JP2018157194A5 - - Google Patents
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- Publication number
- JP2018157194A5 JP2018157194A5 JP2018011618A JP2018011618A JP2018157194A5 JP 2018157194 A5 JP2018157194 A5 JP 2018157194A5 JP 2018011618 A JP2018011618 A JP 2018011618A JP 2018011618 A JP2018011618 A JP 2018011618A JP 2018157194 A5 JP2018157194 A5 JP 2018157194A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- layer
- seal
- suction device
- picked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012636 effector Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2018243A NL2018243B1 (en) | 2017-01-27 | 2017-01-27 | Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector |
| NL2018243 | 2017-01-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018157194A JP2018157194A (ja) | 2018-10-04 |
| JP2018157194A5 true JP2018157194A5 (enExample) | 2020-03-19 |
Family
ID=62843388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018011618A Pending JP2018157194A (ja) | 2017-01-27 | 2018-01-26 | エンドエフェクタ用吸引器具、サブストレート保持用エンドエフェクタ、およびエンドエフェクタ製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10259124B2 (enExample) |
| JP (1) | JP2018157194A (enExample) |
| KR (1) | KR102344555B1 (enExample) |
| CN (1) | CN108364903A (enExample) |
| AT (1) | AT519587B1 (enExample) |
| DE (1) | DE102018100856A1 (enExample) |
| NL (1) | NL2018243B1 (enExample) |
| SG (1) | SG10201800716YA (enExample) |
| TW (1) | TWI710438B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3657537A1 (en) * | 2018-11-23 | 2020-05-27 | ATOTECH Deutschland GmbH | End effector for slab formed substrates |
| US11276593B2 (en) | 2019-07-22 | 2022-03-15 | Rorze Automation, Inc. | Systems and methods for horizontal wafer packaging |
| EP3772089B1 (en) | 2019-07-30 | 2021-05-26 | Semsysco GmbH | Substrate handling device for a wafer |
| US20230321758A1 (en) | 2022-03-25 | 2023-10-12 | Ii-Vi Delaware, Inc. | Laser-roughened reaction-bonded silicon carbide for wafer contact surface |
| EP4273911A1 (de) * | 2022-05-03 | 2023-11-08 | Werner Lieb GmbH | Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen |
| US12348002B2 (en) | 2022-05-31 | 2025-07-01 | Ii-Vi Delaware, Inc. | Current load-controlled laser driver |
| US12337467B2 (en) * | 2022-12-09 | 2025-06-24 | Formfactor, Inc. | Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors |
| US20250073924A1 (en) * | 2023-03-13 | 2025-03-06 | Shanghai Flexiv Robotics Technology Co., Ltd. | Adhesion device and robot |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4131267A (en) * | 1978-06-02 | 1978-12-26 | Disco Kabushiki Kaisha | Apparatus for holding workpiece by suction |
| JPH05267433A (ja) * | 1992-03-19 | 1993-10-15 | Nec Kyushu Ltd | 吸着パッド |
| US5226636A (en) * | 1992-06-10 | 1993-07-13 | International Business Machines Corporation | Holding fixture for substrates |
| JPH07273499A (ja) * | 1994-03-30 | 1995-10-20 | Matsushita Electric Ind Co Ltd | パネル保持装置 |
| JP3200285B2 (ja) * | 1994-06-29 | 2001-08-20 | キヤノン株式会社 | 基板搬送装置 |
| JP2002184835A (ja) | 2000-12-13 | 2002-06-28 | Ando Electric Co Ltd | 吸着パッド |
| US6942265B1 (en) * | 2002-10-23 | 2005-09-13 | Kla-Tencor Technologies Corporation | Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto |
| US20050110292A1 (en) * | 2002-11-26 | 2005-05-26 | Axcelis Technologies, Inc. | Ceramic end effector for micro circuit manufacturing |
| US7641247B2 (en) * | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
| ATE454960T1 (de) | 2003-01-29 | 2010-01-15 | Mitsuboshi Diamond Ind Co Ltd | Vakuum saugkopf |
| US7055875B2 (en) * | 2003-07-11 | 2006-06-06 | Asyst Technologies, Inc. | Ultra low contact area end effector |
| MY157019A (en) * | 2009-03-31 | 2016-04-15 | Automation Tooling Syst | Vacuum gripper assembly |
| US8801069B2 (en) * | 2010-02-26 | 2014-08-12 | Brooks Automation, Inc. | Robot edge contact gripper |
| JP5345167B2 (ja) * | 2011-03-18 | 2013-11-20 | 東京エレクトロン株式会社 | 基板保持装置 |
| JP2014176914A (ja) | 2013-03-14 | 2014-09-25 | Nippon Electric Glass Co Ltd | 吸着パッド及び吸着装置 |
| JP5861677B2 (ja) * | 2013-07-08 | 2016-02-16 | 株式会社安川電機 | 吸着構造、ロボットハンドおよびロボット |
| US9991152B2 (en) * | 2014-03-06 | 2018-06-05 | Cascade Microtech, Inc. | Wafer-handling end effectors with wafer-contacting surfaces and sealing structures |
| NL2014625B1 (en) * | 2015-04-13 | 2017-01-06 | Suss Microtec Lithography Gmbh | Wafer treating device and sealing ring for a wafer treating device. |
-
2017
- 2017-01-27 NL NL2018243A patent/NL2018243B1/en active
-
2018
- 2018-01-16 DE DE102018100856.2A patent/DE102018100856A1/de active Pending
- 2018-01-19 US US15/875,713 patent/US10259124B2/en active Active
- 2018-01-22 TW TW107102181A patent/TWI710438B/zh active
- 2018-01-24 AT ATA50059/2018A patent/AT519587B1/de active
- 2018-01-26 SG SG10201800716YA patent/SG10201800716YA/en unknown
- 2018-01-26 JP JP2018011618A patent/JP2018157194A/ja active Pending
- 2018-01-26 KR KR1020180009854A patent/KR102344555B1/ko active Active
- 2018-01-29 CN CN201810084258.2A patent/CN108364903A/zh active Pending
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