JP2017522722A - 湾曲したリードフレーム上にマウントされたled - Google Patents
湾曲したリードフレーム上にマウントされたled Download PDFInfo
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- JP2017522722A JP2017522722A JP2016569824A JP2016569824A JP2017522722A JP 2017522722 A JP2017522722 A JP 2017522722A JP 2016569824 A JP2016569824 A JP 2016569824A JP 2016569824 A JP2016569824 A JP 2016569824A JP 2017522722 A JP2017522722 A JP 2017522722A
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- lead frame
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- led
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- frame strip
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- 239000010959 steel Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
- B60Q1/34—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating change of drive direction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/15—Strips of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
- F21S43/195—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/26—Refractors, transparent cover plates, light guides or filters not provided in groups F21S43/235 - F21S43/255
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2103/00—Exterior vehicle lighting devices for signalling purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2103/00—Exterior vehicle lighting devices for signalling purposes
- F21W2103/35—Brake lights
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (15)
- 複数のベアの発光ダイオード(LED)ダイであり、当該LEDダイは少なくとも1つの底部金属パッドを有し、当該LEDダイは光を放つ頂面を有する、LEDダイと、
金属リードフレームストリップであり、前記LEDダイの各々の前記底部金属パッドが当該リードフレームストリップの第1の表面に熱的に取り付けられ、前記LEDダイの電極が、前記LEDダイが電気的に相互接続されるように、当該リードフレームストリップに電気的に接続される、リードフレームストリップと、
前記LEDダイを覆って形成されたレンズであり、当該レンズはレンズ材料で形成されており、前記レンズ材料が前記LEDダイと前記リードフレームストリップの一部とを封入している、レンズと、
前記金属リードフレームストリップのための支持体と
を有し、
前記複数のLEDダイのうちの少なくとも一部のLEDダイの頂面が相異なる平面内にあるように、前記リードフレームストリップが、前記支持体によって支持されながら曲げられている、
発光構造体。 - 前記支持体は、前記レンズを覆わずに前記リードフレームストリップの少なくとも一部を覆って成形されたプラスチックボディを有し、前記プラスチックボディは、電源への接続のための金属リードを含んでいる、請求項1に記載の構造体。
- 前記支持体が前記リードフレームストリップの湾曲を定める、請求項1に記載の構造体。
- 前記支持体は、前記リードフレームストリップの一端を受け入れる第1のスロットと、前記リードフレームストリップの反対端を受け入れる第2のスロットとを有する事前成形された支持体を有し、前記支持体は、電源への接続のための金属リードを含んでおり、前記金属リードは、前記第1のスロット及び前記第2のスロットに電気的に結合されている、請求項1に記載の構造体。
- 前記支持体は更に、前記第1のスロットと前記第2のスロットとの間に、前記リードフレームストリップを支持して前記リードフレームストリップの湾曲を定める領域を有する、請求項4に記載の構造体。
- 前記支持体は曲げられない、請求項1に記載の構造体。
- 前記複数のLEDダイは少なくとも直列に接続されている、請求項1に記載の構造体。
- 前記複数のLEDダイは少なくとも4つのLEDダイを有する、請求項1に記載の構造体。
- 前記支持体が、前記リードフレームストリップに継続的な力を供給して、前記リードフレームストリップの湾曲を維持する、請求項1に記載の構造体。
- 前記リードフレームストリップは、少なくとも10°の角度で湾曲されている、請求項1に記載の構造体。
- 前記LEDダイは、曲げられた前記リードフレームストリップの弧に配置されている、請求項1に記載の構造体。
- 前記リードフレームストリップの一部が、前記複数のLEDダイ間の領域で曲げられるよう、前記レンズ材料によって覆われていない、請求項1に記載の構造体。
- 自動車のリアのシグナルランプを形成する請求項1に記載の構造体。
- 曲げられた前記リードフレームストリップによって支持されながらの前記LEDダイの光放射プロファイルが180°よりも大きい、請求項1に記載の構造体。
- 前記複数のLEDダイは直列に接続されており、当該構造体にわたる電圧降下が約12ボルトである、請求項1に記載の構造体。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNPCT/CN2014/000547 | 2014-05-30 | ||
CN2014000547 | 2014-05-30 | ||
EP14181105 | 2014-08-15 | ||
EP14181105.9 | 2014-08-15 | ||
PCT/EP2015/060823 WO2015180978A1 (en) | 2014-05-30 | 2015-05-18 | Leds mounted on curved lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017522722A true JP2017522722A (ja) | 2017-08-10 |
