JP2018091677A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card designed to enable simultaneous measurements of multiple chips with few chip losses without incurring an increase in device size and facilitate probe replacement.SOLUTION: A probe card 10, which is a probe card for simultaneous measurements of multiple chips, comprises a main substrate 12 and a probe fixing part 80 provided on the bottom face of the main substrate 12 and composed of an insulating resin. A probe 50 has an elastic part 54 bent upward from a needle tip 52 that comes in contact with a chip to be measured and extending along the bottom face of the main substrate 12, and is further bent upward inside the probe fixing part 80, extending toward the top face of the main substrate 12 along an inner wall surface 43 of a substrate opening 22 of the main substrate 12, and electrically and mechanically connected at one end to a probe contact terminal 24 on the top face of the main substrate 12.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a probe card, and more particularly to a probe card for simultaneous measurement of multiple chips.

  The probe card is used for a test in a wafer state before an assembly process of manufacturing a large scale integrated circuit (LSI), and has a probe to be brought into contact with each pad of the LSI chip area to be measured.

  Japanese Patent Application Laid-Open No. H10-228561 discloses a plurality of probe cards that can simultaneously test a plurality of chips. An opening for measurement of one chip area is provided with one chip area separated from the adjacent opening. As a result, eight openings are provided for 4 × 8 chip areas, and eight chip areas can be measured at a time, and all of 4 × 8 chip areas can be measured in four measurements. It is stated.

  In the probe card of Patent Document 2, an example is shown in which nine chips are skipped in the X-axis and Y-axis directions and four chips can be measured simultaneously. In another example, a probe card is described in which three chips can be measured simultaneously by skipping three chips diagonally diagonally.

  Patent Document 3 discloses that ends of a plurality of probes held by a probe holder portion fixed to a bottom surface of a guide plate are electrically connected to a connection terminal of a main board through a flexible board. The flexible board passes through the opening provided in the main board, and one end is connected to the connection terminal of the main board and the other end is connected to the end of the probe, so that the space in the thickness direction of the main board is effectively used. By utilizing this, the pitch of the probes can be narrowed.

  Patent Document 4 describes a probe card unit including a main board, a guide plate, and a probe. The main board and the guide plate are each provided with openings of the same size, and the guide plate is provided with a plurality of probe insertion holes. In the probe, an insertion portion extending from the needle tip and bent and extending vertically is inserted into the probe insertion hole and fixed with resin. The insertion portion further extends, is inserted into the through hole of the main substrate, is electrically connected to the wiring of the main substrate in the through hole, and is fixed by solder at the upper end portion of the through hole.

JP 2001-291748 A Japanese Patent No. 5152941 JP 2011-112421 A Japanese Patent No. 5283266

  Since the probe is provided on the bottom surface of the main substrate, it is general that the base portion of the probe is attached to the bottom surface of the substrate. Here, with the diversification of LSIs, the number of pads per chip increases, and when a large number of pads are arranged at a narrow pitch around the chip, the arrangement of probes in the probe card is narrowed. In particular, in a plurality of probe cards, a plurality of probes are locally concentrated. In such a case, in order to attach the base portion of the probe to the connection terminal on the bottom surface of the substrate by soldering or the like, it is necessary to lengthen the probe. If the probe is lengthened, the number of chip skips in the plurality of probe cards is increased, the probe card is increased in size, and if the size of the probe card is fixed, there is a limit to the number of chips.

  As a method for eliminating the need to attach the base portion of the probe to the bottom surface of the substrate, there is a method in which the end portion of the probe is electrically connected to the connection terminal of the main substrate through a flexible substrate as in Patent Document 3, but a flexible substrate is used. Therefore, the size is increased and the cost is increased. Also, as in Patent Document 4, there is a method in which the probe insertion portion is passed through the through hole of the main board and fixed with solder at the upper end portion of the through hole. However, it is difficult to replace the probe in the event of a failure or the like. .

  Accordingly, there is a need for a probe card that enables simultaneous measurement of a large number of chips with a small number of chip skipping without increasing the size and that allows easy probe replacement.

