JP2018073972A - Wiring board and electronic device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board capable of supplying current sufficiently from a constant voltage regulator to a semiconductor element, by securing a good current supply route from a constant voltage regulator mounting section to a semiconductor element mounting section, thereby capable of actuating the semiconductor element stably, and to provide an electronic device using the same.SOLUTION: A wiring conductor 2S for signal is extending on the surface of a build-up insulation layer 1B where solid conductors 2GS, 2PS for grounding or power supply are extending, to the periphery of an insulation board 1, without passing below the intermediate part of a semiconductor element mounting section 10A and a constant voltage regulator mounting section 10B.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a wiring board for mounting a semiconductor element and an electronic device using the wiring board.

  Conventionally, a semiconductor element such as an MPU is used by being mounted on a small-sized wiring board of multilayer high-density wiring.

  Recently, as the operating voltage of a semiconductor element is lowered and the number of simultaneous switching is increased, a slight fluctuation of the operating voltage supplied to the semiconductor element has caused a malfunction of the semiconductor element. Therefore, it has been proposed that a constant voltage regulator is mounted on a wiring board on which a semiconductor element is mounted to prevent a malfunction of the semiconductor element by suppressing fluctuations in operating voltage caused by simultaneous switching of the semiconductor element.

  FIG. 9 shows a conventional wiring board 20 on which the semiconductor element S and the constant voltage regulator V are mounted. The wiring substrate 20 mainly includes an insulating substrate 11, a wiring conductor 12, and a solder resist layer 13.

  The insulating substrate 11 has a semiconductor element mounting portion 20A on which the semiconductor element S is mounted at the center of the upper surface. Moreover, it has the constant voltage regulator mounting part 20B in which the constant voltage regulator V is mounted in the outer peripheral part of the upper surface. The lower surface of the insulating substrate 11 serves as a connection surface 20C for connection to an external electric circuit substrate (not shown) such as a mother board.

  The insulating substrate 11 is formed by laminating a plurality of buildup insulating layers 11a to 11b and 11d to 11e on the upper and lower surfaces of the core insulating layer 11c. The core insulating layer 11 c has a plurality of through holes 14. The build-up insulating layers 11 a to 11 b and 11 d to 11 e have a plurality of via holes 15.

  The wiring conductor 12 is attached to the upper and lower surfaces of the core insulating layer 11c and the core conductors 12c and 12d attached in the through holes 14, and the surfaces of the build-up insulating layers 11a to 11b and 11d to 11e and the via holes 15. Build-up conductors 12a to 12b and 12e to 12f.

  A part of the uppermost buildup conductor 12 a among the wiring conductors 12 forms a semiconductor element connection pad 16. The semiconductor element connection pad 16 includes a signal semiconductor element connection pad 16S, a ground semiconductor element connection pad 16G, and a power supply semiconductor element connection pad 16P. The electrode terminal TS of the semiconductor element S is connected to the semiconductor element connection pad 16 via solder.

  Another part of the uppermost buildup conductor 12 a among the wiring conductors 12 forms a constant voltage regulator connection pad 17. The constant voltage regulator connection pad 17 includes a constant voltage regulator connection pad 17G for grounding and a constant voltage regulator connection pad 17P for power supply. The constant voltage regulator connection pad 17 is connected to the electrode terminal TV of the constant voltage regulator V via solder.

  A part of the lowermost buildup conductor 12 f of the wiring conductor 12 forms an external connection pad 18. The external connection pad 18 includes an external connection pad 18S for signals, an external connection pad 18G for grounding, and an external connection pad 18P for power supply. The external connection pad 18 is connected to a wiring conductor of an external electric circuit board such as a mother board via solder.

  The solder resist layer 13 includes an upper-side solder resist layer 13a deposited on the uppermost buildup insulating layer 11a and the uppermost buildup conductor 12a, and the lowermost buildup insulating layer 11e and the lowermost layer. And a solder resist layer 13b on the lower surface side deposited on the build-up conductor 12f.

  The solder resist layer 13 a on the upper surface side has an opening for exposing the semiconductor element connection pad 16 and an opening for exposing the constant voltage regulator connection pad 17. The solder resist layer 13b on the lower surface side has an opening through which the external connection pad 18 is exposed.

  The semiconductor element connection pad 16, the constant voltage regulator connection pad 17, and the external connection pad 18 are electrically connected to each other through wiring conductors 12 disposed on the surface and inside of the insulating substrate 11. It is connected.

  Therefore, the wiring conductor 12 includes a wiring conductor for signal 12S, a wiring conductor for grounding 12G, and a wiring conductor for power supply 12P.

