JP2018060876A5 - - Google Patents
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- JP2018060876A5 JP2018060876A5 JP2016196164A JP2016196164A JP2018060876A5 JP 2018060876 A5 JP2018060876 A5 JP 2018060876A5 JP 2016196164 A JP2016196164 A JP 2016196164A JP 2016196164 A JP2016196164 A JP 2016196164A JP 2018060876 A5 JP2018060876 A5 JP 2018060876A5
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- core substrate
- electronic component
- component built
- support pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 38
- 239000011810 insulating material Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 30
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016196164A JP6678090B2 (ja) | 2016-10-04 | 2016-10-04 | 電子部品内蔵基板及びその製造方法と電子部品装置 |
| US15/718,280 US10321574B2 (en) | 2016-10-04 | 2017-09-28 | Electronic component-embedded substrate and electronic component device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016196164A JP6678090B2 (ja) | 2016-10-04 | 2016-10-04 | 電子部品内蔵基板及びその製造方法と電子部品装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018060876A JP2018060876A (ja) | 2018-04-12 |
| JP2018060876A5 true JP2018060876A5 (cg-RX-API-DMAC7.html) | 2019-06-20 |
| JP6678090B2 JP6678090B2 (ja) | 2020-04-08 |
Family
ID=61759157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016196164A Active JP6678090B2 (ja) | 2016-10-04 | 2016-10-04 | 電子部品内蔵基板及びその製造方法と電子部品装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10321574B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6678090B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019082987A1 (ja) * | 2017-10-26 | 2019-05-02 | Tdk株式会社 | 電子部品内蔵構造体 |
| KR102595865B1 (ko) * | 2019-03-04 | 2023-10-30 | 삼성전자주식회사 | 하이브리드 인터포저를 갖는 반도체 패키지 |
| CN111970809B (zh) * | 2019-05-20 | 2022-01-11 | 鹏鼎控股(深圳)股份有限公司 | 高频电路板及其制作方法 |
| JP2021052108A (ja) * | 2019-09-25 | 2021-04-01 | ソニーセミコンダクタソリューションズ株式会社 | 半導体レーザ駆動装置、電子機器、および、半導体レーザ駆動装置の製造方法 |
| US11158582B2 (en) | 2019-12-04 | 2021-10-26 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor devices and methods of manufacturing semiconductor devices |
| US11342248B2 (en) * | 2020-07-14 | 2022-05-24 | Gan Systems Inc. | Embedded die packaging for power semiconductor devices |
| KR20230061801A (ko) | 2021-10-29 | 2023-05-09 | 삼성전기주식회사 | 전자부품 내장기판 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011249457A (ja) * | 2010-05-25 | 2011-12-08 | Dainippon Printing Co Ltd | 部品内蔵配線板、部品内蔵配線板の製造方法 |
| CN103563498B (zh) | 2011-05-13 | 2016-07-06 | 揖斐电株式会社 | 电路板及其制造方法 |
| JP5968753B2 (ja) * | 2012-10-15 | 2016-08-10 | 新光電気工業株式会社 | 配線基板 |
| JP2015159153A (ja) * | 2014-02-21 | 2015-09-03 | イビデン株式会社 | 電子部品内蔵多層配線板 |
| JP6393566B2 (ja) * | 2014-09-17 | 2018-09-19 | 新光電気工業株式会社 | 配線基板、半導体装置及び配線基板の製造方法 |
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2016
- 2016-10-04 JP JP2016196164A patent/JP6678090B2/ja active Active
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2017
- 2017-09-28 US US15/718,280 patent/US10321574B2/en active Active