JP2017521861A - 放熱装置 - Google Patents
放熱装置 Download PDFInfo
- Publication number
- JP2017521861A JP2017521861A JP2016574121A JP2016574121A JP2017521861A JP 2017521861 A JP2017521861 A JP 2017521861A JP 2016574121 A JP2016574121 A JP 2016574121A JP 2016574121 A JP2016574121 A JP 2016574121A JP 2017521861 A JP2017521861 A JP 2017521861A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiating
- inset
- heat radiation
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 76
- 230000005855 radiation Effects 0.000 claims description 137
- 230000037303 wrinkles Effects 0.000 claims description 8
- 230000005484 gravity Effects 0.000 description 24
- 238000009826 distribution Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- -1 Electricity Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
- B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
110 プレート
121,122,123,124 放熱フィン
131,132,133,134 放熱領域部
140 インセット部
170 発熱モジュール
Claims (10)
- 放熱プレートと、
前記放熱プレートに備わって互いに異なる角度の放熱フィンが取り付けられている放熱領域部と、
を含むことを特徴とする放熱装置。 - 前記放熱領域部と前記放熱領域部に隣接した放熱領域部との間にインセット部を含むことを特徴とする請求項1に記載の放熱装置。
- 前記放熱領域部に形成される前記放熱フィンと、前記放熱領域部に隣接した放熱領域部に設けられる前記放熱フィンとは、前記インセット部を中心に‘V’字状を有するように具備されることを特徴とする請求項2に記載の放熱装置。
- 前記インセット部は、少なくとも2個のインセットラインを含み、
前記インセットラインは、相互に交差され、あるいは折り曲げられるように形成されていることを特徴とする請求項2に記載の放熱装置。 - 前記インセット部は、前記放熱プレート上に‘+’字状に交差形成され、
前記放熱領域部は、前記インセットラインを中心に第1の放熱領域、第2の放熱領域、第3の放熱領域、及び第4の放熱領域に区画されていることを特徴とする請求項4に記載の放熱装置。 - 前記第1の放熱領域、前記第2の放熱領域、前記第3の放熱領域、及び前記第4の放熱領域上の第1の放熱フィン、第2の放熱フィン、第3の放熱フィン、及び第4の放熱フィンは、前記インセットラインの中央部を中心に‘X’字状の異なる角度を有することを特徴とする請求項5に記載の放熱装置。
- 前記第1の放熱領域、前記第2の放熱領域、前記第3の放熱領域、及び前記第4の放熱領域上の第1の放熱フィン、第2の放熱フィン、第3の放熱フィン、及び第4の放熱フィンは、前記インセットラインの中央部を中心に菱形状の異なる角度を有することを特徴とする請求項5に記載の放熱装置。
- 前記インセット部は、前記放熱プレート上に‘X’字状に交差形成され、
前記放熱領域部は、前記インセットラインを中心に第1の放熱領域、第2の放熱領域、第3の放熱領域、及び第4の放熱領域に区画され、
前記第1の放熱領域、前記第2の放熱領域、前記第3の放熱領域、及び前記第4の放熱領域上の第1の放熱フィン、第2の放熱フィン、第3の放熱フィン、及び第4の放熱フィンは、前記インセットラインの中央部を中心に‘+’字状の異なる角度を有することを特徴とする請求項4に記載の放熱装置。 - 前記放熱フィンは、乱流を形成するようにしわ部、折曲部、突出部、開口部のうち少なくとも一つを含むことを特徴とする請求項1に記載の放熱装置。
- 隣接した前記放熱領域部は、インセット部を中心として対称に具備されることを特徴とする請求項1に記載の放熱装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140074424A KR20150145084A (ko) | 2014-06-18 | 2014-06-18 | 방열 장치 |
KR10-2014-0074424 | 2014-06-18 | ||
PCT/KR2015/006216 WO2015194897A1 (ko) | 2014-06-18 | 2015-06-18 | 방열 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017521861A true JP2017521861A (ja) | 2017-08-03 |
JP6526067B2 JP6526067B2 (ja) | 2019-06-05 |
Family
ID=54935805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016574121A Active JP6526067B2 (ja) | 2014-06-18 | 2015-06-18 | 放熱装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20170097196A1 (ja) |
JP (1) | JP6526067B2 (ja) |
KR (1) | KR20150145084A (ja) |
CN (1) | CN206371029U (ja) |
WO (1) | WO2015194897A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022547443A (ja) * | 2019-08-30 | 2022-11-14 | 華為技術有限公司 | 放熱器、電子デバイス、および車両 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10692798B2 (en) * | 2014-04-10 | 2020-06-23 | Advanced Thermal Solutions, Inc. | Multiple flow entrance heat sink |
CN107105595A (zh) * | 2016-02-19 | 2017-08-29 | 恩佐科技股份有限公司 | 利用散热体排列达低风压需求、低噪音、高效能的散热器 |
CN106255384B (zh) * | 2016-08-22 | 2019-06-04 | 山东久久星新能源车辆科技有限公司 | 一种散热装置及应用该散热装置的电瓶车 |
CN108303837B (zh) * | 2017-01-12 | 2020-12-18 | 中强光电股份有限公司 | 投影装置、散热模块及散热鳍片组 |
