JPH09194959A - Printed circuit board processing system - Google Patents
Printed circuit board processing systemInfo
- Publication number
- JPH09194959A JPH09194959A JP851996A JP851996A JPH09194959A JP H09194959 A JPH09194959 A JP H09194959A JP 851996 A JP851996 A JP 851996A JP 851996 A JP851996 A JP 851996A JP H09194959 A JPH09194959 A JP H09194959A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- processing system
- board processing
- crushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電子機器に使用さ
れているプリント配線基板の処理システム、特に資源価
値の高い銅材料を高純度で回収可能なプリント配線基板
処理システムに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board processing system used in electronic equipment, and more particularly to a printed wiring board processing system capable of recovering a copper material having a high resource value with high purity.
【0002】[0002]
【従来の技術】コンピュータ等の電子機器の普及、また
それらの進歩、改善に伴って多数のプリント配線基板が
使用されてきている。これらのプリント配線基板は、通
常機器の廃棄処分とともに不用のものとなるが、その中
には資源として貴重な銅材料が多く含まれている。従
来、この使用済のプリント配線基板から銅材料を回収す
る手段としては、例えば銅を塩化物等に変換して基板材
料であるプラスチックと分離して回収することが提案さ
れているが、設備等の問題により実用化は難しいものと
なっている。2. Description of the Related Art With the spread of electronic devices such as computers and their progress and improvement, a large number of printed wiring boards have been used. These printed wiring boards usually become useless when the equipment is disposed of, but they contain a lot of valuable copper materials as resources. Conventionally, as a means for recovering a copper material from this used printed wiring board, it has been proposed to convert copper into a chloride or the like to separate it from the plastic which is a board material and recover it. Due to the problem, it is difficult to put it into practical use.
【0003】[0003]
【発明が解決しようとする課題】プリント配線基板から
銅材料を回収する従来の処理システムにあっては、上記
のように設備が複雑になって高価なものになったり、ま
た操作が複雑になるなどの問題点があり、実用化が困難
であった。In the conventional processing system for recovering the copper material from the printed wiring board, the equipment becomes complicated and expensive as described above, and the operation becomes complicated. However, it was difficult to put it into practical use.
【0004】本発明は、上記のような問題点に着目して
なされたもので、簡易な構成で、プリント配線基板から
高純度の銅材料を回収することができ、また操作が簡単
で安価なプリント配線基板処理システムを提供すること
を目的としている。The present invention has been made by paying attention to the above problems, and it is possible to recover a high-purity copper material from a printed wiring board with a simple structure, and the operation is simple and inexpensive. An object is to provide a printed wiring board processing system.
【0005】[0005]
【課題を解決するための手段】本発明に係るプリント配
線基板処理システムは、次のように構成したものであ
る。A printed wiring board processing system according to the present invention is configured as follows.
【0006】(1)プリント配線基板から銅材料を取り
出して再利用可能にするプリント配線基板処理システム
であって、投入されたプリント配線基板を微粉状態に粉
砕する破砕手段と、微粉状態になった材料から重量差を
利用して銅材料と基板材料を分離する分離手段とを備え
た。(1) A printed wiring board processing system in which a copper material is taken out from a printed wiring board and can be reused, and a crushing means for crushing the input printed wiring board into a fine powder state and a fine powder state. A separating means for separating the copper material and the substrate material from each other by utilizing the weight difference is provided.
【0007】(2)上記(1)のシステムにおいて、分
離手段は微粉状態の材料を高速回転させて銅材料と基板
材料を分離するようにした。(2) In the system of the above (1), the separating means rotates the finely powdered material at a high speed to separate the copper material and the substrate material.
【0008】(3)上記(1)または(2)のシステム
において、破砕手段は荒破砕と微粉砕の少なくとも2段
階でプリント配線基板を超微粉状態に破砕するようにし
た。(3) In the system of (1) or (2) above, the crushing means crushes the printed wiring board into an ultrafine powder state in at least two stages of rough crushing and fine crushing.
【0009】[0009]
【発明の実施の形態】図1は本発明の一実施例によるプ
リント配線基板処理システムの構成を示すブロック図で
ある。1 is a block diagram showing the configuration of a printed wiring board processing system according to an embodiment of the present invention.
