JP2018014493A - 紫外線発光半導体装置およびその製造方法 - Google Patents
紫外線発光半導体装置およびその製造方法 Download PDFInfo
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- JP2018014493A JP2018014493A JP2017133884A JP2017133884A JP2018014493A JP 2018014493 A JP2018014493 A JP 2018014493A JP 2017133884 A JP2017133884 A JP 2017133884A JP 2017133884 A JP2017133884 A JP 2017133884A JP 2018014493 A JP2018014493 A JP 2018014493A
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Led Device Packages (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
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| JP2016136388 | 2016-07-08 | ||
| JP2016136388 | 2016-07-08 |
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| JP2018014493A true JP2018014493A (ja) | 2018-01-25 |
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| JP (1) | JP2018014493A (ko) |
| KR (1) | KR20190030702A (ko) |
| CN (1) | CN109219892A (ko) |
| TW (1) | TW201815898A (ko) |
| WO (1) | WO2018008539A1 (ko) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020174152A (ja) * | 2019-04-12 | 2020-10-22 | 日機装株式会社 | 半導体発光装置及びその製造方法 |
| WO2021070347A1 (ja) * | 2019-10-10 | 2021-04-15 | 株式会社エンプラス | 発光装置および殺菌装置 |
| JP2021150428A (ja) * | 2020-03-18 | 2021-09-27 | 日機装株式会社 | 半導体発光装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP7250560B2 (ja) * | 2019-02-20 | 2023-04-03 | 旭化成株式会社 | 紫外線発光装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
| DE10118231A1 (de) * | 2001-04-11 | 2002-10-17 | Heidenhain Gmbh Dr Johannes | Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung |
| US20100163909A1 (en) * | 2007-09-27 | 2010-07-01 | Ming-Hung Chen | Manufacturing method and structure of light-emitting diode with multilayered optical lens |
| JPWO2015115341A1 (ja) * | 2014-01-31 | 2017-03-23 | 住友化学株式会社 | 半導体発光装置の製造方法 |
| JP6500888B2 (ja) * | 2014-02-18 | 2019-04-17 | 住友化学株式会社 | 半導体発光装置の製造方法 |
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2017
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- 2017-06-30 CN CN201780034189.8A patent/CN109219892A/zh active Pending
- 2017-06-30 KR KR1020197003571A patent/KR20190030702A/ko unknown
- 2017-07-05 TW TW106122573A patent/TW201815898A/zh unknown
- 2017-07-07 JP JP2017133884A patent/JP2018014493A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020174152A (ja) * | 2019-04-12 | 2020-10-22 | 日機装株式会社 | 半導体発光装置及びその製造方法 |
| US11430927B2 (en) | 2019-04-12 | 2022-08-30 | Nikkiso Co., Ltd. | Semiconductor light-emitting device and method for manufacturing the same |
| JP7252820B2 (ja) | 2019-04-12 | 2023-04-05 | 日機装株式会社 | 半導体発光装置及びその製造方法 |
| JP2023080122A (ja) * | 2019-04-12 | 2023-06-08 | 日機装株式会社 | 半導体発光装置及びその製造方法 |
| JP7498331B2 (ja) | 2019-04-12 | 2024-06-11 | 日機装株式会社 | 半導体発光装置及びその製造方法 |
| WO2021070347A1 (ja) * | 2019-10-10 | 2021-04-15 | 株式会社エンプラス | 発光装置および殺菌装置 |
| JP2021150428A (ja) * | 2020-03-18 | 2021-09-27 | 日機装株式会社 | 半導体発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109219892A (zh) | 2019-01-15 |
| KR20190030702A (ko) | 2019-03-22 |
| WO2018008539A1 (ja) | 2018-01-11 |
| TW201815898A (zh) | 2018-05-01 |
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