JP2018010949A5 - - Google Patents

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Publication number
JP2018010949A5
JP2018010949A5 JP2016138140A JP2016138140A JP2018010949A5 JP 2018010949 A5 JP2018010949 A5 JP 2018010949A5 JP 2016138140 A JP2016138140 A JP 2016138140A JP 2016138140 A JP2016138140 A JP 2016138140A JP 2018010949 A5 JP2018010949 A5 JP 2018010949A5
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JP
Japan
Prior art keywords
semiconductor light
emitting device
light emitting
base material
main surface
Prior art date
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Granted
Application number
JP2016138140A
Other languages
English (en)
Japanese (ja)
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JP2018010949A (ja
JP7029223B2 (ja
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Priority to JP2016138140A priority Critical patent/JP7029223B2/ja
Priority claimed from JP2016138140A external-priority patent/JP7029223B2/ja
Priority to US15/643,136 priority patent/US10319887B2/en
Priority to CN201710565645.3A priority patent/CN107623065A/zh
Publication of JP2018010949A publication Critical patent/JP2018010949A/ja
Publication of JP2018010949A5 publication Critical patent/JP2018010949A5/ja
Application granted granted Critical
Publication of JP7029223B2 publication Critical patent/JP7029223B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016138140A 2016-07-13 2016-07-13 半導体発光装置 Active JP7029223B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016138140A JP7029223B2 (ja) 2016-07-13 2016-07-13 半導体発光装置
US15/643,136 US10319887B2 (en) 2016-07-13 2017-07-06 Semiconductor light-emitting device and method for manufacturing the same
CN201710565645.3A CN107623065A (zh) 2016-07-13 2017-07-12 半导体发光器件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016138140A JP7029223B2 (ja) 2016-07-13 2016-07-13 半導体発光装置

Publications (3)

Publication Number Publication Date
JP2018010949A JP2018010949A (ja) 2018-01-18
JP2018010949A5 true JP2018010949A5 (enExample) 2019-04-18
JP7029223B2 JP7029223B2 (ja) 2022-03-03

Family

ID=60940741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016138140A Active JP7029223B2 (ja) 2016-07-13 2016-07-13 半導体発光装置

Country Status (3)

Country Link
US (1) US10319887B2 (enExample)
JP (1) JP7029223B2 (enExample)
CN (1) CN107623065A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102769519B1 (ko) * 2018-02-14 2025-02-17 에피스타 코포레이션 발광 장치, 그 제조 방법 및 디스플레이 모듈
JP7257380B2 (ja) * 2018-03-12 2023-04-13 ローム株式会社 半導体装置、および半導体装置の実装構造
JP2020025034A (ja) * 2018-08-08 2020-02-13 ローム株式会社 Ｌｅｄパッケージ、ｌｅｄ表示装置
JP2020027824A (ja) * 2018-08-09 2020-02-20 ローム株式会社 発光装置および表示装置
TWI819073B (zh) * 2019-08-22 2023-10-21 晶元光電股份有限公司 發光裝置、其製造方法及顯示模組
WO2025074771A1 (ja) * 2023-10-04 2025-04-10 ローム株式会社 半導体モジュール

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6194362U (enExample) * 1984-11-26 1986-06-18
JPH08321634A (ja) * 1995-05-26 1996-12-03 Stanley Electric Co Ltd 表面実装型発光ダイオード
JP3065509B2 (ja) * 1995-06-02 2000-07-17 スタンレー電気株式会社 表面実装型発光ダイオード
JP3158018B2 (ja) * 1995-07-17 2001-04-23 シャープ株式会社 横発光型ｌｅｄおよびその製造方法
JPH11298049A (ja) * 1998-04-16 1999-10-29 Matsushita Electron Corp 発光表示装置
JP2007088155A (ja) * 2005-09-21 2007-04-05 Stanley Electric Co Ltd 表面実装型ｌｅｄ基板
JP4049186B2 (ja) * 2006-01-26 2008-02-20 ソニー株式会社 光源装置
JP2007258324A (ja) * 2006-03-22 2007-10-04 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
EP1928026A1 (en) * 2006-11-30 2008-06-04 Toshiba Lighting & Technology Corporation Illumination device with semiconductor light-emitting elements
JP5340583B2 (ja) * 2007-11-26 2013-11-13 スタンレー電気株式会社 半導体発光装置
WO2010061434A1 (ja) * 2008-11-25 2010-06-03 電気化学工業株式会社 発光素子パッケージ用基板の製造方法および発光素子パッケージ
JP2011023461A (ja) * 2009-07-14 2011-02-03 Panasonic Corp 半導体装置
JP2011077164A (ja) * 2009-09-29 2011-04-14 Sanken Electric Co Ltd 半導体発光装置
JP2012186450A (ja) * 2011-02-16 2012-09-27 Rohm Co Ltd Ｌｅｄモジュール
CN103137825B (zh) * 2011-11-30 2016-06-01 光宝电子(广州)有限公司 发光二极管基板结构、发光二极管单元及其光源模块
JP2015115432A (ja) * 2013-12-11 2015-06-22 ローム株式会社 半導体装置
KR102634692B1 (ko) * 2016-02-12 2024-02-08 삼성전자주식회사 반도체 발광 소자 패키지

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