【0010】同図において、1は投入されたプリント配
線基板を荒破砕するハンマーミル、2は荒破砕された各
断片を超微粉状態に粉砕するパルベライザー(破砕手
段)で、図示していないが粉砕用モーター、分吸用モー
ター及びフィード用モーターを有している。In the figure, 1 is a hammer mill for roughly crushing a printed wiring board that has been thrown in, and 2 is a pulverizer (crushing means) for crushing each of the roughly crushed fragments into an ultrafine powder. It has a feed motor, a suction motor, and a feed motor.
【0011】3は上記パルベライザー2によって粉砕さ
れた微粉状態の材料から重量差を利用して銅材料とプラ
スチック(基板材料)を分離するための分吸機(分離手
段)で、重い銅粉は下方のロータリーバルブ4及びスク
リューコンベヤー5を通して容器6に回収され、軽いプ
ラスチック粉はダクト7を通ってタンク8内に入り、下
側のロータリーバルブ9から下方の容器10に回収され
る。Reference numeral 3 denotes a separator (separation means) for separating the copper material and the plastic (substrate material) from the fine powder material pulverized by the pulverizer 2 by utilizing the weight difference. The light plastic powder is collected in the container 6 through the rotary valve 4 and the screw conveyor 5 of the above, enters the tank 8 through the duct 7, and is collected in the container 10 below from the lower rotary valve 9.
【0012】11はタンク8の上側に設けられた集塵機
で、上部は不図示のターボブロアーの吸引ダクトに接続
されている。Reference numeral 11 denotes a dust collector provided on the upper side of the tank 8, the upper part of which is connected to a suction duct of a turbo blower (not shown).
【0013】次に、上記構成の処理システムの動作につ
いて図2のフローチャートを参照しながら説明する。Next, the operation of the processing system having the above configuration will be described with reference to the flowchart of FIG.
【0014】不用となったプリント配線基板はまずハン
マーミル1に投入され、ここで荒く破砕された後(ステ
ップS1)、不図示のスクリューコンベヤーによりパル
ベライザー2に送り込まれて、微粉状態に破砕される
(ステップS2)。このパルベライザー2の内部は高速
回転しており、粉状になった銅粉とプラスチック粉は上
側の分吸機3に導かれ、ここで重量差により分離される
(ステップS3)。The unnecessary printed wiring board is first put into the hammer mill 1 and roughly crushed therein (step S1), then sent to the pulsarizer 2 by a screw conveyor (not shown) and crushed into a fine powder state. (Step S2). The inside of the pulsarizer 2 is rotating at a high speed, and the powdered copper powder and plastic powder are guided to the upper separator 3 where they are separated by a weight difference (step S3).
【0015】すなわち、分吸機3内もローターが高速で
回転しており、重い銅粉の方は下側に導かれ、ロータリ
ーバルブ4及びスクリューコンベヤー5を経て容器6に
収容される。また軽いプラスチック粉は上部からダクト
7を経てタンク8内に入り、ロータリーバルブ9を経て
容器10に収容される。That is, the rotor also rotates at a high speed in the separator 3 and the heavy copper powder is guided to the lower side and is accommodated in the container 6 via the rotary valve 4 and the screw conveyor 5. Light plastic powder enters the tank 8 from the upper part through the duct 7 and is housed in the container 10 through the rotary valve 9.
【0016】ここで、本実施例ではプリント配線基板を
2段階で超微粉状態に粉砕しており、分吸機3によって
銅粉とプラスチック粉を分離しているので、簡易かつ安
価な構成で、高純度の銅材料を回収することができる。
また複雑な操作も行う必要はない。Here, in the present embodiment, the printed wiring board is pulverized in two steps into an ultrafine powder state, and the copper powder and the plastic powder are separated by the separator 3 so that the structure is simple and inexpensive. High-purity copper material can be recovered.
Moreover, it is not necessary to perform complicated operations.
【0017】なお、本発明は上述の実施例に限定される
ものではなく、基板を微粉状態にする手段や銅粉及びプ
ラスチック粉の回収要素も他の構成であっても良い。ま
た本発明は多層基板も処理可能であり、種々の基板を同
時に処理することができる。また、回収した銅粉をプレ
スで圧縮して固形物とすることも輸送や保存の面で有効
であり、幅広い用途が可能となる。The present invention is not limited to the above-mentioned embodiment, and the means for bringing the substrate into a fine powder state and the recovery element for the copper powder and the plastic powder may have other configurations. The present invention can also process multi-layer substrates, and can process various substrates simultaneously. Further, it is also effective in terms of transportation and storage to compress the recovered copper powder into a solid by pressing, and a wide range of applications are possible.