  Then, as shown in FIG. 10, the electrode terminal TS of the semiconductor element S is connected to the semiconductor element connection pad 16 via solder, and the electrode terminal TV of the constant voltage regulator V is connected to the constant voltage regulator connection pad 17 via solder. By connecting, an electronic device in which the semiconductor element S and the constant voltage regulator V are mounted on the wiring board 20 is completed.

  This electronic device is mounted on an external electric circuit board by connecting the external connection pads 18 to a wiring conductor of an external electric circuit board such as a mother board via solder.

  The electronic device mounted on the external electric circuit board exchanges signals with the external electric circuit board via the signal external connection pads 18S. In addition, the ground voltage and the power supply voltage are supplied via the ground external connection pad 18G and the power supply external connection pad 18P, respectively.

  Furthermore, a current is supplied from the constant voltage regulator V to suppress fluctuations in the operating voltage of the semiconductor element S via the constant voltage regulator connection pad 17.

  Here, the second buildup conductor 12b from the top in the conventional wiring board 20 is shown in a top view in FIG. In FIG. 11, regions corresponding to the semiconductor element mounting portion 20A and the constant voltage regulator mounting portion 20B are indicated by two-dot chain lines. Further, the position of the via hole 15 connected from the upper layer buildup conductor 12a is indicated by a broken line. 9 and 10 described above are cross-sectional views taken along section line II in FIG.

  As shown in FIG. 11, a signal wiring conductor 12S and a power wiring conductor 12P are mainly disposed on the second buildup conductor 12b. Only the circular land pattern for the via hole 15 is disposed on the ground wiring conductor 12G.

  The signal wiring conductor 12S of this layer has a plurality of strip conductors 12SS extending from below the semiconductor element mounting portion 20A to the outer peripheral portion of the wiring substrate 20. A part of the strip-shaped conductors 12SS extends to the outer peripheral portion of the wiring board 20 through between the lower part of the semiconductor element mounting part 20A and the lower part of the constant voltage regulator mounting part 20B.

  The power supply wiring conductor 20P has a solid conductor 12PS having a large area that continuously spreads over a wide region including a region corresponding to the semiconductor element mounting portion 20A and a region corresponding to the constant voltage regulator mounting portion 20B. A current from the constant voltage regulator V is supplied to the semiconductor element S through the solid conductor 12PS.

  However, in this wiring board 20, some of the signal strip conductors 12SS extend to the outer periphery of the wiring board 20 between the lower part of the semiconductor element mounting part 20A and the lower part of the constant voltage regulator mounting part 20B. Therefore, the satisfactory current supply from the lower side of the constant voltage regulator mounting portion 20B to the lower side of the semiconductor element mounting portion 20A in the solid conductor 12PS for power supply is hindered by these strip-shaped conductors 12SS and sufficient current supply is achieved. May not be able to do. As a result, it may be difficult to operate the semiconductor element S stably.

Special table 2007-521574 gazette

  The problem to be solved by the present invention is to secure a good current supply path between the constant voltage regulator mounting part and the semiconductor element mounting part, and to sufficiently supply the current from the constant voltage regulator to the semiconductor element. Accordingly, it is an object of the present invention to provide a wiring board capable of stably operating a semiconductor element and an electronic device using the wiring board.

  The wiring board of the present invention is formed by laminating a plurality of build-up insulating layers having a plurality of via holes on the upper and lower surfaces of a core insulating layer having a plurality of through holes. An insulating substrate having a constant voltage regulator mounting portion and an external connection surface on the lower surface, and conductors deposited on the upper and lower surfaces of the core insulating layer and the through hole, and on the surface of the buildup insulating layer and the via hole. A plurality of semiconductor element connection pads for signal, grounding, and power supply disposed in the semiconductor element mounting portion, and the constant voltage regulator mounting portion. A plurality of constant voltage regulator connection pads for grounding and power supply disposed on the outside, and a plurality of externals for signal, grounding and power supply disposed on the external connection surface A connection pad, connected to the signal semiconductor element connection pad below the semiconductor element mounting portion, and connected to the signal external connection pad at an outer peripheral portion of the insulating substrate to pass through the interior of the insulating substrate. A plurality of signal wiring conductors extending from below the semiconductor element mounting portion to the outer peripheral portion of the insulating substrate, and connected to the grounding semiconductor element connection pad below the semiconductor element mounting portion and mounted with the constant voltage regulator Connected to the constant voltage regulator connection pad for grounding below the part, and connected to the external connection pad for grounding below the semiconductor element mounting part and below the constant voltage regulator mounting part. The surfaces of the plurality of build-up insulating layers on the upper surface side and the lower surface side of the constant voltage regulator mounting portion from below the semiconductor element mounting portion. A plurality of solid conductors for grounding extending to the side, and connected to the semiconductor element connection pads for power supply below the semiconductor element mounting portion, and the constant for power supply below the constant voltage regulator mounting portion. Connected to a voltage regulator connection pad, and connected to the external connection pad for the power supply below the semiconductor element mounting portion and below the constant voltage regulator mounting portion, and a plurality of the upper and lower surfaces of the core insulating layer A wiring board having a plurality of solid conductors for power supply extending from a lower side of the semiconductor element mounting portion to a lower side of the constant voltage regulator mounting portion, wherein the surface of the buildup insulating layer is the signal wiring The conductor is mounted on the surface of the build-up insulating layer on which the solid conductor for grounding or power supply extends, the semiconductor element mounting portion and the constant voltage regulator mounted It extends to the outer peripheral part of the insulating substrate without passing below the intermediate part with the part.

