JP2018001296A - 研磨装置、研磨方法、及び研磨制御プログラム - Google Patents

研磨装置、研磨方法、及び研磨制御プログラム Download PDF

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Publication number
JP2018001296A
JP2018001296A JP2016127611A JP2016127611A JP2018001296A JP 2018001296 A JP2018001296 A JP 2018001296A JP 2016127611 A JP2016127611 A JP 2016127611A JP 2016127611 A JP2016127611 A JP 2016127611A JP 2018001296 A JP2018001296 A JP 2018001296A
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JP
Japan
Prior art keywords
polishing
film thickness
measurement
time
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016127611A
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English (en)
Japanese (ja)
Other versions
JP2018001296A5 (enrdf_load_stackoverflow
Inventor
顕 中村
Akira Nakamura
顕 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2016127611A priority Critical patent/JP2018001296A/ja
Priority to TW106117866A priority patent/TW201800183A/zh
Priority to KR1020170077095A priority patent/KR20180002024A/ko
Priority to US15/633,464 priority patent/US20170368661A1/en
Priority to CN201710498753.3A priority patent/CN107538338A/zh
Publication of JP2018001296A publication Critical patent/JP2018001296A/ja
Publication of JP2018001296A5 publication Critical patent/JP2018001296A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016127611A 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム Pending JP2018001296A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム
TW106117866A TW201800183A (zh) 2016-06-28 2017-05-31 研磨裝置、研磨方法、及研磨控制程式
KR1020170077095A KR20180002024A (ko) 2016-06-28 2017-06-19 연마 장치, 연마 방법 및 연마 제어 프로그램
US15/633,464 US20170368661A1 (en) 2016-06-28 2017-06-26 Polishing apparatus, polishing method and polishing control program
CN201710498753.3A CN107538338A (zh) 2016-06-28 2017-06-27 研磨装置、研磨方法、及研磨控制程序

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム

Publications (2)

Publication Number Publication Date
JP2018001296A true JP2018001296A (ja) 2018-01-11
JP2018001296A5 JP2018001296A5 (enrdf_load_stackoverflow) 2019-08-15

Family

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Family Applications (1)

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JP2016127611A Pending JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム

Country Status (5)

Country Link
US (1) US20170368661A1 (enrdf_load_stackoverflow)
JP (1) JP2018001296A (enrdf_load_stackoverflow)
KR (1) KR20180002024A (enrdf_load_stackoverflow)
CN (1) CN107538338A (enrdf_load_stackoverflow)
TW (1) TW201800183A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11534886B2 (en) 2019-12-10 2022-12-27 Kioxia Corporation Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107363730A (zh) * 2017-09-11 2017-11-21 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 涡流检测装置及系统
KR102708233B1 (ko) * 2019-02-15 2024-09-23 주식회사 케이씨텍 기판 연마 시스템
AU2020253350A1 (en) 2019-03-29 2021-10-28 Saint-Gobain Abrasives, Inc. Performance grinding solutions
MX2021012071A (es) 2019-04-03 2021-12-10 Saint Gobain Abrasives Inc Articulo abrasivo, sistema abrasivo y metodo para usarlos y formarlos.

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JP2014003063A (ja) * 2012-06-15 2014-01-09 Ebara Corp 研磨方法
JP2015076449A (ja) * 2013-10-07 2015-04-20 株式会社荏原製作所 研磨方法
JP2015519740A (ja) * 2012-04-26 2015-07-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測
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JP5365091B2 (ja) * 2008-08-18 2013-12-11 富士通株式会社 メッキ厚算出プログラム、メッキ厚算出装置およびメッキ厚算出方法
AT10301U3 (de) * 2008-09-01 2009-09-15 Avl List Gmbh Verfahren und regelanordnung zur regelung einer regelstrecke mit sich wiederholendem arbeitszyklus
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JP2015519740A (ja) * 2012-04-26 2015-07-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測
JP2014003063A (ja) * 2012-06-15 2014-01-09 Ebara Corp 研磨方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11534886B2 (en) 2019-12-10 2022-12-27 Kioxia Corporation Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
TW201800183A (zh) 2018-01-01
US20170368661A1 (en) 2017-12-28
KR20180002024A (ko) 2018-01-05
CN107538338A (zh) 2018-01-05

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