  A probe card according to the present invention is a probe card for simultaneous measurement of a plurality of chips, in which a plurality of probes are arranged in alignment at each peripheral edge of a plurality of rows and columns of card openings and project into the card opening. A main substrate having a plurality of probe connection terminals on the upper surface of the substrate sandwiched between adjacent substrate openings, and a probe made of insulating resin provided on the bottom surface side of the main substrate The probe has an elastic part that bends upward from the tip of the needle that contacts the tip of the measurement object and extends along the bottom surface of the main substrate, and further bends upward inside the probe fixing part. , Extending to the upper surface side of the main substrate along the inner wall surface of the substrate opening of the main substrate and electrically and mechanically connected at one end to the probe connection terminal on the upper surface of the main substrate And wherein the door.

  According to the probe card for simultaneous measurement of multiple chips configured as described above, the probe extends to the upper surface side along the inner wall surface of the substrate opening of the main substrate and does not pass through the main substrate. is there.

  Further, in the probe card according to the present invention, the main board is a multilayer circuit board having a plurality of stacked internal conductive layers, and has a through hole corresponding to each probe connection terminal at the peripheral edge of the board opening. The internal conductive layer connected to the through hole preferably extends as a wiring layer to the tester side terminal.

  According to the probe card for simultaneous measurement of multiple chips of the above configuration, the probe extends to the upper surface side along the inner wall surface of the main opening of the main substrate, and the probe connection corresponding to the through hole of the main substrate on the upper surface of the main substrate. What is necessary is just to connect to a terminal. As a result, the probe is connected to the internal conductive layer of the multilayer circuit board, and is wired to the tester side terminal of the main board using the internal conductive layer as a wiring layer, thus eliminating the need for extra external wiring and increasing the size of the probe card. This can be suppressed.

  Further, in the probe card according to the present invention, the main board is formed of an insulating plate having an upper surface attached to the main substrate and a probe fixing portion provided on the bottom surface, and has an insulating plate opening corresponding to the substrate opening of the main substrate. It is preferable that a probe guide plate having a guide hole for the probe is provided on the overhanging portion that projects inside the substrate opening. With this configuration, a plurality of probes extending to the upper surface side along the inner wall surface of the substrate opening are aligned and guided.

  In the probe card according to the present invention, the probe fixing portion includes a plurality of probes on one side of the substrate opening side and the other side of the substrate opening portion, which are arranged back to back in the adjacent substrate opening portion of the main substrate. The plurality of probes on the side are preferably fixed and held together.

  In the probe card according to the present invention, the guide hole of the probe guide plate is an oblong through hole along each side of the board opening of the main board, and between the probe guided by being inserted into the through hole. Is preferably filled with a fixing resin.

  According to the probe card having the above configuration, a plurality of chips can be obtained with a small number of chip skipping without increasing the size, and the probe can be easily replaced.

It is a top view of the probe card in the embodiment according to the present invention. It is an enlarged view of the opening part area | region in FIG. It is a top view of the chip | tip which is a measuring object of the probe card in embodiment which concerns on this invention. It is an enlarged view about the A section of FIG. It is BB sectional drawing of FIG. It is a perspective view of the C section of FIG. It is a figure which shows the two comparative examples about the effect of the probe card in embodiment which concerns on this invention, and each figure is sectional drawing corresponding to FIG. FIG. 7A is an example in which the probe is soldered on the bottom surface side of the main board, and FIG. 7B is an example in which the probe is soldered on the upper surface of the main board through the through hole of the main board.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. The number of substrate openings, the number of probes, the number of probe connection terminals, the shape, dimensions, materials, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the probe card. Below, the same code | symbol is attached | subjected to the same element in all the drawings, and the overlapping description is abbreviate | omitted.

  FIG. 1 is a top view of the probe card 10. The probe card 10 is a chip measurement card that is attached to a prober device (not shown) that holds and moves a wafer 30 (see FIG. 2) in which chips to be measured are aligned to a predetermined position. . The probe card 10 has a circular main substrate 12 provided with a plurality of card openings 14 for simultaneous measurement of a large number of chips, and a plurality of probes 50 (from FIG. 4) on the bottom side of the peripheral edge of each card opening 14. 6) is arranged.

  FIG. 1 shows an X direction, a Y direction, and a Z direction as three orthogonal directions. The X direction is a row direction in which a plurality of card openings 14 are arranged in the opening region 16. The Y direction is a column direction in which a plurality of card openings 14 are arranged. The Z direction is a direction parallel to the thickness direction of the main substrate 12, the direction toward the top surface of the main substrate 12 is the top surface side, and the direction toward the bottom surface is the bottom surface side.