【0018】[0018]
【発明の効果】以上のように、本発明によれば、簡易か
つ安価な構成で、プリント配線基板から高純度の銅材料
を回収することができ、また操作が簡単になるという効
果がある。As described above, according to the present invention, it is possible to recover a high-purity copper material from a printed wiring board with a simple and inexpensive structure and also to simplify the operation.
【図1】 本発明の一実施例の構成を示すブロック図FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.
【図2】 一実施例の動作を示すフローチャートFIG. 2 is a flowchart showing the operation of one embodiment.
1 ハンマーミル 2 パルベライザー(破砕手段) 3 分吸機(分離手段) 1 Hammer mill 2 Pulverizer (crushing means) 3 Minute sucker (separating means)
Claims (3)
て再利用可能にするプリント配線基板処理システムであ
って、投入されたプリント配線基板を微粉状態に粉砕す
る破砕手段と、微粉状態になった材料から重量差を利用
して銅材料と基板材料を分離する分離手段とを備えたこ
とを特徴とするプリント配線基板処理システム。1. A printed wiring board processing system for retrieving and reusing a copper material from a printed wiring board, comprising: a crushing means for crushing the input printed wiring board into a fine powder state, and a material in a fine powder state. And a separating means for separating the copper material and the substrate material by utilizing the difference in weight from the printed wiring board processing system.
せて銅材料と基板材料を分離することを特徴とする請求
項1記載のプリント配線基板処理システム。2. The printed wiring board processing system according to claim 1, wherein the separating means rotates the material in a fine powder state at a high speed to separate the copper material and the substrate material.
2段階でプリント配線基板を超微粉状態に破砕すること
を特徴とする請求項1または2記載のプリント配線基板
処理システム。3. The printed wiring board processing system according to claim 1, wherein the crushing means crushes the printed wiring board into an ultrafine powder in at least two stages of rough crushing and fine crushing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP851996A JPH09194959A (en) | 1996-01-22 | 1996-01-22 | Printed circuit board processing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP851996A JPH09194959A (en) | 1996-01-22 | 1996-01-22 | Printed circuit board processing system |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09194959A true JPH09194959A (en) | 1997-07-29 |
Family
ID=11695402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP851996A Withdrawn JPH09194959A (en) | 1996-01-22 | 1996-01-22 | Printed circuit board processing system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09194959A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2012131906A1 (en) * | 2011-03-29 | 2014-07-24 | 日本磁力選鉱株式会社 | Method for recovering valuable metals from waste electronic equipment |
CN105256142A (en) * | 2015-11-05 | 2016-01-20 | 清远市进田企业有限公司 | Recycling technology of copper metal in waste circuit board |
JP2016084490A (en) * | 2014-10-23 | 2016-05-19 | Jx金属株式会社 | Recovery method of valuable metal from sanding waste |
JP2019037945A (en) * | 2017-08-25 | 2019-03-14 | Jx金属株式会社 | Method of recovering valuable metal from printed circuit board scrap |
JP2021090963A (en) * | 2017-08-25 | 2021-06-17 | Jx金属株式会社 | Shredder for printed circuit board scraps |
-
1996
- 1996-01-22 JP JP851996A patent/JPH09194959A/en not_active Withdrawn
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2012131906A1 (en) * | 2011-03-29 | 2014-07-24 | 日本磁力選鉱株式会社 | Method for recovering valuable metals from waste electronic equipment |
JP5705305B2 (en) * | 2011-03-29 | 2015-04-22 | 日本磁力選鉱株式会社 | Method for recovering valuable metals from waste electronic equipment |
JP2016084490A (en) * | 2014-10-23 | 2016-05-19 | Jx金属株式会社 | Recovery method of valuable metal from sanding waste |
CN105256142A (en) * | 2015-11-05 | 2016-01-20 | 清远市进田企业有限公司 | Recycling technology of copper metal in waste circuit board |
JP2019037945A (en) * | 2017-08-25 | 2019-03-14 | Jx金属株式会社 | Method of recovering valuable metal from printed circuit board scrap |
JP2021090963A (en) * | 2017-08-25 | 2021-06-17 | Jx金属株式会社 | Shredder for printed circuit board scraps |
JP2021100757A (en) * | 2017-08-25 | 2021-07-08 | Jx金属株式会社 | Method of recovering valuable metal from printed circuit board scrap |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030401 |