JP2017533646A - 発振器およびリアルタイムクロック用途のための複数コイルバネmems共振器 - Google Patents
発振器およびリアルタイムクロック用途のための複数コイルバネmems共振器 Download PDFInfo
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2431—Ring resonators
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02259—Driving or detection means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2452—Free-free beam resonators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0857—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration using a particular shape of the suspension spring
- G01P2015/086—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration using a particular shape of the suspension spring using a torsional suspension spring
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
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- H03H2009/02283—Vibrating means
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- H—ELECTRICITY
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/02291—Beams
- H03H2009/02307—Dog-bone-like structure, i.e. the elongated part of the "bone" is doubly clamped
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/0233—Vibrating means comprising perforations
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H9/02338—Suspension means
- H03H2009/02346—Anchors for ring resonators
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
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- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
本願は、2014年10月22日出願の米国仮特許出願第62/067,230号「MULTIPLE COIL SPRING RESONATORS」の優先権を主張する。当該出願は、すべての目的のために参照により本明細書に組み込まれる。
Claims (15)
- MEMS共振器であって、
基板に接続された中央アンカと、
1または複数ペアのコイルバネと外側閉リングとを備えた共振器本体であって、前記コイルバネは、前記中央アンカから前記外側閉リングまで渦巻きパターンで伸び、前記中央アンカは、前記共振器本体の節点にある共振器本体と、
前記外側閉リング上に形成された1または複数の変換器であって、各変換器は、前記外側閉リングと垂直に前記外側閉リングから外向きに伸びるように形成される変換器と、
前記基板に取り付けられるように形成された1セットの駆動電極および1セットの検知電極であって、各変換器は、1つの駆動電極および1つの検知電極に容量結合されている電極と
を備えるMEMS共振器。 - 請求項1に記載のMEMS共振器であって、前記コイルバネのペアの数、前記コイルバネの長さおよび幅、ならびに、前記外側閉リングの重さが、前記MEMS共振器の共振周波数を調節するために選択されるMEMS共振器。
- 請求項2に記載のMEMS共振器であって、さらに、
前記外側閉リングの前記重さを調整するために前記外側閉リング上に形成された構造を備えるMEMS共振器。 - 請求項1に記載のMEMS共振器であって、それぞれの駆動電極およびそれぞれの変換器は、第1ギャップだけ分離され、前記検知電極およびそれぞれの検知電極およびそれぞれの変換器は、第2ギャップだけ分離され、前記第1および第2ギャップの各々は、1μm以下であるMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記共振器本体は、20〜30μmの厚さを有するMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記共振器本体は、単結晶シリコン層および多結晶シリコン層から選択された材料で形成されるMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記基板は、絶縁層を上に形成されたシリコン基層を含むMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記コイルバネの各々は、前記中央アンカの第1位置から始まり、前記中央アンカ周囲一周にわたって渦巻きパターンで伸び、前記外側閉リング上で前記第1位置と整列した位置に終わるMEMS共振器。
- 請求項1に記載のMEMS共振器であって、各ペアのコイルバネは、前記中央アンカ上の両側の点から始まり、前記外側リング上の両側の点まで渦巻きパターンで伸びるMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記コイルバネの各々は、前記中央アンカから時計回りの渦巻きパターンで伸びるMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記コイルバネの各々は、前記中央アンカから反時計回りの渦巻きパターンで伸びるMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記外側閉リングは、リリース穴を形成されており、前記リリース穴は、前記外側閉リングの重さを調整するMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記1または複数の変換器は、リリース穴を形成されており、前記リリース穴は、前記1または複数の変換器の重さを調整するMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記複合バネ構造内のバネユニットセルの数、ならびに、各バネマス部分の前記マスのサイズおよび重さが、前記MEMS共振器の共振周波数を調節するために選択されるMEMS共振器。
- 請求項1に記載のMEMS共振器であって、前記1または複数の変換器は、それぞれの駆動電極によって異なる位相の駆動信号で駆動されるMEMS共振器。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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US201462067206P | 2014-10-22 | 2014-10-22 | |
US201462067230P | 2014-10-22 | 2014-10-22 | |
US62/067,206 | 2014-10-22 | ||
US62/067,230 | 2014-10-22 | ||
US14/883,400 US9866200B2 (en) | 2014-10-22 | 2015-10-14 | Multiple coil spring MEMS resonator |
US14/883,400 | 2015-10-14 | ||
PCT/US2015/055988 WO2016064677A1 (en) | 2014-10-22 | 2015-10-16 | Multiple coil spring mems resonator for oscillators and real-time clock applications |
Publications (2)
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JP2017533646A true JP2017533646A (ja) | 2017-11-09 |
JP6481028B2 JP6481028B2 (ja) | 2019-03-13 |
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JP2017519316A Expired - Fee Related JP6481028B2 (ja) | 2014-10-22 | 2015-10-16 | 発振器およびリアルタイムクロック用途のための複数コイルバネmems共振器 |
