JP2017523612A5 - - Google Patents

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Publication number
JP2017523612A5
JP2017523612A5 JP2017503988A JP2017503988A JP2017523612A5 JP 2017523612 A5 JP2017523612 A5 JP 2017523612A5 JP 2017503988 A JP2017503988 A JP 2017503988A JP 2017503988 A JP2017503988 A JP 2017503988A JP 2017523612 A5 JP2017523612 A5 JP 2017523612A5
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JP
Japan
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image sensor
adhesive
region
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JP2017503988A
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English (en)
Japanese (ja)
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JP6689817B2 (ja
JP2017523612A (ja
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Priority claimed from PCT/SG2015/050224 external-priority patent/WO2016013977A1/en
Publication of JP2017523612A publication Critical patent/JP2017523612A/ja
Publication of JP2017523612A5 publication Critical patent/JP2017523612A5/ja
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JP2017503988A 2014-07-25 2015-07-22 互いに光学的に分離された領域を有するイメージセンサを含む光電子モジュール Active JP6689817B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462028893P 2014-07-25 2014-07-25
US62/028,893 2014-07-25
US201462053294P 2014-09-22 2014-09-22
US62/053,294 2014-09-22
US201562156416P 2015-05-04 2015-05-04
US62/156,416 2015-05-04
PCT/SG2015/050224 WO2016013977A1 (en) 2014-07-25 2015-07-22 Optoelectronic modules including an image sensor having regions optically separated from one another

Publications (3)

Publication Number Publication Date
JP2017523612A JP2017523612A (ja) 2017-08-17
JP2017523612A5 true JP2017523612A5 (https=) 2018-08-30
JP6689817B2 JP6689817B2 (ja) 2020-04-28

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JP2017503988A Active JP6689817B2 (ja) 2014-07-25 2015-07-22 互いに光学的に分離された領域を有するイメージセンサを含む光電子モジュール

Country Status (8)

Country Link
US (1) US10199412B2 (https=)
EP (1) EP3172767B1 (https=)
JP (1) JP6689817B2 (https=)
KR (1) KR102455919B1 (https=)
CN (1) CN106575660B (https=)
SG (1) SG11201700235QA (https=)
TW (1) TWI685126B (https=)
WO (1) WO2016013977A1 (https=)

Families Citing this family (9)

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CN109155258B (zh) 2016-04-08 2022-04-26 赫普塔冈微光有限公司 具有孔径的薄光电模块及其制造
CN114137672A (zh) * 2016-04-15 2022-03-04 赫普塔冈微光有限公司 具有对准间隔件的光电子模块和用于组装所述光电子模块的方法
CN107786784B (zh) * 2016-08-29 2020-06-30 光宝电子(广州)有限公司 镜头组件及其制作方法
JP6620176B2 (ja) * 2018-01-29 2019-12-11 アオイ電子株式会社 半導体装置
US12169315B2 (en) 2018-03-07 2024-12-17 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules and wafer-level methods for manufacturing the same
EP3620813A1 (en) * 2018-09-04 2020-03-11 ams AG Optical sensor arrangement, device and method of manufacturing an optical sensor arrangement
CN111463293B (zh) * 2019-01-17 2022-05-17 光宝光电(常州)有限公司 支架结构、光传感器结构及制造光传感器结构的方法
CN114339000B (zh) * 2021-12-31 2024-04-23 昆山丘钛微电子科技股份有限公司 一种摄像头模组及制备方法
WO2025012223A1 (en) * 2023-07-10 2025-01-16 Sensibel As Optical readout module

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JP3880278B2 (ja) * 2000-03-10 2007-02-14 オリンパス株式会社 固体撮像装置及びその製造方法
TW513558B (en) 2000-10-27 2002-12-11 Fuji Electric Co Ltd Range finder for automatic focusing
JP2002350129A (ja) 2001-05-23 2002-12-04 Canon Inc 計測装置
JP4016275B2 (ja) 2003-06-25 2007-12-05 富士電機デバイステクノロジー株式会社 測距装置
EP1812968B1 (en) * 2004-08-25 2019-01-16 Callahan Cellular L.L.C. Apparatus for multiple camera devices and method of operating same
JP2007110588A (ja) * 2005-10-17 2007-04-26 Funai Electric Co Ltd 複眼撮像装置
JP4492533B2 (ja) * 2005-12-27 2010-06-30 船井電機株式会社 複眼撮像装置
KR100809277B1 (ko) 2006-07-05 2008-03-03 삼성전기주식회사 어레이 렌즈를 갖는 카메라 모듈
JP2010021283A (ja) * 2008-07-09 2010-01-28 Panasonic Corp 固体撮像装置およびその製造方法
TWM363080U (en) * 2009-01-21 2009-08-11 Pixart Imaging Inc Packaging structure
DE102010041937A1 (de) 2010-10-04 2012-04-05 Robert Bosch Gmbh Optische Abschirm-Vorrichtung zum Trennen von optischen Pfaden
JP5857399B2 (ja) 2010-11-12 2016-02-10 ソニー株式会社 固体撮像装置及び電子機器
CN103620779B (zh) 2011-07-19 2016-12-28 赫普塔冈微光有限公司 光电模块及其制造方法
US8492181B2 (en) * 2011-12-22 2013-07-23 Stmicroelectronics Pte Ltd. Embedded wafer level optical package structure and manufacturing method
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US9543354B2 (en) * 2013-07-30 2017-01-10 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
US9094593B2 (en) * 2013-07-30 2015-07-28 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules

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