JP2018146239A5 - - Google Patents
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- JP2018146239A5 JP2018146239A5 JP2017037988A JP2017037988A JP2018146239A5 JP 2018146239 A5 JP2018146239 A5 JP 2018146239A5 JP 2017037988 A JP2017037988 A JP 2017037988A JP 2017037988 A JP2017037988 A JP 2017037988A JP 2018146239 A5 JP2018146239 A5 JP 2018146239A5
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- JP
- Japan
- Prior art keywords
- substrate
- defect inspection
- illumination
- optical system
- ring illumination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005286 illumination Methods 0.000 claims 37
- 239000000758 substrate Substances 0.000 claims 24
- 238000007689 inspection Methods 0.000 claims 22
- 230000003287 optical Effects 0.000 claims 21
- 238000003384 imaging method Methods 0.000 claims 8
- 231100000716 Acceptable daily intake Toxicity 0.000 claims 4
- 230000001154 acute Effects 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
Claims (10)
前記照明系は、複数のLEDを円環状に配置するとともに、前記複数のLEDによるス
ポット光のそれぞれが前記光学系の焦点位置を中心とした領域に集まるようにしたリング
照明であり、
検査対象である基板の前記光学系の側に設置される前記リング照明であって、前記複数
のLEDによるスポット光のそれぞれが前記基板表面に対して鋭角に照射され、その反射
光が、対物レンズに直接入らないように構成した反射の暗視野リング照明と、
前記基板の前記光学系とは反対側に設置される前記リング照明であって、前記複数のL
EDによるスポット光のそれぞれが基板裏面に対して鋭角に照射され、前記基板内部を屈
折を経て透過した透過光が、前記対物レンズに直接入らないようにした透過の暗視野リン
グ照明と、
を備えることを特徴とする欠陥検査装置。 It has an optical system for defect inspection and an illumination system for defect inspection,
The illumination system is a ring illumination in which a plurality of LEDs are arranged in an annular shape, and each of the spot lights by the plurality of LEDs is gathered in a region centered on a focal position of the optical system,
The ring illumination installed on the side of the optical system of a substrate to be inspected, wherein each of spot lights by the plurality of LEDs is radiated at an acute angle to the substrate surface, and the reflected light is formed by an objective lens. A reflective darkfield ring illumination configured to prevent direct entry into the
The ring illumination installed on the opposite side of the substrate from the optical system, wherein the plurality of L
Each of the spot lights by the ED is radiated at an acute angle to the back surface of the substrate, and the transmitted light transmitted through the inside of the substrate through refraction is transmitted through a dark field ring illumination so as not to directly enter the objective lens.
A defect inspection apparatus comprising:
前記照明系は、複数のLEDを円環状に配置するとともに、前記複数のLEDによるス
ポット光のそれぞれが前記光学系の焦点位置を中心とした領域に集まるようにしたリング
照明であり、
検査対象である基板の前記光学系の側に設置される前記リング照明であって、前記複数
のLEDによるスポット光のそれぞれが前記基板表面に対して鋭角に照射され、その反射
光が、対物レンズに直接入らないように構成した反射の暗視野リング照明と、
前記基板の前記光学系とは反対側に設置される前記リング照明であって、前記複数のL
EDによるスポット光のそれぞれが基板裏面に対して鋭角に照射され、前記基板内部を屈
折を経て透過した透過光が、前記対物レンズに直接入らないようにした透過の暗視野リン
グ照明と、
前記基板の前記光学系とは反対側に設置される照明であって、前記光学系の光軸と同軸
の透過のスポット照明と、
を備えることを特徴とする欠陥検査装置。 It has an optical system for defect inspection and an illumination system for defect inspection,
The illumination system is a ring illumination in which a plurality of LEDs are arranged in an annular shape, and each of the spot lights by the plurality of LEDs is gathered in a region centered on a focal position of the optical system,
The ring illumination installed on the side of the optical system of the substrate to be inspected, wherein each of the spot lights by the plurality of LEDs is irradiated at an acute angle with respect to the substrate surface, and the reflected light is formed by an objective lens. A reflective darkfield ring illumination configured to prevent direct entry into the
The ring illumination installed on the opposite side of the substrate from the optical system, wherein the plurality of L
Each of the spot lights by the ED is radiated at an acute angle to the back surface of the substrate, and the transmitted light transmitted through the inside of the substrate through refraction is transmitted through a dark field ring illumination so as not to directly enter the objective lens.
Illumination installed on the opposite side of the optical system of the substrate, the spot illumination of the transmission coaxial with the optical axis of the optical system,
A defect inspection apparatus comprising:
ことを特徴とする請求項1または2記載の欠陥検査装置。 The defect inspection apparatus according to claim 1, wherein an optical axis of the optical system and a center axis of the ring in the ring illumination are aligned and coaxial.