  The electronic device according to the present invention is characterized in that a semiconductor element is mounted on the semiconductor element mounting portion of the wiring board and a constant voltage regulator is mounted on the constant voltage regulator mounting portion.

  According to the wiring board of the present invention and the electronic device using the wiring substrate, the signal wiring conductor has the surface of the build-up insulating layer on which the solid conductor for grounding or power supply extends as the semiconductor element mounting portion. The solid conductor for grounding or power supply on the surface of the build-up insulation layer is the constant voltage regulator mounting part because it extends to the outer periphery of the insulating substrate without passing below the intermediate part with the voltage regulator mounting part. The current path from directly underneath the semiconductor element mounting portion is not significantly hindered by the signal wiring conductor, and sufficient current supply is provided to the semiconductor element via these grounding or power supply solid conductors. It can be carried out. Therefore, it is possible to provide a wiring board capable of stably operating a semiconductor element and an electronic device using the wiring board.

FIG. 1 is a schematic sectional view showing an embodiment of a wiring board according to the present invention. FIG. 2 is a schematic top view showing the build-up conductor deposited on the surface of the uppermost build-up insulating layer in the embodiment of the wiring board according to the present invention. FIG. 3 is a schematic top view showing the build-up conductor deposited on the surface of the second build-up insulating layer from the top in the embodiment of the wiring board according to the present invention. FIG. 4 is a schematic top view showing the core conductor deposited on the top surface of the core insulating layer in the embodiment of the wiring board according to the present invention. FIG. 5 is a schematic top view showing the core conductor attached to the lower surface of the core insulating layer in the embodiment of the wiring board according to the present invention. FIG. 6 is a schematic top view showing the build-up conductor deposited on the surface of the second build-up insulating layer from the bottom in the embodiment of the wiring board according to the present invention. FIG. 7 is a schematic top view showing the buildup conductor deposited on the surface of the bottommost buildup insulating layer in the embodiment of the wiring board according to the present invention. FIG. 8 is a schematic cross-sectional view showing an embodiment of an electronic device in which a semiconductor element and a constant voltage regulator are mounted on the wiring board of the present invention. FIG. 9 is a schematic cross-sectional view showing a conventional wiring board. FIG. 10 is a schematic cross-sectional view of an electronic device in which a semiconductor element and a constant voltage regulator are mounted on a conventional wiring board. FIG. 11 is a schematic top view showing the buildup conductor deposited on the surface of the second buildup insulating layer from the top in the conventional wiring board.

  Next, an example of an embodiment of the wiring board according to the present invention will be described with reference to FIGS. FIG. 1 is a schematic cross-sectional view showing a wiring board 10 of this example. The wiring substrate 10 mainly includes an insulating substrate 1, a wiring conductor 2, and a solder resist layer 3. The wiring board 10 is for mounting the semiconductor element S and the constant voltage regulator V.

  The insulating substrate 1 has a semiconductor element mounting portion 10A on which the semiconductor element S is mounted at the center of the upper surface. Moreover, it has the constant voltage regulator mounting part 10B in which the constant voltage regulator V is mounted in the outer peripheral part of the upper surface. The lower surface of the insulating substrate 1 serves as a connection surface 10C for connection to an external electric circuit substrate (not shown) such as a mother board.

  The insulating substrate 1 is formed by laminating a plurality of buildup insulating layers 1a to 1b and 1d to 1e on the upper and lower surfaces of the core insulating layer 1c.

