JP2018160491A - コイル基板 - Google Patents
コイル基板 Download PDFInfo
- Publication number
- JP2018160491A JP2018160491A JP2017055408A JP2017055408A JP2018160491A JP 2018160491 A JP2018160491 A JP 2018160491A JP 2017055408 A JP2017055408 A JP 2017055408A JP 2017055408 A JP2017055408 A JP 2017055408A JP 2018160491 A JP2018160491 A JP 2018160491A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- layer
- conductor
- coil substrate
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 75
- 239000010410 layer Substances 0.000 claims abstract description 179
- 239000004020 conductor Substances 0.000 claims abstract description 103
- 229910000679 solder Inorganic materials 0.000 claims abstract description 33
- 239000011229 interlayer Substances 0.000 claims abstract description 21
- 238000004804 winding Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000007772 electroless plating Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000012783 reinforcing fiber Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017055408A JP2018160491A (ja) | 2017-03-22 | 2017-03-22 | コイル基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017055408A JP2018160491A (ja) | 2017-03-22 | 2017-03-22 | コイル基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018160491A true JP2018160491A (ja) | 2018-10-11 |
| JP2018160491A5 JP2018160491A5 (enrdf_load_stackoverflow) | 2019-03-22 |
Family
ID=63796771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017055408A Pending JP2018160491A (ja) | 2017-03-22 | 2017-03-22 | コイル基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2018160491A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021044294A (ja) * | 2019-09-06 | 2021-03-18 | 株式会社村田製作所 | インダクタ部品 |
| CN115831915A (zh) * | 2021-09-17 | 2023-03-21 | 上海玻芯成微电子科技有限公司 | 一种隔离器及芯片 |
| CN115966548A (zh) * | 2021-09-17 | 2023-04-14 | 上海玻芯成微电子科技有限公司 | 一种电感器及芯片 |
| CN116825753A (zh) * | 2022-03-22 | 2023-09-29 | 上海玻芯成微电子科技有限公司 | 一种电容隔离器及芯片 |
-
2017
- 2017-03-22 JP JP2017055408A patent/JP2018160491A/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021044294A (ja) * | 2019-09-06 | 2021-03-18 | 株式会社村田製作所 | インダクタ部品 |
| US11631526B2 (en) | 2019-09-06 | 2023-04-18 | Murata Manufacturing Co., Ltd. | Inductor component |
| JP7449660B2 (ja) | 2019-09-06 | 2024-03-14 | 株式会社村田製作所 | インダクタ部品 |
| CN115831915A (zh) * | 2021-09-17 | 2023-03-21 | 上海玻芯成微电子科技有限公司 | 一种隔离器及芯片 |
| CN115966548A (zh) * | 2021-09-17 | 2023-04-14 | 上海玻芯成微电子科技有限公司 | 一种电感器及芯片 |
| CN115966548B (zh) * | 2021-09-17 | 2024-03-12 | 上海玻芯成微电子科技有限公司 | 一种电感器及芯片 |
| CN115831915B (zh) * | 2021-09-17 | 2024-06-11 | 上海玻芯成微电子科技有限公司 | 一种隔离器及芯片 |
| CN116825753A (zh) * | 2022-03-22 | 2023-09-29 | 上海玻芯成微电子科技有限公司 | 一种电容隔离器及芯片 |
| CN116825753B (zh) * | 2022-03-22 | 2024-06-11 | 上海玻芯成微电子科技有限公司 | 一种电容隔离器及芯片 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190206 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190315 |