JP2017536049A5 - - Google Patents

Download PDF

Info

Publication number
JP2017536049A5
JP2017536049A5 JP2017527692A JP2017527692A JP2017536049A5 JP 2017536049 A5 JP2017536049 A5 JP 2017536049A5 JP 2017527692 A JP2017527692 A JP 2017527692A JP 2017527692 A JP2017527692 A JP 2017527692A JP 2017536049 A5 JP2017536049 A5 JP 2017536049A5
Authority
JP
Japan
Prior art keywords
conductive layer
thermal conductive
acoustic
low thermal
active area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017527692A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017536049A (ja
JP6668347B2 (ja
Filing date
Publication date
Priority claimed from DE102014117238.8A external-priority patent/DE102014117238B4/de
Application filed filed Critical
Publication of JP2017536049A publication Critical patent/JP2017536049A/ja
Publication of JP2017536049A5 publication Critical patent/JP2017536049A5/ja
Application granted granted Critical
Publication of JP6668347B2 publication Critical patent/JP6668347B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017527692A 2014-11-25 2015-11-10 自己発熱が低減されたbaw共振器、共振器を備える高周波フィルタ、高周波フィルタを備えるデュプレクサ、及びその製造方法 Expired - Fee Related JP6668347B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014117238.8 2014-11-25
DE102014117238.8A DE102014117238B4 (de) 2014-11-25 2014-11-25 BAW-Resonator mit verringerter Eigenerwärmung, HF-Filter mit BAW-Resonator, Duplexer mit HF-Filter und Verfahren zur Herstellung
PCT/EP2015/076197 WO2016083121A1 (de) 2014-11-25 2015-11-10 Baw-resonator mit verringerter eigenerwärmung, hf-filter mit baw-resonator, duplexer mit hf-filter und verfahren zur herstellung

Publications (3)

Publication Number Publication Date
JP2017536049A JP2017536049A (ja) 2017-11-30
JP2017536049A5 true JP2017536049A5 (https=) 2019-07-18
JP6668347B2 JP6668347B2 (ja) 2020-03-18

Family

ID=54478045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017527692A Expired - Fee Related JP6668347B2 (ja) 2014-11-25 2015-11-10 自己発熱が低減されたbaw共振器、共振器を備える高周波フィルタ、高周波フィルタを備えるデュプレクサ、及びその製造方法

Country Status (6)

Country Link
US (1) US10298202B2 (https=)
EP (1) EP3224946A1 (https=)
JP (1) JP6668347B2 (https=)
CN (1) CN107005220B (https=)
DE (1) DE102014117238B4 (https=)
WO (1) WO2016083121A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016111061B4 (de) * 2016-06-16 2018-06-28 Snaptrack, Inc. Akustischer Volumenwellenresonator mit reduzierten Verlusten, HF-Filter mit solchen Resonatoren und Verfahren zur Herstellung solcher Resonatoren
DE102017129160B3 (de) 2017-12-07 2019-01-31 RF360 Europe GmbH Elektroakustisches Resonatorbauelement und Verfahren zu dessen Herstellung
CN111342797B (zh) * 2018-12-18 2025-10-17 天津大学 压电滤波器及具有其的电子设备
DE102018132890B4 (de) * 2018-12-19 2020-08-06 RF360 Europe GmbH Mikroakustische Vorrichtung und Herstellungsverfahren
CN111384907B (zh) * 2018-12-29 2023-07-18 开元通信技术(厦门)有限公司 体声波谐振器及其制作方法、滤波器、双工器
CN111010114B (zh) * 2019-08-09 2023-10-27 天津大学 带吸热与散热结构的体声波谐振器、滤波器和电子设备
US11362638B2 (en) * 2020-08-19 2022-06-14 RF360 Europe GmbH Bulk acoustic wave resonator with a heatsink region and electrical insulator region
EP4200981A1 (en) * 2020-09-14 2023-06-28 Huawei Technologies Co., Ltd. Solidly mounted bulk acoustic wave resonator with frequency tuning by mass loading in acoustic reflector and method of manufacturing thereof
EP4503435A4 (en) 2022-03-31 2026-04-01 Nitto Denko Corp VOLUME ELASTIC WAVE FILTER DEVICE