  The main substrate 12 is a multilayer circuit board having a plurality of stacked internal conductive layers, and the internal conductive layer has a predetermined wiring pattern together with the top wiring layer on the top surface side of the substrate and the bottom wiring layer on the bottom surface side of the substrate. The top wiring layer, the bottom wiring layer, and each internal conductive layer are electrically connected by through holes. The main board 12 is formed by laminating glass epoxy boards formed in a predetermined wiring pattern in a predetermined number of layers.

  Each of the card openings 14 is an opening that is opened in the probe card 10 to a size that allows measurement of one of the chips that are measurement objects. As will be described later with reference to FIGS. 4 to 6, a probe guide plate 70 having an insulating plate opening 44 is provided on the bottom surface side of the probe card 10, and a substrate opening 22 is provided on the main substrate 12. The card opening 14 is an opening defined by two of the insulating plate opening 44 and the substrate opening 22.

  The opening area 16 is an area in which a plurality of card openings 14 are arranged in a plurality of rows and columns. Here, the card openings 14 are arranged in 8 rows × 6 columns, and a total of 48 card openings 14 are arranged in the opening area 16.

  The reinforcing frame 18 is a frame that is disposed on the outer peripheral portion of the opening region 16 and is attached to the main substrate 12 to suppress deformation of the opening region 16. As the reinforcing frame 18, a metal member having an appropriate strength is formed into a predetermined shape and subjected to necessary insulation treatment. Attachment of the reinforcing frame 18 to the main board 12 uses fixing means such as bolts.

  The measurement electronic component 20 is an electronic circuit, resistance, capacitance, and inductance arranged on the upper surface wiring layer of the main board 12 in order to perform signal processing from the probe 50 to a tester side terminal that is a connection terminal to an external tester. Etc. Examples of signal processing performed by the measurement electronic component 20 include multiplexer processing, amplification processing, noise removal processing, impedance conversion processing, and the like.

  FIG. 2 is an enlarged view of the reinforcing frame 18 and the opening region 16. In FIG. 2, the reinforcing frame 18 and a part of the opening region 16 are broken, and a wafer 30 arranged on the bottom side of the probe card 10 is shown. The wafer 30 is a semiconductor substrate on which chips 32 as measurement objects are arranged in a matrix. The prober device (not shown) positions the wafer 30 with respect to the probe card 10 so that two orthogonal sides of the chip 32 are parallel to the X direction and the Y direction.

  In FIG. 2, when the dimension in the X direction of the chip 32 is a and the dimension in the Y direction is b, the dimension in the X direction of each card opening 14 is set to 3a, and the dimension in the Y direction is set to 3b. Since it is possible to measure one chip 32 per one card opening 14, the chips 32 to be measured in the adjacent card openings 14 have an interval of 2a in the X direction and in the Y direction. 2b interval. Accordingly, a total of 432 chips of 24 rows × 18 columns are arranged immediately below the opening region 16 in which a total of 48 card openings 14 of 8 rows × 6 columns are arranged. Only 48 chips 32 can be measured at a time using the 48 card openings 14, and two chips are separated in the X direction between the measured chips 32, and 2 in the Y direction. The tip is separated. If the number of chips separated between the chips 32 to be measured is “chip skip number”, the example of FIG. 2 is “X direction 2 chip Y direction 2 chip skip”. In this case, all of the 432 chips are measured in 9 steps. In FIG. 2, the chip 32 that can be measured at once using the 48 card openings 14 is hatched. The remaining chips that are not hatched are to be measured during the next 48 measurements.

  In FIG. 2, the arrangement of the wafer 30 is omitted in the upper left portion of the opening area 16 on the paper surface, and only the shape of the card opening 14 is shown. The opening shape of the card opening 14 is substantially octagonal.

  FIG. 3 is a top view of the chip 32. A plurality of pads are arranged on the peripheral edge of the chip 32. Nineteen pads 34 and 35 are arranged in the X direction on the two peripheral edges along the Y direction, and thirteen pads 36 in the Y direction are arranged on the two peripheral edges along the X direction. , 37 are arranged. Since the probe card 10 is provided with one probe 50 corresponding to each pad 34, 35, 36, 37, (19 + 13 + 19 + 13) = 64 probes 50 are provided for one card opening 14.

  FIG. 4 is an enlarged view of a portion A in FIG. Here, the wafer 30 is disposed below the probe card 10 and the probe 50 is in contact with the pads 34, 35, 36, and 37 of the chip 32. In FIG. 4, only 10 probes 50 are shown per chip 32, and other illustrations are omitted. The illustration of the pads 34, 35, 36, and 37 of the chip 32 is also omitted.