  The core insulating layer 1c is formed, for example, by impregnating a glass fabric obtained by weaving glass fiber bundles vertically and horizontally with a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. The thickness of the insulating layer 1c is about 0.1 to 1 mm. A number of through holes 4 are formed in the core insulating layer 1c from the upper surface to the lower surface. The diameter of the through hole 4 is about 50 to 200 μm.

  The build-up insulating layers 1a to 1b and 1d to 1e are made of a thermosetting resin such as an epoxy resin. Each of the build-up insulating layers 1a to 1b and 1d to 1e has a thickness of about 20 to 60 μm. The build-up insulating layers 1a to 1b and 1d to 1e have a plurality of via holes 5 from the upper surface to the lower surface of each layer. The diameter of the via hole 5 is about 30 to 100 μm.

  The wiring conductor 2 is attached to the top and bottom surfaces of the core insulating layer 1c and the core conductors 2c and 2d deposited in the through holes 4, and the surfaces of the build-up insulating layers 1a to 1b and 1d to 1e and the via holes 5. Build-up conductors 2a to 2b and 2e to 2f.

  The core conductors 2c and 2d are made of, for example, copper foil and copper plating on the upper and lower surfaces of the core insulating layer 1c, and are made of, for example, copper plating in the through hole 4. The thickness of the core conductors 2c and 2d is about 10 to 30 μm. The core conductors 2c and 2d are formed by, for example, a well-known subtractive method. The through hole 4 is filled with a conductor formed simultaneously with the core conductors 2c and 2d.

  The build-up conductors 2a to 2b and 2e to 2f are made of, for example, copper plating. The build-up conductors 2a to 2b and 2e to 2f have a thickness of about 5 to 25 μm. The build-up conductors 2a to 2b and 2e to 2f are formed by, for example, a known semi-additive method.

  Of the wiring conductor 2, a part of the uppermost buildup conductor 2 a forms a semiconductor element connection pad 6. The semiconductor element connection pad 6 includes a semiconductor element connection pad 6S for signal, a semiconductor element connection pad 6G for grounding, and a semiconductor element connection pad 6P for power supply. The semiconductor element connection pad 6 has a circular shape with a diameter of about 50 to 100 μm. The semiconductor element connection pads 6 are arranged, for example, in a grid pattern on the semiconductor element mounting portion 10A. The electrode terminal TS of the semiconductor element S is connected to the semiconductor element connection pad 6 via solder.

  Another part of the uppermost buildup conductor 2 a among the wiring conductors 2 forms a constant voltage regulator connection pad 7. The constant voltage regulator connection pad 7 includes a constant voltage regulator connection pad 7G for grounding and a constant voltage regulator connection pad 7P for power supply. The constant voltage regulator connection pad 7 is a square having a side length of about 50 to 500 μm or a circle having a diameter of about 50 to 500 μm. The constant voltage regulator connection pad 7 is connected to the electrode terminal TV of the constant voltage regulator V via solder.

  A part of the lowermost buildup conductor 2 f of the wiring conductor 2 forms an external connection pad 8. The external connection pad 8 includes an external connection pad 8S for signals, an external connection pad 8G for grounding, and an external connection pad 8P for power supply. The external connection pad 8 has a circular shape with a diameter of about 250 to 1000 μm. The external connection pads 8 are arranged, for example, in a grid pattern on the external connection surface 10C in a region including the lower part of the semiconductor element mounting part 10A and the lower part of the constant voltage regulator mounting part 10B. The external connection pad 8 is connected to a wiring conductor of an external electric circuit board (not shown) such as a mother board via solder.

  The solder resist layer 3 is made of a thermosetting resin such as an acrylic-modified epoxy resin. The solder resist layer 3 includes an upper-side solder resist layer 3a deposited on the uppermost buildup insulating layer 1a and the uppermost buildup conductor 2a, and the lowermost buildup insulating layer 1e and the lowermost layer. And a solder resist layer 3b on the lower surface side deposited on the build-up conductor 2f.

  The solder resist layer 3 a on the upper surface side has an opening for exposing the semiconductor element connection pad 6 and an opening for exposing the constant voltage regulator connection pad 7. The solder resist layer 3 b on the lower surface side has an opening for exposing the external connection pad 8. The solder resist layer 3 is formed by using a photosensitive thermosetting resin paste on the uppermost buildup insulating layer 1a and the uppermost buildup conductor 2a, and on the lowermost buildup insulating layer 1e and the lowermost layer. This is done by printing and coating on the build-up conductor 2f, exposure and development using a photolithography technique, and thermosetting.