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US (1) | US9866200B2 (ja) |
EP (1) | EP3210302A1 (ja) |
JP (1) | JP6481028B2 (ja) |
KR (1) | KR20170056008A (ja) |
CN (1) | CN107251425A (ja) |
TW (1) | TWI581565B (ja) |
WO (1) | WO2016064677A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020036078A (ja) * | 2018-08-27 | 2020-03-05 | 株式会社東芝 | 共振器およびそれを含む装置 |
JPWO2020195386A1 (ja) * | 2019-03-27 | 2020-10-01 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9923545B2 (en) | 2014-10-22 | 2018-03-20 | Microchip Technology Incorporated | Compound spring MEMS resonators for frequency and timing generation |
US9866200B2 (en) * | 2014-10-22 | 2018-01-09 | Microchip Technology Incorporated | Multiple coil spring MEMS resonator |
WO2019032177A1 (en) * | 2017-08-08 | 2019-02-14 | Hrl Laboratories, Llc | VIBRATION GYROSCOPE WITH HIGH QUALITY FACTOR, SILICON-LIKE, FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS), |
US11609653B2 (en) | 2018-07-09 | 2023-03-21 | Hideep Inc. | Touch apparatus and touch detection method thereof |
CN114217093B (zh) * | 2021-06-21 | 2024-04-26 | 西北工业大学 | 一种适用于mems模态局部化传感器的环状耦合系统 |
GB2612183B (en) * | 2021-09-15 | 2024-06-19 | Bae Systems Plc | Resonator, resonator array, vibration control system and method |
CN116470880B (zh) * | 2023-06-20 | 2023-09-19 | 麦斯塔微电子(深圳)有限公司 | 反对称驱动的微机电系统谐振器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5025346A (en) * | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
JPH09145740A (ja) * | 1995-09-22 | 1997-06-06 | Denso Corp | 加速度センサ |
US6686807B1 (en) * | 1999-11-02 | 2004-02-03 | Eta Sa Fabriques D'ebauches | Time base comprising an integrated micromechanical ring resonator |
US20090140356A1 (en) * | 2005-07-21 | 2009-06-04 | Evigia Systems, Inc. | Integrated sensor and circuitry and process therefor |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5767405A (en) | 1992-04-07 | 1998-06-16 | The Charles Stark Draper Laboratory, Inc. | Comb-drive micromechanical tuning fork gyroscope with piezoelectric readout |
AU5869994A (en) | 1992-12-11 | 1994-07-04 | Regents Of The University Of California, The | Microelectromechanical signal processors |
US5491604A (en) | 1992-12-11 | 1996-02-13 | The Regents Of The University Of California | Q-controlled microresonators and tunable electronic filters using such resonators |
US5450751A (en) * | 1993-05-04 | 1995-09-19 | General Motors Corporation | Microstructure for vibratory gyroscope |
US6401536B1 (en) | 2000-02-11 | 2002-06-11 | Motorola, Inc. | Acceleration sensor and method of manufacture |
US6630871B2 (en) * | 2001-09-28 | 2003-10-07 | Intel Corporation | Center-mass-reduced microbridge structures for ultra-high frequency MEM resonator |
FR2832270B1 (fr) | 2001-11-15 | 2006-07-28 | Centre Nat Rech Scient | Procede de reglage de l'ecartement de deux elements mecaniques d'une structure micromecanique sensiblement plane et resonateur electromecanique correspondant |
US7023065B2 (en) * | 2002-08-07 | 2006-04-04 | Georgia Tech Research Corporation | Capacitive resonators and methods of fabrication |
EP1573273B1 (en) | 2002-12-10 | 2015-01-07 | Nxp B.V. | Transducer and electronic device |
DE10310161B4 (de) | 2003-03-07 | 2009-04-09 | Infineon Technologies Ag | Monolithisch integrierte Schaltkreis-Anordnung |
TWI260104B (en) | 2003-07-25 | 2006-08-11 | Sony Corp | MEMS type resonator, method for manufacturing the same, and communication device |
EP1519197B1 (en) | 2003-09-26 | 2007-11-14 | STMicroelectronics S.r.l. | Planar inertial sensor, in particular for portable devices having a stand-by function |
US7102472B1 (en) * | 2004-05-06 | 2006-09-05 | Northrop Grumman Corporation | MEMS device |
US7218193B2 (en) * | 2004-08-16 | 2007-05-15 | Lucent Technologies Inc. | MEMS-based inertial switch |
US7211926B2 (en) | 2005-03-09 | 2007-05-01 | The Regents Of The University Of California | Temperature compensated oscillator including MEMS resonator for frequency control |