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10252828B4 (de) * 2002-11-13 2018-07-05 Epcos Ag Mit akustischen Wellen arbeitendes Bauelement und Verfahren zur Herstellung eines Bauelements
JP3889351B2 (ja) * 2002-12-11 2007-03-07 Tdk株式会社 デュプレクサ
JP4624659B2 (ja) * 2003-09-30 2011-02-02 パナソニック株式会社 超音波探触子
US6992400B2 (en) 2004-01-30 2006-01-31 Nokia Corporation Encapsulated electronics device with improved heat dissipation
JP4697517B2 (ja) * 2004-12-16 2011-06-08 株式会社村田製作所 圧電薄膜共振子およびその製造方法
US7378781B2 (en) * 2005-09-07 2008-05-27 Nokia Corporation Acoustic wave resonator with integrated temperature control for oscillator purposes
JP4835238B2 (ja) * 2006-04-06 2011-12-14 ソニー株式会社 共振器、共振器の製造方法および通信装置
JP4975377B2 (ja) * 2006-06-06 2012-07-11 太陽誘電株式会社 弾性境界波素子、共振器およびフィルタ
US7463118B2 (en) * 2006-06-09 2008-12-09 Texas Instruments Incorporated Piezoelectric resonator with an efficient all-dielectric Bragg reflector
JP2008035358A (ja) * 2006-07-31 2008-02-14 Hitachi Media Electoronics Co Ltd 薄膜圧電バルク波共振器及びそれを用いた高周波フィルタ
JP4895323B2 (ja) * 2006-10-27 2012-03-14 宇部興産株式会社 薄膜圧電共振器
WO2008090651A1 (ja) * 2007-01-24 2008-07-31 Murata Manufacturing Co., Ltd. 圧電共振子及び圧電フィルタ
WO2008126473A1 (ja) * 2007-04-11 2008-10-23 Murata Manufacturing Co., Ltd. 圧電薄膜フィルタ
JP5031450B2 (ja) * 2007-06-12 2012-09-19 富士フイルム株式会社 複合圧電材料、超音波探触子、超音波内視鏡、及び、超音波診断装置
US20090026192A1 (en) * 2007-07-27 2009-01-29 Fuhrman Michael D Electric radiant heating element positioning mats and related methods
US20100277034A1 (en) * 2009-03-11 2010-11-04 Rajarishi Sinha Array of baw resonators with mask controlled resonant frequencies
US8610333B2 (en) * 2010-09-24 2013-12-17 Wei Pang Acoustic wave devices
DE102010056562B4 (de) 2010-12-30 2018-10-11 Snaptrack, Inc. Elektroakustisches Bauelement und Verfahren zur Herstellung des elektroakustischen Bauelements
US9299914B2 (en) * 2011-04-01 2016-03-29 Renesas Electronics Corporation Semiconductor device, manufacturing method of the same, and mobile phone
CN102571027A (zh) * 2012-02-27 2012-07-11 浙江瑞能通信科技有限公司 基于全金属布拉格反射层的薄膜体声波谐振器结构
US9118300B2 (en) * 2013-01-15 2015-08-25 Phonon Corporation SAW device with heat efficient temperature controller
DE102014112372B3 (de) * 2014-08-28 2016-02-25 Epcos Ag Filterchip und Verfahren zur Herstellung eines Filterchips

Similar Documents

Publication Publication Date Title
JP2017536049A5 (https=)
US7893793B2 (en) Film bulk acoustic wave resonator and method for manufacturing the same
US11012787B2 (en) Piezoelectric element, piezoelectric microphone, piezoelectric resonator and method for manufacturing piezoelectric element
JP5187597B2 (ja) 弾性波素子
JP5360432B2 (ja) 圧電デバイス
JP4324182B2 (ja) 薄膜バルク音響共振器および表面音響波共振器が集積された集積フィルタおよびその製造方法
JPWO2018163935A1 (ja) ウエハ支持台
JP6668347B2 (ja) 自己発熱が低減されたbaw共振器、共振器を備える高周波フィルタ、高周波フィルタを備えるデュプレクサ、及びその製造方法
JP2013168419A5 (https=)
JP6330912B2 (ja) 弾性波装置
KR20170071586A (ko) 필름 커패시터
WO2021241696A1 (ja) 周波数フィルタ
JP2015073271A5 (https=)
JP2009130478A (ja) 圧電振動子およびその製造方法
JP2015519848A5 (https=)
CN100413111C (zh) 压电振动器以及其制造方法
JP2008079294A (ja) 薄膜弾性波共振器およびその製造方法
JP2001211052A (ja) 圧電共振子
JP2010109526A5 (ja) 振動片、振動子及び振動片の製造方法
CN117792331B (zh) 一种兰姆波谐振器及其制作方法
CN103117724B (zh) 一种压电谐振器
JP2010187196A5 (https=)
CN103312292A (zh) 单片集成多个声表面波滤波器间声电耦合的隔离方法
CN101262210A (zh) 压电振动器以及其制造方法
JP2000350964A (ja) ボルト締めランジュバン型振動子