  In FIG. 4, the probe guide plate 70 is an insulating plate having a probe guide hole 72 for guiding the probe 50. Details of the arrangement and fixing of the probe 50 including the probe guide plate 70 will be described with reference to FIGS. FIG. 5 is a sectional view taken along line BB in FIG. FIG. 6 is a perspective view of a portion C in FIG.

  As shown in FIGS. 5 and 6, the probe guide plate 70 is attached with its upper surface fixed to the bottom surface of the main board 12. The probe guide plate 70 has an insulating plate opening 44 corresponding to the substrate opening 22 of the main substrate 12, but the insulating plate opening 44 is not the same size as the substrate opening 22. As shown in FIG. 6, the probe guide plate 70 has a protruding portion 71 that projects from the peripheral edge of each side of the main substrate 12 to the inside of the substrate opening 22. It does not overhang the peripheral edge of the corner 15. The overhang 71 is provided with a probe guide hole 72 which is an oval through hole parallel to the side of the substrate opening 22. The probe guide plate 70 is formed by molding a plastic material having electrical insulation into a predetermined shape including probe guide holes 72 that are oval through holes.

  In the top view of the probe card 10 viewed from the + Z direction, the card opening 14 is defined by the narrower one of the substrate opening 22 and the insulating plate opening 44. Therefore, in the side portion where the overhanging portion 71 is present, the inner contour line of the overhanging portion 71 becomes the contour line of the card opening portion 14 and in the portion where the corner portion 15 is present, the inner contour line of the corner portion 15 is the card opening portion 14. Therefore, the card opening 14 is generally octagonal as a whole. In the above description, the substantially octagonal shape is an illustrative example, and other shapes may be used. For example, the card opening 14 may be a quadrangle in which the corner 15 is omitted.

  In the main substrate 12, a region sandwiched between adjacent substrate openings 22 is referred to as a connection region 13. The connection region 13 is a region that extends in the X direction and the Y direction in the opening region 16. A plurality of probe connection terminals 24 are arranged on the upper surface of the connection region 13 along each of the X direction and the Y direction. In the peripheral portion of one substrate opening 22, 64 probe connection terminals 24 are provided corresponding to 64 probes 50 provided corresponding to 64 pads of the chip 32 which is a measurement object. .

  As shown in FIG. 4, the connection region 13 extending in the X direction between two adjacent substrate openings 22 is disposed along the X direction of the chip 32 described in FIG. 3 (19 × 2) = Corresponding to the 38 pads 34 and 35, (19 × 2) = 38 probe connection terminals 24 are arranged. Similarly, the connection region 13 extending in the Y direction between two adjacent substrate openings 22 corresponds to (13 × 2) = 26 pads 36 and 37 arranged along the Y direction of the chip 32. Thus, (13 × 2) = 26 probe connection terminals 24 are arranged. In the connection region 13, the element 26 provided between two rows of the probe connection terminals 24 arranged along the X direction or the Y direction is a capacitance having an appropriate capacity.

  Soldering is used for electrical and mechanical connection between the probe connection terminal 24 and the probe 50. In FIG. 4, in order to show the solder 60 for connection, the probe connection terminals 24 to which the ten probes 50 illustrated for one card opening 14 are connected are hatched.

  In the connection region 13, through holes 28 are provided at locations corresponding to the probe connection terminals 24. In other words, an annular wiring pattern connected to the upper opening of the through hole 28 opened on the upper surface of the main substrate 12 is the probe connection terminal 24. The through hole 28 is electrically connected to an internal conductive layer 29 of the main board 12 which is a multilayer circuit board. The internal conductive layer 29 is wired inside the main board 12 as a wiring layer of a predetermined conductive pattern, and has an opening portion. It is connected to a predetermined tester side terminal provided outside the region 16.

  The probe 50 is a conductive probe needle having a tip 52 that contacts the tip 32 of the measurement object at the tip and one end on the opposite side connected to the probe connection terminal 24. As the probe 50, a conductive material made of tungsten alloy such as tungsten or rhenium tungsten, AgPdCu alloy or the like is formed into a predetermined shape.