前記撮像素子はTDIセンサであり、
前記結像光学系は、TDIカメラを含み、
前記基板とTDIカメラとを、一定速度で一定方向に相対的に移動させる手段を有し、
前記基板上の撮像領域の移動方向および速度とTDIセンサにおけるCCDの電荷転送
の方向および速度を合わせることで、CCDの垂直段の数だけ前記撮像領域を繰り返し露
光し撮影する手段を有することを特徴とする請求項1から3のいずれかに記載の欠陥検査
装置。 Having an imaging optical system including an objective lens, an imaging lens and an imaging element,
The image sensor is a TDI sensor,
The imaging optics includes a TDI camera;
Means for relatively moving the substrate and the TDI camera in a constant direction at a constant speed,
The moving direction and the speed of the imaging area on the substrate are matched with the direction and speed of the charge transfer of the CCD in the TDI sensor, so that the imaging area is repeatedly exposed and photographed by the number of vertical stages of the CCD. The defect inspection apparatus according to any one of claims 1 to 3, wherein
ことを特徴とする請求項1から4のいずれかに記載の欠陥検査装置。 The defect inspection apparatus according to any one of claims 1 to 4, wherein the defect inspection apparatus includes a high-precision imaging optical system having a focus likelihood of less than ± 0.1 mm.
と共に、
前記オートフォーカス手段に用いる前記レーザービームの前記撮像素子への映り込みを
回避する手段を有することを特徴とする請求項4または5のいずれかに記載の欠陥検査装
置。 Using the objective lens, using a laser beam, and constructing an autofocus means,
The defect inspection apparatus according to claim 4, further comprising a unit configured to prevent the laser beam used for the autofocus unit from being reflected on the imaging device.
前記照明系は、複数のLEDを円環状に配置するとともに、前記複数のLEDによるス
ポット光のそれぞれが前記光学系の焦点位置を中心とした領域に集まるようにしたリング
照明であり、
前記リング照明は、検査対象である基板の前記光学系の側に設置され、
前記リング照明における前記基板側の先端から前記基板表面までの距離を、前記リング
照明の作動距離dとし、
前記リング照明の半径をrとし、
機械的な大きさ制限の観点から、前記dと前記rの範囲を規定し、
前記LEDの光線が前記基板に入射される際、前記光線と前記基板表面とのなす角を、
前記リング照明の照射角度αとし、対物レンズに直接照明光が入らないようにする暗視野
要請の観点から、前記αの範囲を規定し、
前記リング照明による照射密度をpとし、照射密度pを大きくする観点および前記暗視
野要請から前記照射角度αの上限が制限される観点から、前記pの範囲を規定し、
位置関係から定まる数式d=rTan(α)から、前記照射密度pを考慮しつつ、前記
d、前記rおよび前記αの値を決定し、これらの値に基づき装置を製造することを特徴と
する欠陥検査装置の製造方法。 It has an optical system for defect inspection and an illumination system for defect inspection,
The illumination system is a ring illumination in which a plurality of LEDs are arranged in an annular shape, and each of the spot lights by the plurality of LEDs is gathered in a region centered on a focal position of the optical system,
The ring illumination is installed on the side of the optical system of the substrate to be inspected,
The distance from the end of the substrate side in the ring illumination to the substrate surface, the working distance d of the ring illumination,
Let the radius of the ring illumination be r,
From the viewpoint of mechanical size limitation, the ranges of d and r are defined,
When the light beam of the LED is incident on the substrate, the angle between the light beam and the substrate surface,
With the irradiation angle α of the ring illumination, from the viewpoint of a dark field request that direct illumination light does not enter the objective lens, to define the range of the α,
The irradiation density by the ring illumination is p, from the viewpoint of increasing the irradiation density p and from the viewpoint that the upper limit of the irradiation angle α is limited from the dark field request, to define the range of the p,
From the equation d = rTan (α) determined from the positional relationship, the values of d, r and α are determined while considering the irradiation density p, and the apparatus is manufactured based on these values. A method for manufacturing a defect inspection device.
