JP2018142627A - インプリント装置、インプリント方法、プログラム、および物品製造方法 - Google Patents

インプリント装置、インプリント方法、プログラム、および物品製造方法 Download PDF

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Publication number
JP2018142627A
JP2018142627A JP2017036020A JP2017036020A JP2018142627A JP 2018142627 A JP2018142627 A JP 2018142627A JP 2017036020 A JP2017036020 A JP 2017036020A JP 2017036020 A JP2017036020 A JP 2017036020A JP 2018142627 A JP2018142627 A JP 2018142627A
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JP
Japan
Prior art keywords
substrate
mold
imprint
unit
holding unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017036020A
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English (en)
Japanese (ja)
Inventor
縄田　亮
Akira Nawata
亮 縄田
鈴木　健太郎
Kentaro Suzuki
健太郎 鈴木
木村　淳
Atsushi Kimura
淳 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2017036020A priority Critical patent/JP2018142627A/ja
Priority to KR1020180019752A priority patent/KR20180099480A/ko
Publication of JP2018142627A publication Critical patent/JP2018142627A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2017036020A 2017-02-28 2017-02-28 インプリント装置、インプリント方法、プログラム、および物品製造方法 Pending JP2018142627A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017036020A JP2018142627A (ja) 2017-02-28 2017-02-28 インプリント装置、インプリント方法、プログラム、および物品製造方法
KR1020180019752A KR20180099480A (ko) 2017-02-28 2018-02-20 임프린트 장치, 임프린트 방법, 기록 매체, 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017036020A JP2018142627A (ja) 2017-02-28 2017-02-28 インプリント装置、インプリント方法、プログラム、および物品製造方法

Publications (1)

Publication Number Publication Date
JP2018142627A true JP2018142627A (ja) 2018-09-13

Family

ID=63528287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017036020A Pending JP2018142627A (ja) 2017-02-28 2017-02-28 インプリント装置、インプリント方法、プログラム、および物品製造方法

Country Status (2)

Country Link
JP (1) JP2018142627A (ko)
KR (1) KR20180099480A (ko)

Also Published As

Publication number Publication date
KR20180099480A (ko) 2018-09-05

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