  The probe 50 has an elastic portion 54 that bends upward from the needle tip 52 and extends along the bottom surface of the main substrate 12. The probe 50 is fixed on the bottom surface of the probe guide plate 70 by a probe fixing portion 80 made of an insulating resin. . The probe 50 bends further upward inside the probe fixing portion 80, passes through the probe guide hole 72 of the probe guide plate 70, passes through the inside of the substrate opening 22 of the main substrate 12, and extends upward. Become. The vertical portion 56 extends toward the upper surface of the main substrate 12 along the inner wall surface 43 of the substrate opening 22, and becomes one end 58 that bends toward the probe connection terminal 24 when the upper surface of the main substrate 12 is exceeded. . The tip of one end 58 is electrically and mechanically connected to the probe connection terminal 24 via the solder 60. As described above, the probe 50 includes the needle tip 52, the elastic portion 54, the vertical portion 56, and the one end 58, and is bent into a predetermined shape between the respective portions.

  The probe fixing portion 80 is provided on the bottom surface of the probe guide plate 70 and fixes the elastic portion 54 having the needle tip 52. Therefore, the probe fixing portion 80 is located between the tip 32 and the elastic portion 54 having the needle tip. It becomes a fulcrum when it is elastically bent by the needle pressure. As the probe fixing portion 80, a plastic material having electrical insulation is used, and a probe 50 in which the base side of the elastic portion 54 is bent upward is embedded and integrated by insert molding. An epoxy resin or the like is used as the plastic material.

  Since the probe fixing portion 80 is provided so as to cover the oval through hole of the probe guide hole 72 directly below the probe guide hole 72, the vertical portion 56 bent upward in the probe fixing portion 80 is a probe guide hole. 72. By filling a suitable fixing resin having electrical insulation between the probe guide hole 72 and the vertical portion 56 passing through the probe guide hole 72, electrical insulation between the adjacent vertical portions 56 can be secured, Further, the arrangement position of the vertical portion 56 is stabilized. A silicone resin, an epoxy resin, or the like can be used as the fixing resin.

  The width of the oval of the probe guide hole 72 is set to a size obtained by adding a predetermined margin to the diameter of the probe 50. Since the inner edge of the probe guide plate 70 in which the probe guide hole 72 is provided is the inner edge of the probe opening 14, the probe guide hole 72 is aligned so that the vertical portion 56 does not protrude inside the probe opening 14. Has a function.

  As a fixing method between the probe fixing part 80 and the probe guide plate 70, a mechanical fixing method such as screwing, a chemical bonding method such as adhesion, or the like can be used.

  In the above, the probe fixing portion 80 is disposed below each probe guide hole 72. That is, in the cross-sectional view of FIG. 5, the probe fixing portions 80 are independently arranged at both edges in the X direction of the connection region 13. Instead of this configuration, the probe fixing portions 80 on both edges in the X direction of the connection region 13 are integrated, and the plurality of probes 50 on the one side substrate opening 22 side disposed on both edges of the connection region 13 and the other The plurality of probes 50 on the side of the substrate opening 22 side may be integrally fixed and held. Similarly, the probe fixing portions 80 on both edges in the Y direction of the connection region 13 may be integrated. As a result, the number of probe fixing portions 80 can be reduced, and the configuration of the probe card 10 is simplified.

  In the probe 50 having the above configuration, a probe fixing portion 80 made of an insulating resin is provided on the bottom surface side of the main substrate 12 as a fulcrum for needle pressure. As a result, the fixing point setting operation such as soldering of the probe 50 on the bottom surface side of the main board 12 can be omitted. Instead, the probe 50 is extended along the inner wall surface 43 of the substrate opening 22, and one end thereof is electrically and mechanically connected to the probe connection terminal 24 on the upper surface of the main substrate 12 by soldering.

  FIG. 7 is a diagram showing two comparative examples of the operational effects of the probe card 10 configured as described above, and each figure is a cross-sectional view corresponding to FIG.

  FIG. 7A shows an example in which the probe 90 is soldered to the probe connection terminal 92 on the bottom surface side of the main board 12. The probe connection terminal 92 is electrically connected to the through hole 28. Here, in the connection region 13, the length from the inner wall surface 43 of the substrate opening 22 to the probe connection terminal 92 is c, and the length between the two probe connection terminals 92 at both edges of the connection region 13 is d. Then, the length of the connection region 13 in the X direction is (2c + d). Compared with FIG. 5, c is clearly longer than the length between the probe connection terminal 24 (60) and the inner wall surface 43 in FIG.

