JP2018157194A - エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法 - Google Patents

エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法 Download PDF

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Publication number
JP2018157194A
JP2018157194A JP2018011618A JP2018011618A JP2018157194A JP 2018157194 A JP2018157194 A JP 2018157194A JP 2018011618 A JP2018011618 A JP 2018011618A JP 2018011618 A JP2018011618 A JP 2018011618A JP 2018157194 A JP2018157194 A JP 2018157194A
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JP
Japan
Prior art keywords
end effector
suction device
contact surface
channel
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018011618A
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English (en)
Japanese (ja)
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JP2018157194A5 (enExample
Inventor
ベルンハルト・ボグナー
bogner Bernhard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suess Microtec Lithography GmbH
Original Assignee
Suess Microtec Lithography GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suess Microtec Lithography GmbH filed Critical Suess Microtec Lithography GmbH
Publication of JP2018157194A publication Critical patent/JP2018157194A/ja
Publication of JP2018157194A5 publication Critical patent/JP2018157194A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/007—Means or methods for designing or fabricating manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2018011618A 2017-01-27 2018-01-26 エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法 Pending JP2018157194A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2018243A NL2018243B1 (en) 2017-01-27 2017-01-27 Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector
NL2018243 2017-01-27

Publications (2)

Publication Number Publication Date
JP2018157194A true JP2018157194A (ja) 2018-10-04
JP2018157194A5 JP2018157194A5 (enExample) 2020-03-19

Family

ID=62843388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018011618A Pending JP2018157194A (ja) 2017-01-27 2018-01-26 エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法

Country Status (9)

Country Link
US (1) US10259124B2 (enExample)
JP (1) JP2018157194A (enExample)
KR (1) KR102344555B1 (enExample)
CN (1) CN108364903A (enExample)
AT (1) AT519587B1 (enExample)
DE (1) DE102018100856A1 (enExample)
NL (1) NL2018243B1 (enExample)
SG (1) SG10201800716YA (enExample)
TW (1) TWI710438B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3657537A1 (en) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH End effector for slab formed substrates
US11276593B2 (en) 2019-07-22 2022-03-15 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
PT3772089T (pt) * 2019-07-30 2021-06-28 Semsysco Gmbh Dispositivo de manuseamento de substrato para uma pastilha
WO2023141006A1 (en) * 2022-01-19 2023-07-27 Lam Research Corporation Wafer transfer paddles with minimum contact area structures for reduced backside marking
US20230321758A1 (en) 2022-03-25 2023-10-12 Ii-Vi Delaware, Inc. Laser-roughened reaction-bonded silicon carbide for wafer contact surface
EP4273911A1 (de) * 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
US12348002B2 (en) 2022-05-31 2025-07-01 Ii-Vi Delaware, Inc. Current load-controlled laser driver
KR102712350B1 (ko) * 2022-06-16 2024-10-02 세메스 주식회사 반도체 제조용 부품 캐리어 및 이를 이용한 반도체 제조용 부품 반송장치
US12337467B2 (en) * 2022-12-09 2025-06-24 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
US12678978B2 (en) * 2023-03-13 2026-07-14 Shanghai Flexiv Robotics Technology Co., Ltd. Adhesion device and robot

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267433A (ja) * 1992-03-19 1993-10-15 Nec Kyushu Ltd 吸着パッド
JPH0653309A (ja) * 1992-06-10 1994-02-25 Internatl Business Mach Corp <Ibm> 基板用保持固定具
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
JPH0817896A (ja) * 1994-06-29 1996-01-19 Canon Inc 基板搬送装置
JP2012199282A (ja) * 2011-03-18 2012-10-18 Tokyo Electron Ltd 基板保持装置
JP2016538711A (ja) * 2014-03-06 2016-12-08 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェーハ‐ハンドリング・エンドエフェクタ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
JP2002184835A (ja) 2000-12-13 2002-06-28 Ando Electric Co Ltd 吸着パッド
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
WO2004067234A1 (ja) 2003-01-29 2004-08-12 Mitsuboshi Diamond Industrial Co., Ltd. 真空吸着ヘッド
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
MY157019A (en) * 2009-03-31 2016-04-15 Automation Tooling Syst Vacuum gripper assembly
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP2014176914A (ja) 2013-03-14 2014-09-25 Nippon Electric Glass Co Ltd 吸着パッド及び吸着装置
JP5861677B2 (ja) * 2013-07-08 2016-02-16 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267433A (ja) * 1992-03-19 1993-10-15 Nec Kyushu Ltd 吸着パッド
JPH0653309A (ja) * 1992-06-10 1994-02-25 Internatl Business Mach Corp <Ibm> 基板用保持固定具
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
JPH0817896A (ja) * 1994-06-29 1996-01-19 Canon Inc 基板搬送装置
JP2012199282A (ja) * 2011-03-18 2012-10-18 Tokyo Electron Ltd 基板保持装置
JP2016538711A (ja) * 2014-03-06 2016-12-08 カスケード マイクロテック インコーポレイテッドＣａｓｃａｄｅ Ｍｉｃｒｏｔｅｃｈ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェーハ‐ハンドリング・エンドエフェクタ

Also Published As

Publication number Publication date
US20180215049A1 (en) 2018-08-02
SG10201800716YA (en) 2018-08-30
NL2018243B1 (en) 2018-08-07
KR20180088598A (ko) 2018-08-06
CN108364903A (zh) 2018-08-03
DE102018100856A1 (de) 2018-08-02
KR102344555B1 (ko) 2021-12-28
AT519587A3 (de) 2020-02-15
US10259124B2 (en) 2019-04-16
TW201831290A (zh) 2018-09-01
TWI710438B (zh) 2020-11-21
AT519587B1 (de) 2021-10-15
AT519587A2 (de) 2018-08-15

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