TW201800183A - 研磨裝置、研磨方法、及研磨控制程式 - Google Patents

研磨裝置、研磨方法、及研磨控制程式 Download PDF

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Publication number
TW201800183A
TW201800183A TW106117866A TW106117866A TW201800183A TW 201800183 A TW201800183 A TW 201800183A TW 106117866 A TW106117866 A TW 106117866A TW 106117866 A TW106117866 A TW 106117866A TW 201800183 A TW201800183 A TW 201800183A
Authority
TW
Taiwan
Prior art keywords
film thickness
polishing
measurement
data
time
Prior art date
Application number
TW106117866A
Other languages
English (en)
Chinese (zh)
Inventor
中村顕
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201800183A publication Critical patent/TW201800183A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW106117866A 2016-06-28 2017-05-31 研磨裝置、研磨方法、及研磨控制程式 TW201800183A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016127611A JP2018001296A (ja) 2016-06-28 2016-06-28 研磨装置、研磨方法、及び研磨制御プログラム
JP2016-127611 2016-06-28

Publications (1)

Publication Number Publication Date
TW201800183A true TW201800183A (zh) 2018-01-01

Family

ID=60675235

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106117866A TW201800183A (zh) 2016-06-28 2017-05-31 研磨裝置、研磨方法、及研磨控制程式

Country Status (5)

Country Link
US (1) US20170368661A1 (enrdf_load_stackoverflow)
JP (1) JP2018001296A (enrdf_load_stackoverflow)
KR (1) KR20180002024A (enrdf_load_stackoverflow)
CN (1) CN107538338A (enrdf_load_stackoverflow)
TW (1) TW201800183A (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107363730A (zh) * 2017-09-11 2017-11-21 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 涡流检测装置及系统
KR102708233B1 (ko) * 2019-02-15 2024-09-23 주식회사 케이씨텍 기판 연마 시스템
AU2020253350A1 (en) 2019-03-29 2021-10-28 Saint-Gobain Abrasives, Inc. Performance grinding solutions
MX2021012071A (es) 2019-04-03 2021-12-10 Saint Gobain Abrasives Inc Articulo abrasivo, sistema abrasivo y metodo para usarlos y formarlos.
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法

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JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
JP5365091B2 (ja) * 2008-08-18 2013-12-11 富士通株式会社 メッキ厚算出プログラム、メッキ厚算出装置およびメッキ厚算出方法
AT10301U3 (de) * 2008-09-01 2009-09-15 Avl List Gmbh Verfahren und regelanordnung zur regelung einer regelstrecke mit sich wiederholendem arbeitszyklus
JP5728239B2 (ja) * 2010-03-02 2015-06-03 株式会社荏原製作所 研磨監視方法、研磨方法、研磨監視装置、および研磨装置
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
CN103205665B (zh) * 2012-01-13 2015-05-06 鞍钢股份有限公司 一种连续热镀锌线锌层厚度自动控制方法
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
JP5941763B2 (ja) * 2012-06-15 2016-06-29 株式会社荏原製作所 研磨方法
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
JP2013252613A (ja) * 2013-09-26 2013-12-19 Nikon Corp 終点検出装置および研磨装置
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
KR102326730B1 (ko) * 2014-03-12 2021-11-17 가부시키가이샤 에바라 세이사꾸쇼 막 두께 측정값의 보정 방법, 막 두께 보정기 및 와전류 센서
JP6423600B2 (ja) * 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
US20160074988A1 (en) * 2014-09-11 2016-03-17 Ebara Corporation Processing module, processing apparatus, and processing method
JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
CN104570729A (zh) * 2014-11-24 2015-04-29 东北林业大学 一种改进型的Smith预估控制器
CN104741388B (zh) * 2015-04-15 2016-10-19 东北大学 一种热连轧精轧厚度控制方法
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Also Published As

Publication number Publication date
US20170368661A1 (en) 2017-12-28
KR20180002024A (ko) 2018-01-05
CN107538338A (zh) 2018-01-05
JP2018001296A (ja) 2018-01-11

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