JP2018001310A5 - - Google Patents

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Publication number
JP2018001310A5
JP2018001310A5 JP2016128716A JP2016128716A JP2018001310A5 JP 2018001310 A5 JP2018001310 A5 JP 2018001310A5 JP 2016128716 A JP2016128716 A JP 2016128716A JP 2016128716 A JP2016128716 A JP 2016128716A JP 2018001310 A5 JP2018001310 A5 JP 2018001310A5
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JP
Japan
Prior art keywords
film thickness
thickness data
generated
edge
polishing object
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JP2016128716A
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English (en)
Japanese (ja)
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JP2018001310A (ja
JP6795337B2 (ja
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Priority claimed from JP2016128716A external-priority patent/JP6795337B2/ja
Priority to JP2016128716A priority Critical patent/JP6795337B2/ja
Priority to TW106117636A priority patent/TWI723169B/zh
Priority to KR1020170077097A priority patent/KR102340702B1/ko
Priority to US15/633,546 priority patent/US10569380B2/en
Priority to CN201710509057.8A priority patent/CN107538339B/zh
Publication of JP2018001310A publication Critical patent/JP2018001310A/ja
Publication of JP2018001310A5 publication Critical patent/JP2018001310A5/ja
Publication of JP6795337B2 publication Critical patent/JP6795337B2/ja
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JP2016128716A 2016-06-29 2016-06-29 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法 Active JP6795337B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016128716A JP6795337B2 (ja) 2016-06-29 2016-06-29 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
TW106117636A TWI723169B (zh) 2016-06-29 2017-05-26 膜厚信號處理裝置、研磨裝置、膜厚信號處理方法、及研磨方法
KR1020170077097A KR102340702B1 (ko) 2016-06-29 2017-06-19 막 두께 신호 처리 장치, 연마 장치, 막 두께 신호 처리 방법 및 연마 방법
US15/633,546 US10569380B2 (en) 2016-06-29 2017-06-26 Film thickness signal processing apparatus, and polishing apparatus
CN201710509057.8A CN107538339B (zh) 2016-06-29 2017-06-28 膜厚信号处理装置、研磨装置、膜厚信号处理方法及研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016128716A JP6795337B2 (ja) 2016-06-29 2016-06-29 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法

Publications (3)

Publication Number Publication Date
JP2018001310A JP2018001310A (ja) 2018-01-11
JP2018001310A5 true JP2018001310A5 (enExample) 2019-08-08
JP6795337B2 JP6795337B2 (ja) 2020-12-02

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ID=60806394

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JP2016128716A Active JP6795337B2 (ja) 2016-06-29 2016-06-29 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法

Country Status (5)

Country Link
US (1) US10569380B2 (enExample)
JP (1) JP6795337B2 (enExample)
KR (1) KR102340702B1 (enExample)
CN (1) CN107538339B (enExample)
TW (1) TWI723169B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7019305B2 (ja) * 2017-04-26 2022-02-15 株式会社荏原製作所 渦電流センサのキャリブレーション方法
US20190299360A1 (en) * 2018-04-02 2019-10-03 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP7050560B2 (ja) * 2018-04-18 2022-04-08 株式会社荏原製作所 研磨装置及び基板処理装置
JP7153490B2 (ja) * 2018-07-13 2022-10-14 株式会社荏原製作所 研磨装置およびキャリブレーション方法
JP7084811B2 (ja) * 2018-07-13 2022-06-15 株式会社荏原製作所 研磨装置および研磨方法
US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
JP7575309B2 (ja) * 2021-03-17 2024-10-29 株式会社荏原製作所 膜厚測定方法、ノッチ部の検出方法、および研磨装置
CN117681117B (zh) * 2024-01-31 2024-05-17 华海清科(北京)科技有限公司 用于晶圆的金属薄膜厚度测量方法、装置、抛光设备和介质

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005011977A (ja) 2003-06-18 2005-01-13 Ebara Corp 基板研磨装置および基板研磨方法
JP4451111B2 (ja) 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
JP4163145B2 (ja) * 2004-04-30 2008-10-08 株式会社ルネサステクノロジ ウェハの研磨方法
US6949007B1 (en) * 2004-08-31 2005-09-27 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for multi-stage process control in film removal
JP4790475B2 (ja) * 2006-04-05 2011-10-12 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚測定プログラム
JP2008277450A (ja) * 2007-04-26 2008-11-13 Tokyo Seimitsu Co Ltd Ｃｍｐ装置の研磨条件管理装置及び研磨条件管理方法
JP5080933B2 (ja) * 2007-10-18 2012-11-21 株式会社荏原製作所 研磨監視方法および研磨装置
KR101018644B1 (ko) * 2008-09-05 2011-03-03 에스엔유 프리시젼 주식회사 증착장치 및 이를 이용한 증착방법
CN102049732B (zh) * 2010-08-30 2012-05-23 清华大学 一种硅片边缘膜厚测量方法
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
JP6050571B2 (ja) * 2011-08-09 2016-12-21 株式会社荏原製作所 研磨監視方法および研磨装置
US20130065493A1 (en) * 2011-08-09 2013-03-14 Taro Takahashi Polishing monitoring method, polishing end point detection method, and polishing apparatus
US9205527B2 (en) * 2012-11-08 2015-12-08 Applied Materials, Inc. In-situ monitoring system with monitoring of elongated region
JP6145342B2 (ja) * 2013-07-12 2017-06-07 株式会社荏原製作所 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
KR102326730B1 (ko) * 2014-03-12 2021-11-17 가부시키가이샤 에바라 세이사꾸쇼 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서
CN104154852B (zh) * 2014-08-20 2017-11-28 中国科学技术大学 基于电涡流传感器的导电膜厚度测量系统及方法
JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
KR101655074B1 (ko) * 2014-11-04 2016-09-07 주식회사 케이씨텍 화학 기계적 연마 장치 및 와전류 센서를 이용한 웨이퍼 도전층 두께 측정 방법
US10160089B2 (en) * 2015-10-01 2018-12-25 Ebara Corporation Polishing apparatus
KR102276869B1 (ko) * 2016-06-30 2021-07-14 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 자동화된 레시피 생성

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