  The semiconductor element connection pad 6, the constant voltage regulator connection pad 7, and the external connection pad 8 are connected to each other through a wiring conductor 2 disposed on the surface and inside of the insulating substrate 1. Yes.

  Therefore, the wiring conductor 2 includes a wiring conductor for signal 2S, a wiring conductor for grounding 2G, and a wiring conductor for power supply 2P.

  FIG. 2 shows the upper surface of the buildup conductor 2a deposited on the surface of the uppermost buildup insulating layer 1a. In FIG. 2, regions corresponding to the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B are indicated by two-dot chain lines. Moreover, FIG. 1 mentioned above has shown the cross section in the cutting | disconnection line II of FIG. Furthermore, the opening in the solder resist layer 3a is indicated by a broken line. The semiconductor element mounting portion 10 </ b> A is disposed at the center of the upper surface of the insulating substrate 1. The constant voltage regulator mounting portion 10B is disposed on both sides of the semiconductor element mounting portion 10A.

  The buildup conductor 2a has a plurality of semiconductor element connection pads 6 in a region corresponding to the mounting portion 10A. The semiconductor element connection pad 6 includes a semiconductor element connection pad 6S for signal, a semiconductor element connection pad 6G for grounding, and a semiconductor element connection pad 6P for power supply. A large number of signal semiconductor element connection pads 6S are arranged on the outer periphery along two sides mainly on the side not adjacent to the area corresponding to the constant voltage regulator mounting part 10B in the area corresponding to the semiconductor element mounting part 10A. Yes. Many grounding and power supply semiconductor element connection pads 6G and 6P are arranged mainly in a region corresponding to the central portion of the semiconductor element mounting portion 10A.

  The buildup conductor 2a has a plurality of constant voltage regulator connection pads 7 in a region corresponding to the constant voltage regulator mounting portion 10B. The constant voltage regulator connection pad 7 includes a constant voltage regulator connection pad 7G for grounding and a constant voltage regulator connection pad 7P for power supply. The constant voltage regulator connection pads 7G for grounding and the constant voltage regulator connection pads 7P for power supply are arranged in a plurality of rows so as to be alternately positioned.

  Furthermore, the build-up conductor 2a has a solid conductor 2GS for grounding from a region corresponding to the semiconductor element mounting portion 10A to a region corresponding to the constant voltage regulator mounting portion 10B. The solid ground conductor 2GS in the build-up conductor 2a integrally includes a ground semiconductor element connection pad 6G and a ground constant voltage regulator connection pad 7G. The solid ground conductor 2GS is connected to the ground external connection pad 8G via the through hole 4 and the via hole 5 below the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B. Yes. A current for applying a ground potential to the semiconductor element S is supplied between the constant voltage regulator mounting part 10B and the semiconductor element mounting part 10A via the solid conductor 2GS.

  The buildup conductor 2a is not disposed between the area corresponding to the semiconductor element mounting portion 10A and the area corresponding to the constant voltage regulator mounting portion 10B that obstructs the current supply therebetween. Therefore, a current for applying a ground potential to the semiconductor element S can be satisfactorily supplied from the constant voltage regulator V via the solid ground conductor 2GS formed on the build-up conductor 2a.

  FIG. 3 shows the top surface of the buildup conductor 2b deposited on the surface of the second buildup insulating layer 1b from the top. In FIG. 3, regions corresponding to the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B are indicated by two-dot chain lines. The position of the via hole 5 connected from the upper layer buildup conductor 2a is indicated by a broken line.

  The build-up conductor 2b mainly has a strip-like conductor 2SS for signals and a solid conductor 2PS for power supply. As the wiring conductor 2G for grounding, only circular land conductors for connection to the upper and lower conductors 2a and 2c are formed.

  The signal strip conductor 2SS in the buildup conductor 2b is a thin strip conductor having a width of about 5 to 30 μm. The strip conductor 2SS extends from below the semiconductor element mounting portion 10A to the outer peripheral portion of the insulating substrate 1. The strip-shaped conductor 2SS extends to the outer peripheral portion of the insulating substrate 1 without passing below the intermediate portion between the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B. The signal strip conductor 2SS is connected to the signal semiconductor element connection pad 6S below the semiconductor element mounting portion 10A. In addition, the outer peripheral portion of the insulating substrate 1 is connected to the signal external connection pad 8S.

