JP2017528908A5 - - Google Patents

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Publication number
JP2017528908A5
JP2017528908A5 JP2017505210A JP2017505210A JP2017528908A5 JP 2017528908 A5 JP2017528908 A5 JP 2017528908A5 JP 2017505210 A JP2017505210 A JP 2017505210A JP 2017505210 A JP2017505210 A JP 2017505210A JP 2017528908 A5 JP2017528908 A5 JP 2017528908A5
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JP
Japan
Prior art keywords
integrated circuit
flexible integrated
flexible
bonding wire
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017505210A
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English (en)
Japanese (ja)
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JP2017528908A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/051210 external-priority patent/WO2016048888A1/en
Publication of JP2017528908A publication Critical patent/JP2017528908A/ja
Publication of JP2017528908A5 publication Critical patent/JP2017528908A5/ja
Pending legal-status Critical Current

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JP2017505210A 2014-09-22 2015-09-21 伸張かつ屈曲可能な相互接続として機能するボンディング・ワイヤを、整形しかつルーピングするための方法および装置 Pending JP2017528908A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462053641P 2014-09-22 2014-09-22
US62/053,641 2014-09-22
PCT/US2015/051210 WO2016048888A1 (en) 2014-09-22 2015-09-21 Methods and apparatuses for shaping and looping bonding wires that serve as stretchable and bendable interconnects

Publications (2)

Publication Number Publication Date
JP2017528908A JP2017528908A (ja) 2017-09-28
JP2017528908A5 true JP2017528908A5 (enExample) 2018-11-01

Family

ID=55526453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017505210A Pending JP2017528908A (ja) 2014-09-22 2015-09-21 伸張かつ屈曲可能な相互接続として機能するボンディング・ワイヤを、整形しかつルーピングするための方法および装置

Country Status (7)

Country Link
US (1) US20160086909A1 (enExample)
EP (1) EP3198638A4 (enExample)
JP (1) JP2017528908A (enExample)
KR (1) KR20170058968A (enExample)
CN (1) CN107004665A (enExample)
CA (1) CA2957044A1 (enExample)
WO (1) WO2016048888A1 (enExample)

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US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
EP2906960A4 (en) 2012-10-09 2016-06-15 Mc10 Inc CONFORMING ELECTRONICS INTEGRATED WITH A DRESS
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
CA2930740A1 (en) 2013-11-22 2015-05-28 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
EP3092661A4 (en) 2014-01-06 2017-09-27 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
CA2940539C (en) 2014-03-04 2022-10-04 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
USD781270S1 (en) * 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
WO2017015000A1 (en) 2015-07-17 2017-01-26 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
WO2017059215A1 (en) 2015-10-01 2017-04-06 Mc10, Inc. Method and system for interacting with a virtual environment
EP3359031A4 (en) 2015-10-05 2019-05-22 Mc10, Inc. METHOD AND SYSTEM FOR NEUROMODULATION AND STIMULATION
CN115175014A (zh) 2016-02-22 2022-10-11 美谛达解决方案公司 贴身传感器系统
US10673280B2 (en) 2016-02-22 2020-06-02 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
CN109310340A (zh) 2016-04-19 2019-02-05 Mc10股份有限公司 用于测量汗液的方法和系统
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
DE102016224631B4 (de) * 2016-12-09 2020-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch leitende Verbindung zwischen mindestens zwei elektrischen Komponenten an einem mit elektronischen und/oder elektrischen Bauelementen bestücktem Träger, die mit einem Bonddraht ausgebildet ist
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
WO2022169407A1 (en) * 2021-02-05 2022-08-11 Heraeus Materials Singapore Pte. Ltd. Coated wire
WO2022259328A1 (ja) * 2021-06-07 2022-12-15 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法

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