JP2018163965A - 半導体記憶装置及びその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000003860 storage Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 11
- 239000010937 tungsten Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 97
- 229910052751 metal Inorganic materials 0.000 description 68
- 239000002184 metal Substances 0.000 description 68
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 47
- 229910052710 silicon Inorganic materials 0.000 description 47
- 239000010703 silicon Substances 0.000 description 47
- 230000004888 barrier function Effects 0.000 description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 28
- 229910052814 silicon oxide Inorganic materials 0.000 description 28
- 239000000758 substrate Substances 0.000 description 19
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 7
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
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- 230000008569 process Effects 0.000 description 3
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 2
- -1 tungsten nitride Chemical class 0.000 description 2
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- 239000013078 crystal Substances 0.000 description 1
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- 230000005669 field effect Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Abstract
【解決手段】半導体記憶装置は、電極膜及び絶縁膜が第1方向に沿って交互に積層された積層体と、前記第1方向に延びる半導体部材と、前記半導体部材と前記電極膜との間に設けられた電荷蓄積部材と、を備える。前記電極膜は、前記絶縁膜の上面上及び前記絶縁膜の下面上に設けられた第1導電層と、前記電極膜の第1部分において前記第1導電層間に設けられ、前記第1導電層とは異なる材料によって形成された第2導電層と、を有する。前記第1部分における前記第1導電層の厚さは、前記第1部分と前記半導体部材との間に配置された前記電極膜の第2部分における前記第1導電層の厚さよりも薄い。
【選択図】図3
Description
以下、第1の実施形態について説明する。
図2は、本実施形態に係る半導体記憶装置を示す平面図である。
図3は、図2に示すA−A’線による断面図である。
図4は、本実施形態に係る半導体記憶装置のシリコンピラー周辺を示す断面図である。
なお、各図は模式的なものであり、適宜誇張及び省略して描かれている。
図5(a)〜(c)、図6(a)〜(c)、図7(a)〜(c)は、本実施形態に係る半導体記憶装置の製造方法を示す断面図である。
次に、図6(b)に示すように、等方性エッチングを施すことにより、スリット43内及びスペース44内におけるスリット43側に位置する部分から、絶縁層28を除去する。この結果、スペース44内におけるスリット43側の部分(両端部分26)から絶縁層28が除去される。このとき、スペース44内におけるスリット43から離隔した部分(中央部分25)には、絶縁層28が残留する。
本実施形態に係る半導体記憶装置1においては、図3に示すように、電極膜13の両端部分26のみにタングステンからなる金属層29が設けられている。このため、電極膜13全体に金属層29を設ける場合と比較して、タングステンに起因する応力を低減し、積層体15の変形を抑制することができる。従って、半導体記憶装置1は信頼性が高い。
次に、第2の実施形態について説明する。
図8は、本実施形態に係る半導体記憶装置を示す断面図である。
図8が示す領域は、第1の実施形態における図3に示す領域に相当する。
図9(a)〜(c)、図10は、本実施形態に係る半導体記憶装置の製造方法を示す断面図である。
本実施形態においては、図9(a)に示す工程において、スペース44をZ方向に拡張しているため、図8に示すように、製造後の半導体記憶装置2においては、電極膜13の両端部分26のZ方向における厚さtcが、中央部分25のZ方向における厚さtdよりも厚い。これにより、前述の第1の実施形態と比較して、金属層29をより厚くすることができ、電極膜13の導電性をより一層向上させることができる。
本実施形態における上記以外の構成、製造方法及び効果は、前述の第1の実施形態と同様である。
Claims (9)
- 電極膜及び絶縁膜が第1方向に沿って交互に積層された積層体と、
前記第1方向に延びる半導体部材と、
前記半導体部材と前記電極膜との間に設けられた電荷蓄積部材と、
を備え、
前記電極膜は、
前記絶縁膜の上面上及び前記絶縁膜の下面上に設けられた第1導電層と、
前記電極膜の第1部分において前記第1導電層間に設けられ、前記第1導電層とは異なる材料によって形成された第2導電層と、
を有し、
前記第1部分における前記第1導電層の厚さは、前記第1部分と前記半導体部材との間に配置された前記電極膜の第2部分における前記第1導電層の厚さよりも薄い半導体記憶装置。 - 前記積層体から見て、前記第1方向に対して交差する第2方向に配置された絶縁板をさらに備え、
前記第2方向において、前記電荷蓄積部材、前記第2部分、前記第1部分、及び、前記絶縁板が、この順に配列された請求項1記載の半導体記憶装置。 - 前記第1方向における前記第1部分の厚さは、前記第1方向における前記第2部分の厚さよりも厚い請求項1または2に記載の半導体記憶装置。
- 前記絶縁膜における前記第1部分によって挟まれた部分の前記第1方向における厚さは、前記絶縁膜における前記第2部分によって挟まれた部分の前記第1方向における厚さよりも薄い請求項1〜3のいずれか1つに記載の半導体記憶装置。
- 前記第2導電層はタングステンを含む請求項1〜4のいずれか1つに記載の半導体記憶装置。
- 前記第2部分において前記第1導電層間に設けられた第1絶縁層をさらに備えた請求項1〜5のいずれか1つに記載の半導体記憶装置。
- 絶縁膜及び第1膜が第1方向に沿って交互に積層され、内部に前記第1方向に延びる半導体部材が設けられ、前記半導体部材と前記第1膜との間に電荷蓄積部材が設けられた積層体に、前記第1方向に対して交差する第2方向に延びるスリットを形成する工程と、
前記スリットを介して前記第1膜を除去することにより、前記絶縁膜間にスペースを形成する工程と、
前記スリットを介して前記スペースの内面上に第3導電層を形成する工程と、
前記第3導電層における前記スペースの前記スリット側の第1部分に配置された部分を、前記スリットを介して除去する工程と、
前記第1部分における前記スペースの内面上に、前記スリットを介して、前記第3導電層よりも薄い第4導電層を形成する工程と、
前記第1部分内に第2導電層を形成する工程と、
を備えた半導体記憶装置の製造方法。 - 前記第3導電層を形成する工程の後、前記スペースにおける前記半導体部材と前記第1部分との間の第2部分内に、第1絶縁層を形成する工程をさらに備え、
前記第3導電層を除去する工程は、前記第1絶縁層をマスクとしてエッチングを施す工程を有する請求項7記載の半導体記憶装置の製造方法。 - 前記第3導電層を除去する工程の後、前記第4導電層を形成する工程の前に、前記スリットを介して前記絶縁膜をエッチングすることにより、前記スペースの前記第1部分を前記第1方向において拡張する工程をさらに備えた請求項7または8に記載の半導体記憶装置の製造方法。
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US15/686,474 US20180277559A1 (en) | 2017-03-24 | 2017-08-25 | Semiconductor memory device and method for manufacturing same |
CN201711039381.4A CN108630702A (zh) | 2017-03-24 | 2017-10-30 | 半导体存储装置及其制造方法 |
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