JP2017529572A - 基板レスフレキシブルディスプレイおよびその製造方法 - Google Patents
基板レスフレキシブルディスプレイおよびその製造方法 Download PDFInfo
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- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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Abstract
Description
Claims (26)
- 基板レス表示装置であって、
複数の無機バリア膜および複数のポリマー膜を含み、前記無機バリア膜と前記ポリマー膜とが交互に配置されたバリアスタックと、
前記バリアスタック上に配置された薄膜トランジスタ(TFT)デバイス層と、
前記TFTデバイス層上に配置された表示媒体層と、
前記表示媒体層上に配置された封止層と
を備え、
前記無機バリア膜のうちの1つの無機バリア膜が、前記封止層の反対側の前記バリアスタックの最も外側に配置されており、前記表示装置が基板レスである、基板レス表示装置。 - 前記無機バリア膜が、金属、金属酸化物、金属窒化物、スピンオンガラス、スピンオン誘電体、酸化ケイ素、窒化ケイ素または炭化ケイ素のうちの1つもしくは複数を含む、請求項1に記載の表示装置。
- 前記ポリマー膜が、ポリイミド、ポリノルボルネン、ポリアミド、ポリエーテルスルホン、ポリエーテルイミド、ポリカーボネート、ポリエチレンナフタレート、ポリエステル、アクリルポリマーまたはナイロンのうちの1つもしくは複数を含む、請求項1に記載の表示装置。
- 前記無機バリア膜の厚さが、10nm〜10μmの範囲にある、請求項1に記載の表示装置。
- 前記ポリマー膜の厚さが、100nm〜100μmの範囲にある、請求項1に記載の表示装置。
- 前記表示媒体層が、有機発光ダイオードデバイス層、液晶層または電気泳動インク層のうちの1つを含む、請求項1に記載の表示装置。
- 前記TFTデバイス層が、前記無機バリア膜のうちの1つの無機バリア膜上に配置された、請求項1に記載の表示装置。
- 前記封止層の反対側の前記バリアスタックの最も外側に配置された前記無機バリア膜上に配置された犠牲層または接着制御層をさらに備える、請求項1に記載の表示装置。
- 基板レス表示装置を製造する方法であって、
担体上にバリアスタックを形成すること
を含み、前記バリアスタックが、複数の無機バリア膜および複数のポリマー膜を含み、前記無機バリア膜と前記ポリマー膜とが交互に配置され、前記バリアスタックの前記担体に隣接した膜が、前記無機バリア膜のうちの1つの無機バリア膜であり、前記方法がさらに、
前記バリアスタック上に薄膜トランジスタ(TFT)デバイス層を形成すること、
前記TFTデバイス層上に表示媒体層を形成すること、
前記表示媒体層上に封止層を形成すること、ならびに
前記バリアスタックから前記担体を除去すること
を含む方法。 - 前記担体と前記バリアスタックとの間に犠牲層を形成すること
をさらに含み、
前記バリアスタックから前記担体を除去することが、前記犠牲層の少なくとも一部分を除去することを含む、
請求項9に記載の方法。 - 前記担体と前記バリアスタックとの間に接着制御層を形成すること
をさらに含み、
前記接着制御層が、有機シラン化合物、ヘキサメチルジシラザン(HMDS)もしくはポリマーの層、またはこれらの組合せの層を含む、
請求項9に記載の方法。 - 前記ポリマー膜が、約300〜450℃の温度で形成される、請求項9に記載の方法。
- 前記TFTデバイス層が、300℃よりも高い温度で形成される、請求項12に記載の方法。
- 基板レス表示装置であって、
複数の無機バリア膜および複数のポリマー膜を含み、前記無機バリア膜と前記ポリマー膜とが交互に配置されたバリアスタックであって、前記ポリマー膜のうちの第1のポリマー膜が、前記バリアスタックの最も下の膜として配置されたバリアスタックと、
前記バリアスタック上に配置された薄膜トランジスタ(TFT)デバイス層と、
前記TFTデバイス層上に配置された表示媒体層と、
前記表示媒体層上に配置された封止層と
を備え、
前記表示装置が基板レスである、基板レス表示装置。 - 前記無機バリア膜が、金属、金属酸化物、金属窒化物、スピンオンガラス、スピンオン誘電体、酸化ケイ素、窒化ケイ素または炭化ケイ素のうちの1つもしくは複数を含む、請求項14に記載の表示装置。
- 前記ポリマー膜が、ポリイミド、ポリノルボルネン、ポリアミド、ポリエーテルスルホン、ポリエーテルイミド、ポリカーボネート、ポリエチレンナフタレート、ポリエステルまたはナイロンのうちの1つもしくは複数を含む、請求項14に記載の表示装置。
- 前記ポリマー膜のうちの前記第1のポリマー膜の前記無機バリア膜がある側とは反対の側に配置された犠牲層または接着制御層をさらに備える、請求項14に記載の表示装置。
- 前記無機バリア膜の厚さが、10nm〜10μmの範囲にある、請求項14に記載の表示装置。
- 前記ポリマー膜の厚さが、100nm〜100μmの範囲にある、請求項14に記載の表示装置。
- 前記表示媒体層が、有機発光ダイオードデバイス層、液晶層または電気泳動インク層のうちの1つを含む、請求項14に記載の表示装置。
- 前記TFTデバイス層が、前記無機バリア膜のうちの1つの無機バリア膜上に配置された、請求項14に記載の表示装置。
- 基板レス表示装置を製造する方法であって、
バリアスタックを形成すること
を含み、前記バリアスタックが、複数の無機バリア膜および複数のポリマー膜を含み、前記無機バリア膜と前記ポリマー膜とが交互に配置され、前記ポリマー膜のうちの第1のポリマー膜が、前記バリアスタックの最も下の膜として配置され、前記方法がさらに、
前記バリアスタック上に薄膜トランジスタ(TFT)デバイス層を形成すること、
前記TFTデバイス層上に表示媒体層を形成すること、
前記表示媒体層上に封止層を形成すること、ならびに
前記バリアスタックから前記担体を除去すること
を含む方法。 - 前記担体と前記バリアスタックの間に犠牲層を形成すること
をさらに含み、
前記バリアスタックから前記担体を除去することが、前記犠牲層の少なくとも一部分を除去することを含む、
請求項22に記載の方法。 - 前記担体と前記バリアスタックの間に接着制御層を形成すること
をさらに含み、
接着制御層が、有機シラン化合物、ヘキサメチルジシラザン(HMDS)もしくはポリマーの層、またはこれらの組合せの層を含む、
請求項22に記載の方法。 - 前記ポリマー膜が、約300〜450℃の温度で形成される、請求項22に記載の方法。
- 前記TFTデバイス層が、300℃よりも高い温度で形成される、請求項25に記載の方法。
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US14/507,608 US9594287B2 (en) | 2014-08-24 | 2014-10-06 | Substrate-less flexible display and method of manufacturing the same |
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