JP2018028147A5 - - Google Patents

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Publication number
JP2018028147A5
JP2018028147A5 JP2017156457A JP2017156457A JP2018028147A5 JP 2018028147 A5 JP2018028147 A5 JP 2018028147A5 JP 2017156457 A JP2017156457 A JP 2017156457A JP 2017156457 A JP2017156457 A JP 2017156457A JP 2018028147 A5 JP2018028147 A5 JP 2018028147A5
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JP
Japan
Prior art keywords
copper foil
plane
treated copper
treated
wireless charging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017156457A
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English (en)
Japanese (ja)
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JP6421222B2 (ja
JP2018028147A (ja
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Publication date
Priority claimed from US15/241,264 external-priority patent/US9673646B1/en
Application filed filed Critical
Publication of JP2018028147A publication Critical patent/JP2018028147A/ja
Publication of JP2018028147A5 publication Critical patent/JP2018028147A5/ja
Application granted granted Critical
Publication of JP6421222B2 publication Critical patent/JP6421222B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017156457A 2016-08-19 2017-08-14 表面処理電解銅箔およびフレキシブルプリント回路基板の無線充電方法 Active JP6421222B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/241,264 US9673646B1 (en) 2016-08-19 2016-08-19 Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board
US15/241,264 2016-08-19

Publications (3)

Publication Number Publication Date
JP2018028147A JP2018028147A (ja) 2018-02-22
JP2018028147A5 true JP2018028147A5 (enExample) 2018-06-14
JP6421222B2 JP6421222B2 (ja) 2018-11-07

Family

ID=58776464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017156457A Active JP6421222B2 (ja) 2016-08-19 2017-08-14 表面処理電解銅箔およびフレキシブルプリント回路基板の無線充電方法

Country Status (5)

Country Link
US (1) US9673646B1 (enExample)
JP (1) JP6421222B2 (enExample)
KR (1) KR101919246B1 (enExample)
CN (1) CN107769395B (enExample)
TW (1) TWI627293B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180007745A (ko) * 2016-07-14 2018-01-24 (주)에너브레인 소형 액추에이터의 박막형 코일부 제조 방법
JP6926013B2 (ja) * 2018-02-23 2021-08-25 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、フレキシブルプリント基板用銅箔の販売製品、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
US11689065B2 (en) * 2019-02-15 2023-06-27 Honda Motor Co., Ltd. System and methods for charging a device
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI697549B (zh) 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
CN111610181A (zh) * 2020-06-05 2020-09-01 多氟多新能源科技有限公司 一种铜箔铬元素含量的定量检测方法
DE102020211597A1 (de) 2020-09-16 2022-03-17 Continental Automotive Gmbh Verfahren zum Betreiben einer elektrischen Schalteinheit mit zumindest einer Ladespule einer induktiven Ladeeinrichtung für ein mobiles Endgerät, das damit in einem Kraftfahrzeug mit Radioempfänger geladen werden kann, sowie Schalteinheit, Ladeeinrichtung und Kraftfahrzeug
KR20220043617A (ko) * 2020-09-29 2022-04-05 에스케이넥실리스 주식회사 고강도 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지 및 그것의 제조방법
US11646606B2 (en) 2021-01-22 2023-05-09 Microsoft Technology Licensing, Llc Receive and transmit coil pair selection
WO2025184076A1 (en) * 2024-02-27 2025-09-04 Rogers Corporation Laminate
CN119243159B (zh) * 2024-12-03 2025-04-11 安徽华威铜箔科技有限公司 一种载体铜箔粗化药水和载体铜箔粗化方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215646A (en) * 1992-05-06 1993-06-01 Circuit Foil Usa, Inc. Low profile copper foil and process and apparatus for making bondable metal foils
US6372113B2 (en) * 1999-09-13 2002-04-16 Yates Foil Usa, Inc. Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
JP4833556B2 (ja) 2004-02-06 2011-12-07 古河電気工業株式会社 表面処理銅箔
JP2006222185A (ja) * 2005-02-09 2006-08-24 Furukawa Circuit Foil Kk ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板
JP4833692B2 (ja) 2006-03-06 2011-12-07 古河電気工業株式会社 銅箔、銅箔の製造方法および前記銅箔を用いた積層回路基板
WO2009084412A1 (ja) * 2007-12-27 2009-07-09 Nippon Mining & Metals Co., Ltd. ２層銅張積層板の製造方法及び２層銅張積層板
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP5634103B2 (ja) 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
CN104651836B (zh) * 2010-11-22 2018-11-02 三井金属矿业株式会社 表面处理铜箔
CN102625580A (zh) * 2011-01-31 2012-08-01 李洲科技股份有限公司 一种电路板制造流程
JP5411192B2 (ja) * 2011-03-25 2014-02-12 Ｊｘ日鉱日石金属株式会社 圧延銅箔及びその製造方法
TWI533496B (zh) * 2013-07-23 2016-05-11 Chang Chun Petrochemical Co Electrolytic copper foil
KR101449342B1 (ko) 2013-11-08 2014-10-13 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지
TWI542739B (zh) * 2014-03-21 2016-07-21 長春石油化學股份有限公司 電解銅箔
JP5756547B1 (ja) * 2014-04-28 2015-07-29 株式会社Ｓｈカッパープロダクツ 表面処理銅箔及び積層板
CN204526301U (zh) 2015-04-10 2015-08-05 松扬电子材料(昆山)有限公司 适用于无线充电设备的双面铜箔基板

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