  Therefore, if the length in the X direction of the connection region 13 in FIG. 7A is made the same as the length of the connection region in FIG. 5, the length d in FIG. 7A is equal to the length of the connection region 13 in FIG. It becomes shorter than the length between the two probe connection terminals 24 (60) at both edges. Since d is the length of the space necessary for the soldering operation, the soldering operation in FIG. 7A becomes difficult. In FIG. 7A, when it is attempted to secure a length d sufficient for the soldering operation, the length of the connection region 13 in the X direction is increased, and the probe card is increased in size. If the size of the probe card is constant, the number of chip skips in the simultaneous measurement of many chips increases. As the number of chip skips increases, the time required for simultaneous measurement of a large number of chips increases. On the other hand, since the probe card 10 does not perform soldering on the bottom surface side of the main board 12, the size of the connection region 13 can be optimized for “two chips in the X direction and two chips in the Y direction”. Efficient simultaneous measurement of multiple chips is possible without increasing the size.

  FIG. 7B shows an example in which the probe 94 is soldered by the probe connection terminal 96 on the upper surface of the main board 12 through the through hole 28 of the main board 12. In this case, when the probe 94 needs to be replaced due to a failure or the like, the replacement work of the probe 94 is performed by removing the solder from one end of the soldering and pulling it through the through hole 28 in that state. There is a risk of damage. It is difficult to replace the probe 94 so as not to damage the through hole 28. As a result, if the through hole 28 is damaged, the entire probe card is replaced. On the other hand, in the probe card 10, since the probe 50 does not pass through the through hole 28, even if the probe 50 needs to be replaced, it can be replaced without damaging the through hole 28. .

  As described above, according to the probe card of the present invention, it is possible to perform simultaneous measurement of a large number of chips with a small number of chip skipping without increasing the size, and the probe can be easily replaced.

  DESCRIPTION OF SYMBOLS 10 Probe card, 12 Main board | substrate, 13 Connection area | region, 14 Card opening part, 15 Corner part, 16 Opening area | region, 18 Reinforcement frame, 20 Measurement electronic component, 22 Board | substrate opening part, 24, 92, 96 Probe connection terminal, 26 elements, 28 through holes, 29 internal conductive layers, 30 wafers, 32 chips, 34, 35, 36, 37 pads, 43 inner wall surfaces, 44 insulating plate openings, 50, 90, 94 probes, 52 needle tips, 54 elasticity Part, 56 vertical part, 58 one end, 60 solder, 70 probe guide plate, 71 overhang part, 72 probe guide hole, 80 probe fixing part.

Claims (5)

A probe card for simultaneous measurement of multiple chips, in which a plurality of probes are arranged in alignment at each peripheral edge of a plurality of rows and columns of card openings and project into the card opening,
A main board having a board opening corresponding to the card opening and having a plurality of probe connection terminals on the upper surface of the board sandwiched between adjacent board openings;
A probe fixing portion that is provided on the bottom side of the main substrate and is made of an insulating resin;
With
The probe
It has an elastic part that bends upward from the needle tip that contacts the tip of the measurement object and extends along the bottom surface of the main board, bends further upward inside the probe fixing part, and the inner wall surface of the board opening of the main board A probe card characterized by extending to the upper surface side of the main substrate along one end and being electrically and mechanically connected to a probe connection terminal on the upper surface of the main substrate. The main board is
Multi-layer circuit board with multiple layers of internal conductive layers, with through holes corresponding to each probe connection terminal at the peripheral edge of the board opening, and the internal conductive layers connected to the through holes route to the tester side terminals The probe card according to claim 1, wherein the probe card extends as a layer.   The top surface is made of an insulating plate that is attached to the main substrate and the probe fixing portion is provided on the bottom surface, has an insulating plate opening corresponding to the substrate opening of the main substrate, and is extended to the inside of the main substrate opening. The probe card according to claim 1, further comprising a probe guide plate having a guide hole for the probe at the exit portion. The probe fixing part
A plurality of probes on one side of the substrate opening side and a plurality of probes on the other side of the substrate opening side, which are arranged on both edges of the region sandwiched between adjacent substrate openings of the main board, are integrally fixed. The probe card according to claim 1, wherein the probe card is held. The guide hole on the probe guide plate
4. The fixing resin is filled between the oblong through holes along each side of the substrate opening of the main board and the probe guided by being inserted into the through holes. Probe card as described in

Images