  The solid conductor 2PS for power supply in the buildup conductor 2b extends from below the semiconductor element mounting portion 10A to below the constant voltage regulator mounting portion 10B. The solid conductor 2PS for power supply is electrically connected to the power supply semiconductor element connection pad 6P via the upper via hole 5 below the semiconductor element mounting portion 10A. Further, below the constant voltage regulator mounting portion 10B, the power supply constant voltage regulator connection pad 7P is electrically connected through the upper via hole 5. Further, it is connected to the external connection pad 8P for power supply below the semiconductor element mounting portion 10A and below the constant voltage regulator mounting portion 10B. A current for applying a power supply potential to the semiconductor element S is supplied between the constant voltage regulator mounting part 10B and the semiconductor element mounting part 10A via the solid conductor 2PS.

  The build-up conductor 2b is formed with a signal strip conductor 2SS extending from the lower side of the semiconductor element mounting portion 10A to the outer peripheral portion of the insulating substrate 1, but the signal strip conductor 2SS is a semiconductor. It extends to the outer peripheral portion of the insulating substrate 1 without passing below the intermediate portion between the element mounting portion 10A and the constant voltage regulator mounting portion 10B. Therefore, current supply from the lower side of the semiconductor element mounting portion 10A to the lower side of the constant voltage regulator mounting portion 10B is not significantly hindered. Therefore, a current for applying a power supply potential to the semiconductor element S can be satisfactorily supplied from the low voltage regulator V through the solid conductor 2PS for power supply formed on the buildup conductor 2b.

  FIG. 4 shows the top surface of the core conductor 2c deposited on the top surface of the core insulating layer 1c. In FIG. 4, regions corresponding to the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B are indicated by two-dot chain lines. The position of the via hole 5 connected from the upper layer buildup conductor 2b is indicated by a broken line.

  The core conductor 2c mainly includes a solid conductor 2GS for grounding. As the signal wiring conductor 2S and the power supply wiring conductor 2G, only circular land conductors for connection to the upper and lower conductors 2b and 2d are formed.

  The grounding solid conductor 2GS in the core conductor 2c extends from below the semiconductor element mounting portion 10A to below the constant voltage regulator mounting portion 10B. The solid ground conductor 2GS is connected to the grounding semiconductor element connection pad 6G below the semiconductor element mounting portion 10A. Further, below the constant voltage regulator mounting portion 10B, it is connected to the grounding constant voltage regulator connection pad 7G. Furthermore, it is connected to the ground external connection pad 8G below the semiconductor element mounting portion 10A and below the constant voltage regulator mounting portion 10B. A current for applying a ground potential to the semiconductor element S is supplied between the constant voltage regulator mounting part 10B and the semiconductor element mounting part 10A via the solid conductor 2GS.

  The core conductor 2c does not impede current supply between the lower part of the semiconductor element mounting part 10A and the lower part of the constant voltage regulator mounting part 10B. Therefore, a current for giving a ground potential to the semiconductor element S can be satisfactorily supplied from the constant voltage regulator V via the solid ground conductor 2GS formed on the core conductor 2c.

  FIG. 5 shows the upper surface of the core conductor 2d deposited on the lower surface of the core insulating layer 1c. In FIG. 5, regions corresponding to the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B are indicated by two-dot chain lines. The position of the through hole 4 connected from the upper core conductor 2c is indicated by a broken line.

  The core conductor 2d mainly has a solid conductor 2PS for power supply. As the signal wiring conductor 2S and the ground wiring conductor 2G, only circular land conductors for connection to the upper and lower conductors 2c and 2e are formed.

  The solid conductor 2PS for power supply in the core conductor 2d extends from below the semiconductor element mounting portion 10A to below the constant voltage regulator mounting portion 10B. The solid conductor 2PS for power supply is connected to the semiconductor element connection pad 6P for power supply below the semiconductor element mounting portion 10A. Further, below the constant voltage regulator mounting portion 10B, the power supply constant voltage regulator connection pad 7P is connected. Further, it is connected to the external connection pad 8P for power supply below the semiconductor element mounting portion 10A and below the constant voltage regulator mounting portion 10B. A current for applying a power supply potential to the semiconductor element S is supplied between the constant voltage regulator mounting part 10B and the semiconductor element mounting part 10A via the solid conductor 2PS.

  The core conductor 2d does not obstruct current supply between the lower part of the semiconductor element mounting part 10A and the lower part of the constant voltage regulator mounting part 10B. Therefore, a current for applying a power source potential to the semiconductor element S can be satisfactorily supplied from the constant voltage regulator V via the solid power source conductor 2PS formed on the core conductor 2d.

