、厚さは０．２０ｍｍ）が施された粉砕刃とスクリーンを有する衝撃式粉砕機を利用したところ、粉砕刃とスクリーンの耐摩耗性の向上、長寿命化を確認することができた。具体的には、ＷＣ溶射処理を行った場合の粉砕刃とスクリーンの寿命は、ＷＣ溶射処理を行わない場合に比べて、少なくとも２倍以上、通常３～６倍に延長されることが分かった。 In addition, according to the present embodiment, by applying WC thermal spraying to the crushing blades and screens of the impact crushers (intermediate crusher and final crusher), the impact can be reduced without changing the materials of the crushing blades and screens. It is possible to improve the wear resistance of the crushing blades and the screen of the type crusher, and to extend the life of the crusher and the screen. This makes it possible to maintain a high recovery efficiency of valuable metals over a long period of time. In addition, the present inventor used an impact-type crusher having a crushing blade and a screen subjected to WC thermal spraying (hard material: WC/12Co, thickness: 0.20 mm) by Shinko Metallicon Co., Ltd. We were able to confirm that the wear resistance of the blade and screen has been improved and that the service life has been extended. Specifically, it was found that the service life of the crushing blades and screens with WC spraying is at least twice as long, usually 3 to 6 times longer than without WC spraying. .

なお、上記実施形態では、衝撃式粉砕機（２つの中間粉砕機及び最終粉砕機）の全てに関し、粉砕刃とスクリーンにＷＣ溶射処理を施す場合について説明したが、これに限られるものではない。すなわち、衝撃式粉砕機の少なくとも１つにＷＣ溶射処理を施すこととしてもよい。また、衝撃式粉砕機の粉砕刃とスクリーンの両方にＷＣ溶射処理を施す場合に限らず、粉砕刃とスクリーンのいずれか一方にＷＣ溶射処理を施すこととしてもよい。 In the above embodiment, the case where the WC thermal spray treatment is applied to the crushing blades and screens for all of the impact crushers (the two intermediate crushers and the final crusher) has been described, but the present invention is not limited to this. That is, at least one of the impact pulverizers may be subjected to WC thermal spraying. Further, the WC thermal spraying treatment is not limited to both the crushing blades and the screen of the impact crusher, and either the crushing blades or the screen may be subjected to the WC spraying treatment.

以下、本発明の実施例を示すが、本発明は実施例に限定されるものではない。
（実施例１～６）
表１に示した廃プリント基板を原料とし、それぞれ示された条件により廃プリント基板の粉砕処理を行った。表２に、得られた粉体物の平均粒径（Ｄ５０）を示す。比較のため、長尺基板を原料とし、予備粉砕を行わず、１次粉砕及び２次粉砕をせん断式の粉砕機で行った。しかしながら、比較例では、２次粉砕の終了時点において、目視の状態でも十分な粉砕物を得ることが出来ず、また、有価金属と基板層とが十分に剥離できていなかったため、２次粉砕の終了時点で粉砕を中止した。 Examples of the present invention are shown below, but the present invention is not limited to the examples.
(Examples 1 to 6)
Using the waste printed circuit boards shown in Table 1 as raw materials, the waste printed circuit boards were pulverized under the conditions shown. Table 2 shows the average particle size (D50) of the obtained powder. For comparison, a long substrate was used as a raw material, and primary and secondary pulverization was performed by a shear type pulverizer without preliminary pulverization. However, in the comparative example, at the end of the secondary pulverization, sufficient pulverized material could not be obtained even visually, and the valuable metal and the substrate layer were not sufficiently separated. Milling was stopped at the end.

Figure 0007307105000001
Figure 0007307105000001
Figure 0007307105000002
Figure 0007307105000002

表２に示すように、実施例１～６において、得られた粉体物の平均粒径（Ｄ５０）は、２００～３６０μｍとなり、プリント基板屑を粉状に粉砕することができた。また、目視にて、プリント基板屑が良好に粉砕され、かつ、有価金属と基板層とが十分に剥離されていることが確認された。 As shown in Table 2, in Examples 1 to 6, the average particle size (D50) of the obtained powder was 200 to 360 μm, and the printed circuit board scrap could be pulverized into powder. Moreover, it was visually confirmed that the printed circuit board scraps were well pulverized and that the valuable metal and the circuit board layer were sufficiently separated.

風力選別機を用いて、上記の粉砕処理により得られた粉体物から銅滓及び樹脂の回収を行った。なお、粉体物に含まれる銅品位、銅量はＩＣＰ法にて測定して評価した。 Copper slag and resin were recovered from the powder material obtained by the above pulverization treatment using an air force sorter. The grade and amount of copper contained in the powder were measured and evaluated by the ICP method.

実施例１から実施例６で得られた合計の粉体物１８４ｋｇには、５０ｋｇのＣｕが含まれていたが、５６ｋｇの銅滓と１２８ｋｇの樹脂に分離された。
回収された樹脂成分の銅品位は５％未満であり、銅滓と樹脂とを有効に分離でき、また、高い回収率で銅滓成分が得られることが明らかとなった。 The total 184 kg of powder obtained in Examples 1 to 6 contained 50 kg of Cu, which was separated into 56 kg of copper slag and 128 kg of resin.
It was found that the recovered resin component had a copper grade of less than 5%, the copper slag and the resin could be effectively separated, and the copper slag component was obtained at a high recovery rate.

以上、本発明の実施例について詳述したが、本発明は係る特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。
Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and variations can be made within the scope of the gist of the present invention described in the scope of claims. Change is possible.

Claims (1)

衝撃式粉砕機によりプリント基板屑を粉砕するプリント基板屑の粉砕装置において、
前記衝撃式粉砕機は、第１のスクリーン径の第１の中間粉砕機と、前記第１のスクリーン径よりも小さい第２のスクリーン径の第２の中間粉砕機と、前記第２のスクリーン径よりも小さい第３のスクリーン径の最終粉砕機と、を含み、少なくとも前記第２の中間粉砕機及び前記最終粉砕機のスクリーンの孔を形成する縁部にＷＣ溶射処理が施されていることを特徴とするプリント基板屑の粉砕装置。
In a crusher for printed circuit board scraps that crushes printed circuit board scraps with an impact crusher,
The impact pulverizer includes a first intermediate pulverizer having a first screen diameter, a second intermediate pulverizer having a second screen diameter smaller than the first screen diameter, and a second screen diameter . and a third final crusher having a screen diameter smaller than that of the second intermediate crusher and at least edges forming holes of the screens of the second intermediate crusher and the final crusher are subjected to a WC thermal spray treatment. A crushing device for printed circuit board scraps.
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JP2019037944A (en) 2017-08-25 2019-03-14 Ｊｘ金属株式会社 Printed circuit board scrap crushing device and printed circuit board scrap crushing method

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JPH05329841A (en) * 1992-06-03 1993-12-14 Nec Corp Method for recovering valuables from printed circuit board
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JP2002302702A (en) 2001-04-04 2002-10-18 Sumitomo Special Metals Co Ltd Method for manufacturing powder of magnetic iron alloy
WO2012131906A1 (en) 2011-03-29 2012-10-04 日本磁力選鉱株式会社 Method for reclaiming valuable metal from waste electronic devices
CN103100545A (en) 2011-11-15 2013-05-15 梁刚 Environmentally-friendly old circuit board resource recycling production line
JP2019037944A (en) 2017-08-25 2019-03-14 Ｊｘ金属株式会社 Printed circuit board scrap crushing device and printed circuit board scrap crushing method

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