前記照明系は、複数のLEDを円環状に配置するとともに、前記複数のLEDによるス
ポット光のそれぞれが前記光学系の焦点位置を中心とした領域に集まるようにしたリング
照明であり、
前記リング照明は、検査対象である基板の前記光学系とは反対側に設置され、
前記リング照明における前記基板側の先端から前記基板表面までの距離を、前記リング
照明の作動距離dとし、
前記リング照明の半径をrとし、
機械的な大きさ制限の観点から、前記dと前記rの範囲を規定し、
前記LEDの光線が前記基板に入射される際、前記光線と前記基板裏面とのなす角を、
前記リング照明の照射角度αとし、対物レンズに直接照明光が入らないようにする暗視野
要請の観点から、および、ブリュースター角近傍での入射の要請の観点から、前記αの範
囲を規定し、
前記リング照明による照射密度をpとし、照射密度pを大きくする観点並びに前記暗視
野要請および前記ブリュースター角近傍での入射の要請によって前記照射角度αの上限が
制限される観点から、前記pの範囲を規定し、
ガラスの厚さをgとし、
位置関係から定まる下記数式(3)から、前記照射密度pを考慮しつつ、前記d、前記
rおよび前記αの値を決定し、これらの値に基づき装置を製造することを特徴とする欠陥
検査装置の製造方法。
The illumination system is a ring illumination in which a plurality of LEDs are arranged in an annular shape, and each of the spot lights by the plurality of LEDs is gathered in a region centered on a focal position of the optical system,
The ring illumination is installed on the opposite side of the substrate to be inspected from the optical system,
The distance from the end of the substrate side in the ring illumination to the substrate surface, the working distance d of the ring illumination,
Let the radius of the ring illumination be r,
From the viewpoint of mechanical size limitation, the ranges of d and r are defined,
When the light beam of the LED is incident on the substrate, the angle between the light beam and the back surface of the substrate,
With the irradiation angle α of the ring illumination, from the viewpoint of a dark field request to prevent the illumination light from directly entering the objective lens, and from the viewpoint of the request of incidence near the Brewster angle, to define the range of α. ,
From the viewpoint that the irradiation density by the ring illumination is p, the upper limit of the irradiation angle α is limited by the viewpoint of increasing the irradiation density p, and by the dark field request and the request for incidence near the Brewster angle. Stipulate the range,
Let g be the thickness of the glass,
Defect inspection wherein the values of d, r, and α are determined in consideration of the irradiation density p from the following equation (3) determined from the positional relationship, and an apparatus is manufactured based on these values. Device manufacturing method.
Priority Applications (1)
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JP2017037988A JP6895768B2 (en) | 2017-03-01 | 2017-03-01 | Defect inspection equipment and defect inspection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017037988A JP6895768B2 (en) | 2017-03-01 | 2017-03-01 | Defect inspection equipment and defect inspection method |
Publications (3)
Publication Number | Publication Date |
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JP2018146239A JP2018146239A (en) | 2018-09-20 |
JP2018146239A5 true JP2018146239A5 (en) | 2020-02-13 |
JP6895768B2 JP6895768B2 (en) | 2021-06-30 |
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Families Citing this family (5)
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CN111351794B (en) * | 2018-12-20 | 2021-12-10 | 上海微电子装备(集团)股份有限公司 | Object surface detection device and detection method |
TWI676797B (en) * | 2019-03-12 | 2019-11-11 | 住華科技股份有限公司 | Optical film detecting device and optical film detecting method |
WO2021090827A1 (en) * | 2019-11-05 | 2021-05-14 | 株式会社小糸製作所 | Inspection device |
CN111337518A (en) * | 2020-03-19 | 2020-06-26 | 东莞市瑞图新智科技有限公司 | Lens defect detecting system |
CN114354627B (en) * | 2022-01-04 | 2022-11-22 | 浙江大学 | Annular uniform collimation lighting device and method for surface defect detection |
Family Cites Families (12)
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JPH05297262A (en) * | 1992-04-23 | 1993-11-12 | Toshiba Corp | Automatic focusing device |
JPH11132748A (en) * | 1997-10-24 | 1999-05-21 | Hitachi Ltd | Multi-focal point concurrent detecting device, stereoscopic shape detecting device, external appearance inspecting device, and its method |
JP2000009591A (en) * | 1998-06-25 | 2000-01-14 | Omron Corp | Inspection equipment |
JP3330089B2 (en) * | 1998-09-30 | 2002-09-30 | 株式会社大協精工 | Inspection method and apparatus for rubber products |
JP2008209726A (en) * | 2007-02-27 | 2008-09-11 | Olympus Corp | Illuminating device |
JP2009162492A (en) * | 2007-12-28 | 2009-07-23 | Daishinku Corp | Inspection apparatus |
JP2010123824A (en) * | 2008-11-21 | 2010-06-03 | Hitachi High-Tech Control Systems Corp | Alignment unit and wafer transfer device |
JP2010151479A (en) * | 2008-12-24 | 2010-07-08 | Ushio Inc | Wiring pattern inspecting device |
JP2010223613A (en) * | 2009-03-19 | 2010-10-07 | Futec Inc | Optical examining device |
JP5158552B1 (en) * | 2012-01-19 | 2013-03-06 | レーザーテック株式会社 | Microscope and inspection device |
JP6212843B2 (en) * | 2012-09-05 | 2017-10-18 | 大日本印刷株式会社 | Foreign matter inspection device, foreign matter inspection method |
JP6142996B2 (en) * | 2013-06-26 | 2017-06-07 | レーザーテック株式会社 | Via shape measuring device and via inspection device |
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