JP6609574B2 JP6609574B2 (ja) | 2019-11-20 |
Family
ID=53175529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016569824A Active JP6609574B2 (ja) | 2014-05-30 | 2015-05-18 | 湾曲したリードフレーム上にマウントされたled |
Country Status (6)
Country | Link |
---|---|
US (1) | US10168015B2 (ja) |
EP (1) | EP3152477B1 (ja) |
JP (1) | JP6609574B2 (ja) |
KR (1) | KR102363258B1 (ja) |
CN (1) | CN106461169B (ja) |
WO (1) | WO2015180978A1 (ja) |
Cited By (1)
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JP2020150229A (ja) * | 2019-03-15 | 2020-09-17 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
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US10170455B2 (en) * | 2015-09-04 | 2019-01-01 | PlayNitride Inc. | Light emitting device with buffer pads |
US10082282B2 (en) | 2016-06-14 | 2018-09-25 | GM Global Technology Operations LLC | Light assembly with LED string |
WO2018011014A1 (en) * | 2016-07-14 | 2018-01-18 | Lumileds Holding B.V. | Modular lighting devices |
EP3555520B1 (en) | 2016-12-13 | 2023-04-12 | Lumileds LLC | Arrangement of leds on a leadframe |
DE102016125022A1 (de) * | 2016-12-20 | 2018-06-21 | Osram Opto Semiconductors Gmbh | Herstellung von leuchtvorrichtungen |
US10141265B2 (en) * | 2016-12-29 | 2018-11-27 | Intel IP Corporation | Bent-bridge semiconductive apparatus |
JP7092465B2 (ja) * | 2017-04-21 | 2022-06-28 | 株式会社小糸製作所 | 車両用灯具 |
KR101982778B1 (ko) * | 2017-06-30 | 2019-05-27 | 엘지전자 주식회사 | 차량용 램프 및 차량 |
CN207246837U (zh) * | 2017-09-07 | 2018-04-17 | 李立新 | 一种全罩大角度发光led灯泡 |
USD863118S1 (en) | 2018-01-15 | 2019-10-15 | Steven Isaacson | Illuminable motorcycle engine guard |
USD863120S1 (en) | 2018-01-15 | 2019-10-15 | Steven Isaacson | Illuminable motorcycle engine guard |
USD863119S1 (en) | 2018-01-15 | 2019-10-15 | Steven Isaacson | Illuminable motorcycle engine guard |
CN111615471A (zh) * | 2018-01-18 | 2020-09-01 | 索尤若驱动有限及两合公司 | 具有至少一个模块的移动设备和用于运行移动设备的方法 |
DE202018105898U1 (de) * | 2018-10-16 | 2018-10-22 | Ledvance Gmbh | Beleuchtungsvorrichtung mit Leadframe |
CN110764310B (zh) * | 2019-10-31 | 2022-03-08 | 厦门天马微电子有限公司 | 一种曲面背光模组和曲面显示装置 |
EP4088059A4 (en) * | 2020-01-09 | 2024-02-07 | Electronic Controls Company | FLEXIBLE DIRECTIONAL VEHICLE WARNING LIGHT |
USD1010179S1 (en) | 2020-01-09 | 2024-01-02 | Electronic Controls Company | Flexible directional vehicle warning light |
DE112021002614A5 (de) * | 2020-05-04 | 2023-02-16 | Ams-Osram International Gmbh | Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements |
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- 2015-05-18 JP JP2016569824A patent/JP6609574B2/ja active Active
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CN111697121A (zh) * | 2019-03-15 | 2020-09-22 | 日亚化学工业株式会社 | 发光装置及其制造方法 |
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WO2015180978A1 (en) | 2015-12-03 |
CN106461169A (zh) | 2017-02-22 |
KR20170012472A (ko) | 2017-02-02 |
KR102363258B1 (ko) | 2022-02-16 |
EP3152477B1 (en) | 2020-03-18 |
US20170241611A1 (en) | 2017-08-24 |
US10168015B2 (en) | 2019-01-01 |
EP3152477A1 (en) | 2017-04-12 |
JP6609574B2 (ja) | 2019-11-20 |
CN106461169B (zh) | 2019-12-31 |
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