US7551043B2 (en) * | 2005-08-29 | 2009-06-23 | The Regents Of The University Of Michigan | Micromechanical structures having a capacitive transducer gap filled with a dielectric and method of making same |
US7495199B2 (en) | 2006-02-10 | 2009-02-24 | Stmicroelectronics, Inc. | MEMS radiometer |
JP2009529820A (ja) | 2006-03-09 | 2009-08-20 | エヌエックスピー ビー ヴィ | 少なくとも1個の共振器モード形状を有するmems共振器 |
JP4844526B2 (ja) * | 2006-10-03 | 2011-12-28 | ソニー株式会社 | 共振器、発振器及び通信装置 |
US7591201B1 (en) | 2007-03-09 | 2009-09-22 | Silicon Clocks, Inc. | MEMS structure having a compensated resonating member |
EP2165416A1 (en) | 2007-06-01 | 2010-03-24 | Nxp B.V. | Mems resonators |
WO2008149298A1 (en) | 2007-06-04 | 2008-12-11 | Nxp B.V. | Pressure gauge |
CN100588119C (zh) * | 2007-09-10 | 2010-02-03 | 北京大学 | 一种平面电容谐振器及其制备方法 |
US7908922B2 (en) * | 2008-01-24 | 2011-03-22 | Delphi Technologies, Inc. | Silicon integrated angular rate sensor |
US8629731B2 (en) | 2008-11-10 | 2014-01-14 | Nxp, B.V. | MEMS resonator |
US20110210801A1 (en) | 2010-02-26 | 2011-09-01 | Imec | Temperature measurement system comprising a resonant mems device |
CN101883307B (zh) * | 2010-05-04 | 2012-12-12 | 瑞声声学科技(深圳)有限公司 | 电容mems麦克风振膜 |
EP2395660B1 (en) | 2010-06-10 | 2013-08-14 | Nxp B.V. | MEMS resonators |
EP2403139A1 (en) * | 2010-07-02 | 2012-01-04 | Nxp B.V. | Resonator |
EP2515436A1 (en) | 2011-04-18 | 2012-10-24 | Nxp B.V. | MEMS resonator and method of controlling the same |
US8570112B2 (en) | 2011-06-09 | 2013-10-29 | Panasonic Corporation | Oscillator with MEMS resonator |
EP2544370B1 (en) | 2011-07-06 | 2020-01-01 | Nxp B.V. | MEMS resonator |
TWI519066B (zh) | 2012-06-28 | 2016-01-21 | 清華大學 | 微機電共振器及其訊號處理方法以及製造方法 |
US9509278B2 (en) | 2013-03-14 | 2016-11-29 | Silicon Laboratories Inc. | Rotational MEMS resonator for oscillator applications |
US9412934B2 (en) | 2013-05-20 | 2016-08-09 | Murata Manufacturing Co., Ltd. | Microelectromechanical resonator |
CN103762956A (zh) * | 2013-12-31 | 2014-04-30 | 中国科学院半导体研究所 | 一种频率可切换的微机械谐振器及其制备方法 |
US9866200B2 (en) * | 2014-10-22 | 2018-01-09 | Microchip Technology Incorporated | Multiple coil spring MEMS resonator |
US9923545B2 (en) * | 2014-10-22 | 2018-03-20 | Microchip Technology Incorporated | Compound spring MEMS resonators for frequency and timing generation |
US9584092B2 (en) | 2015-04-14 | 2017-02-28 | International Business Machines Corporation | Mechanical resonator with a spring-mass system comprising a phase-change material |
-
2015
- 2015-10-14 US US14/883,400 patent/US9866200B2/en active Active
- 2015-10-16 KR KR1020177010412A patent/KR20170056008A/ko active IP Right Grant
- 2015-10-16 JP JP2017519316A patent/JP6481028B2/ja not_active Expired - Fee Related
- 2015-10-16 WO PCT/US2015/055988 patent/WO2016064677A1/en active Application Filing
- 2015-10-16 EP EP15788283.8A patent/EP3210302A1/en not_active Withdrawn
- 2015-10-16 CN CN201580055505.0A patent/CN107251425A/zh active Pending
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5025346A (en) * | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
JPH09145740A (ja) * | 1995-09-22 | 1997-06-06 | Denso Corp | 加速度センサ |
US6686807B1 (en) * | 1999-11-02 | 2004-02-03 | Eta Sa Fabriques D'ebauches | Time base comprising an integrated micromechanical ring resonator |
US20090140356A1 (en) * | 2005-07-21 | 2009-06-04 | Evigia Systems, Inc. | Integrated sensor and circuitry and process therefor |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020036078A (ja) * | 2018-08-27 | 2020-03-05 | 株式会社東芝 | 共振器およびそれを含む装置 |
US10892732B2 (en) | 2018-08-27 | 2021-01-12 | Kabushiki Kaisha Toshiba | Resonator and device including the same |
JPWO2020195386A1 (ja) * | 2019-03-27 | 2020-10-01 | ||
JP7403069B2 (ja) | 2019-03-27 | 2023-12-22 | パナソニックIpマネジメント株式会社 | 物理量センサ |
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TWI581565B (zh) | 2017-05-01 |
KR20170056008A (ko) | 2017-05-22 |
TW201626715A (zh) | 2016-07-16 |
JP6481028B2 (ja) | 2019-03-13 |
EP3210302A1 (en) | 2017-08-30 |
CN107251425A (zh) | 2017-10-13 |
US9866200B2 (en) | 2018-01-09 |
WO2016064677A1 (en) | 2016-04-28 |
US20160118955A1 (en) | 2016-04-28 |
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