  FIG. 6 shows the top surface of the buildup conductor 2e deposited on the surface of the second buildup insulating layer 1d from the bottom. In FIG. 6, regions corresponding to the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B are indicated by two-dot chain lines. The position of the via hole 5 connected from the upper core conductor 2d is indicated by a broken line.

  The build-up conductor 2e mainly has a solid conductor 2GS for grounding. As the signal wiring conductor 2S and the power supply wiring conductor 2P, only circular land conductors for connection to the upper and lower conductors 2d and 2f are formed.

  The solid conductor 2GS for grounding in the buildup conductor 2e extends from below the semiconductor element mounting portion 10A to below the constant voltage regulator mounting portion 10B. The solid ground conductor 2GS is connected to the grounding semiconductor element connection pad 6G below the semiconductor element mounting portion 10A. Further, below the constant voltage regulator mounting portion 10B, it is connected to the grounding constant voltage regulator connection pad 7G. Furthermore, it is connected to the ground external connection pad 8G below the semiconductor element mounting portion 10A and below the constant voltage regulator mounting portion 10B. A current for applying a ground potential to the semiconductor element S is supplied between the constant voltage regulator mounting part 10B and the semiconductor element mounting part 10A via the solid conductor 2GS.

  The buildup conductor 2e does not obstruct current supply between the lower part of the semiconductor element mounting part 10A and the lower part of the constant voltage regulator mounting part 10B. Therefore, a current for applying a ground potential to the semiconductor element S can be satisfactorily supplied from the constant voltage regulator V via the solid ground conductor 2GS formed on the buildup conductor 2e.

  FIG. 7 shows a top view of the buildup conductor 2f deposited on the surface of the lowermost buildup insulating layer 1e. In FIG. 7, regions corresponding to the semiconductor element mounting portion 10A and the constant voltage regulator mounting portion 10B are indicated by two-dot chain lines. Further, the position of the via hole 5 connected from the upper buildup conductor 2a and the position of the opening of the solder resist layer 3b on the lower surface side are indicated by broken lines.

  The build-up conductor 2f mainly includes a solid conductor 2PS for power supply and external connection pads 8S, 8G, and 8P for signal, grounding, and power. The signal external connection pad 8S is electrically connected to the signal strip conductor 2SS through the through hole 4 and the via hole 5. The external connection pads 8G and 8P for grounding and power supply are electrically connected to the solid conductors 2GS and 2PS for grounding through the through hole 4 and the via hole 5, respectively.

  The solid conductor 2PS for power supply in this layer is formed integrally with the external connection pad 8P for power supply, and extends from below the semiconductor element mounting portion 10A to below the constant voltage regulator mounting portion 10B. . A current for applying a power supply potential to the semiconductor element S is supplied between the constant voltage regulator mounting part 10B and the semiconductor element mounting part 10A via the solid conductor 2PS.

  The buildup conductor 2f does not impede current supply between the lower part of the semiconductor element mounting part 10A and the lower part of the constant voltage regulator mounting part 10B. Therefore, a current for applying the ground potential to the semiconductor element S can be satisfactorily supplied from the constant voltage regulator V through the solid conductor 2PS for power supply formed on the buildup conductor 2f.

  Then, according to the wiring board 10 of this example, as shown in FIG. 8, the electrode terminal TS of the semiconductor element S is connected to the semiconductor element connection pad 6 via solder and the electrode terminal TV of the constant voltage regulator V is fixed. By connecting to the voltage regulator connection pad 7 via solder, an electronic device in which the semiconductor element S and the constant voltage regulator V are mounted on the wiring board 10 is completed.

  The electronic device is mounted on the external electric circuit board by connecting the external connection pads 8 to a wiring conductor of an external electric circuit board (not shown) such as a mother board via solder.

  The electronic device mounted on the external electric circuit board transmits and receives signals to and from the external electric circuit board via the signal external connection pads 8S. Further, the ground and the power supply voltage are supplied through the external connection pad 8G for grounding and the external connection pad 8P for power supply, respectively.

  Furthermore, a current is supplied from the constant voltage regulator V to suppress fluctuations in the operating voltage of the semiconductor element S through the solid ground conductor 2GS and the solid power source conductor 2PS.

