JP2018026138A5 - - Google Patents

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Publication number
JP2018026138A5
JP2018026138A5 JP2017156619A JP2017156619A JP2018026138A5 JP 2018026138 A5 JP2018026138 A5 JP 2018026138A5 JP 2017156619 A JP2017156619 A JP 2017156619A JP 2017156619 A JP2017156619 A JP 2017156619A JP 2018026138 A5 JP2018026138 A5 JP 2018026138A5
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JP
Japan
Prior art keywords
process fluid
meniscus
elongated bladder
chamber
bladder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017156619A
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English (en)
Japanese (ja)
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JP7013168B2 (ja
JP2018026138A (ja
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Application filed filed Critical
Publication of JP2018026138A publication Critical patent/JP2018026138A/ja
Publication of JP2018026138A5 publication Critical patent/JP2018026138A5/ja
Application granted granted Critical
Publication of JP7013168B2 publication Critical patent/JP7013168B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017156619A 2016-08-11 2017-08-14 メニスカス制御を備えた高精度分配システム Active JP7013168B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373733P 2016-08-11 2016-08-11
US62/373,733 2016-08-11

Publications (3)

Publication Number Publication Date
JP2018026138A JP2018026138A (ja) 2018-02-15
JP2018026138A5 true JP2018026138A5 (enExample) 2020-09-10
JP7013168B2 JP7013168B2 (ja) 2022-01-31

Family

ID=61160360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017156619A Active JP7013168B2 (ja) 2016-08-11 2017-08-14 メニスカス制御を備えた高精度分配システム

Country Status (5)

Country Link
US (1) US10354872B2 (enExample)
JP (1) JP7013168B2 (enExample)
KR (2) KR102545444B1 (enExample)
CN (1) CN107728431A (enExample)
TW (1) TWI760355B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11072858B2 (en) * 2018-09-05 2021-07-27 Nova Engineering Films, Inc. Pulsing mixture of precursor and supercritical fluid to treat substrate surface
JP6698809B1 (ja) * 2018-12-19 2020-05-27 株式会社キャタラー 排ガス浄化装置の製造方法
US12080903B2 (en) * 2019-04-15 2024-09-03 Robert Bosch Gmbh Pressure management device for battery pack
US11754923B2 (en) * 2021-03-26 2023-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Resist dispensing system and method of use
KR102650050B1 (ko) 2021-08-24 2024-03-20 세메스 주식회사 메니스커스 측정 장치 및 방법, 기판 처리 장치

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US4195810A (en) 1978-03-31 1980-04-01 Lavin Aaron M Pinch valve
US4442954A (en) 1982-07-30 1984-04-17 National Instrument Company, Inc. Self-pressurizing pinch valve
JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
FR2651552B1 (fr) 1989-09-01 1991-12-06 Cit Alcatel Vanne et dispositifs utilisant ladite vanne.
US20020055786A1 (en) * 1994-08-16 2002-05-09 Anthony Atala Reconstruction of urological structures with polymeric matrices
JP3958926B2 (ja) 1999-10-18 2007-08-15 インテグレイテッド・デザインズ・リミテッド・パートナーシップ 流体を分配する装置および方法
JP2002231668A (ja) 2001-01-31 2002-08-16 Mitsubishi Materials Silicon Corp スラリー移送装置
US6568416B2 (en) 2001-02-28 2003-05-27 Brian L. Andersen Fluid flow control system, fluid delivery and control system for a fluid delivery line, and method for controlling pressure oscillations within fluid of a fluid delivery line
JP2005504908A (ja) 2001-10-01 2005-02-17 エフエスアイ インターナショナル 流体を滴下させる装置と、この方法
US7114641B2 (en) * 2003-09-19 2006-10-03 Intel Corporation Drip resistant dispensing nozzle
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JP4511868B2 (ja) * 2004-04-26 2010-07-28 株式会社コガネイ 可撓性タンクとこれを用いた薬液供給装置
US7335003B2 (en) 2004-07-09 2008-02-26 Saint-Gobain Performance Plastics Corporation Precision dispense pump
US20060029720A1 (en) * 2004-08-03 2006-02-09 Anastasia Panos Methods and apparatus for injection coating a medical device
KR100643494B1 (ko) 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치
KR20060065188A (ko) 2004-12-10 2006-06-14 삼성전자주식회사 반도체 코팅설비의 포토레지스트 분사장치
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JP2006324677A (ja) * 2006-05-29 2006-11-30 Tokyo Electron Ltd 液処理装置の自動設定装置
US7935948B2 (en) * 2006-08-11 2011-05-03 Sokudo Co., Ltd. Method and apparatus for monitoring and control of suck back level in a photoresist dispense system
US20080169230A1 (en) 2007-01-12 2008-07-17 Toshiba America Electronic Components, Inc. Pumping and Dispensing System for Coating Semiconductor Wafers
JP4824792B2 (ja) * 2009-07-02 2011-11-30 東京エレクトロン株式会社 塗布装置
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