  Thus, according to the wiring board 10 of this example and the electronic apparatus using the same, the signal wiring conductor 2S has the surface of the build-up insulating layer 2b on which the solid conductor 2PS for power supply extends, mounted on the semiconductor element. The solid conductor 2PS for power supply on the surface of the build-up insulating layer 1b is not extended below the intermediate portion between the portion 10A and the constant voltage regulator mounting portion 10B, and extends to the outer peripheral portion of the insulating substrate 1. The current path from directly under the constant voltage regulator mounting portion 10B to directly under the semiconductor element mounting portion 10A is not obstructed by the signal wiring conductor 2S, and is used for grounding or power supply disposed in each of the conductor layers 2a to 2f. A sufficient current can be supplied to the semiconductor element S through the solid conductors 2GS and 2PS. Therefore, it is possible to provide a wiring board 10 capable of stably operating the semiconductor element S and an electronic device using the same.

  In addition, this invention is not limited to the above-mentioned embodiment example, A various change is possible if it is a range which does not deviate from the summary of this invention. For example, the solid ground conductor 2GS and the solid power source conductor 2PS in the above-described embodiment may be interchanged. Further, the build-up insulating layer and the build-up conductor are not limited to the above-described number of layers, and can be any number of layers.

DESCRIPTION OF SYMBOLS 1 .... Insulation substrate 1a ... Core insulation layer 1b ... Build-up insulation layer 2 .... Wiring conductor 2GS ... Solid-state conductor for grounding 2PS ... ... Solid conductors for power supply 2S ... Wiring conductors for signals 2SS ... ... Strip conductors for signals 4 ... ... Through holes 5 ... Via holes 6 ... .... Semiconductor element connection pads 6G ... Semiconductor element connection pads for grounding 6P ... Semiconductor element connection pads for power supply 6S ... Semiconductor element connection pads for signals 7.・ ・ ・ ・ Constant voltage regulator connection pad 7G ・ ・ ・ ・ ・ Constant voltage regulator connection pad for grounding 7P ・ ・ ・ Constant voltage regulator connection pad for power supply 8 ・ ・ ・ ・ ・ ・ External connection pad 8G ・ ・... External connection pad for grounding 8P ... External connection pad for power supply 8S ... External connection pad for signal 10 ... Wiring board 10A ... Semiconductor element mounting part 10B ... Constant voltage regulator mounting part 10C ... External connection surface

Claims (2)

  A plurality of build-up insulating layers having a plurality of via holes are laminated on the upper and lower surfaces of a core insulating layer having a plurality of through holes, and a semiconductor element mounting portion and a constant voltage regulator mounting portion on the outer periphery of the upper surface are formed. And an insulating substrate having an external connection surface on the lower surface, and a wiring conductor composed of conductors deposited on the upper and lower surfaces of the core insulating layer and in the through hole, and on the surface of the build-up insulating layer and the via hole, A plurality of semiconductor element connection pads for signal, grounding, and power supply disposed on the semiconductor element mounting portion; and a grounding conductor disposed on the constant voltage regulator mounting portion. A plurality of constant voltage regulator connection pads for power, a plurality of signal, ground, power supply external connection pads disposed on the external connection surface, and the half The signal is connected to the signal semiconductor element connection pad below the body element mounting portion, and is connected to the signal external connection pad at the outer periphery of the insulating substrate so that the inside of the insulating substrate is connected to the semiconductor element mounting portion. A plurality of signal wiring conductors extending from below to the outer periphery of the insulating substrate, and connected to the grounding semiconductor element connection pad below the semiconductor element mounting part and below the constant voltage regulator mounting part Connected to the grounding constant voltage regulator connection pad, and connected to the grounding external connection pad below the semiconductor element mounting portion and below the constant voltage regulator mounting portion, and on the upper surface side and the lower surface side of the core insulating layer A plurality of the plurality of build-up insulating layers extending from below the semiconductor element mounting portion to below the constant voltage regulator mounting portion A solid conductor for grounding is connected to the power source semiconductor element connection pad below the semiconductor element mounting portion and to the power source constant voltage regulator connection pad below the constant voltage regulator mounting portion. The surfaces of the plurality of build-up insulating layers on the upper surface side and the lower surface side of the core insulating layer are connected to the external connection pads for power supply below the semiconductor element mounting portion and below the constant voltage regulator mounting portion. A plurality of solid conductors for power supply extending from below the semiconductor element mounting portion to below the constant voltage regulator mounting portion, wherein the signal wiring conductor is used for grounding or The surface of the build-up insulating layer where the solid conductor for power supply extends extends below the intermediate portion between the semiconductor element mounting portion and the constant voltage regulator mounting portion. A wiring board characterized by extending to the outer periphery of the insulating substrate without passing through.   2. An electronic device comprising: a semiconductor element mounted on the semiconductor element mounting portion of the wiring board according to claim 1; and a constant voltage regulator mounted on the constant voltage regulator mounting portion.