CN108105088A (zh) * | 2018-01-30 | 2018-06-01 | 重庆大学 | 一种无油涡旋压缩机的混合型涡盘散热结构 |
EP3780260B1 (en) * | 2018-04-11 | 2024-10-23 | KMW Inc. | Multiple input and multiple output antenna apparatus |
WO2019227393A1 (zh) * | 2018-05-31 | 2019-12-05 | 深圳市大疆创新科技有限公司 | 散热系统及摄影摄像设备 |
JP7021013B2 (ja) * | 2018-06-25 | 2022-02-16 | トヨタ自動車株式会社 | 冷却器 |
JP7118788B2 (ja) * | 2018-07-19 | 2022-08-16 | 株式会社フジクラ | コールドプレート及びコールドプレートの製造方法 |
CN208834080U (zh) | 2018-07-23 | 2019-05-07 | 中强光电股份有限公司 | 投影装置、散热模块及散热鳍片 |
US11011452B2 (en) * | 2018-11-29 | 2021-05-18 | Micron Technology, Inc. | Heat spreaders for semiconductor devices, and associated systems and methods |
USD971192S1 (en) | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
USD976242S1 (en) | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
USD971900S1 (en) | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
CN112698541A (zh) * | 2019-10-22 | 2021-04-23 | 中强光电股份有限公司 | 散热模块及使用其的投影装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888301A (ja) * | 1994-09-19 | 1996-04-02 | Mitsubishi Electric Corp | 放熱フィン |
JP3076220U (ja) * | 2000-09-08 | 2001-03-30 | 奇▲宏▼股▲ふん▼有限公司 | ヒートシンクの構造 |
JP2005529489A (ja) * | 2002-06-06 | 2005-09-29 | レイセオン カンパニー | 回路部材の冷却方法及び装置 |
JP2006330680A (ja) * | 2005-05-25 | 2006-12-07 | Samsung Sdi Co Ltd | プラズマディスプレイ装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3313339A (en) * | 1965-03-15 | 1967-04-11 | Wakefield Engineering Company | Heat transfer apparatus |
US4587595A (en) * | 1983-09-06 | 1986-05-06 | Digital Equipment Corporation | Heat sink arrangement with clip-on portion |
US5582240A (en) * | 1994-09-19 | 1996-12-10 | Motorola, Inc. | Pneumatically coupled heat sink assembly |
JP3552559B2 (ja) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | 発熱体冷却装置 |
US6418020B1 (en) * | 2001-03-30 | 2002-07-09 | Advanced Thermal Technologies | Heat dissipation device with ribbed fin plates |
CN1578614B (zh) * | 2003-06-30 | 2010-04-21 | 山洋电气株式会社 | 轴流风扇装置和发热体冷却装置 |
US7423877B2 (en) * | 2006-09-01 | 2008-09-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080128110A1 (en) * | 2006-11-30 | 2008-06-05 | Foxconn Technology Co., Ltd. | Heat sink assembly having a fan mounting device |
US20090129019A1 (en) * | 2007-11-15 | 2009-05-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with fan holder |
TWI334531B (en) * | 2007-12-05 | 2010-12-11 | Wistron Corp | Heat sink and electronic apparatus using the same |
TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
-
2014
- 2014-06-18 KR KR1020140074424A patent/KR20150145084A/ko active Application Filing
-
2015
- 2015-06-18 CN CN201590000741.8U patent/CN206371029U/zh active Active
- 2015-06-18 JP JP2016574121A patent/JP6526067B2/ja active Active
- 2015-06-18 WO PCT/KR2015/006216 patent/WO2015194897A1/ko active Application Filing
-
2016
- 2016-12-19 US US15/383,476 patent/US20170097196A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888301A (ja) * | 1994-09-19 | 1996-04-02 | Mitsubishi Electric Corp | 放熱フィン |
JP3076220U (ja) * | 2000-09-08 | 2001-03-30 | 奇▲宏▼股▲ふん▼有限公司 | ヒートシンクの構造 |
JP2005529489A (ja) * | 2002-06-06 | 2005-09-29 | レイセオン カンパニー | 回路部材の冷却方法及び装置 |
JP2006330680A (ja) * | 2005-05-25 | 2006-12-07 | Samsung Sdi Co Ltd | プラズマディスプレイ装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022547443A (ja) * | 2019-08-30 | 2022-11-14 | 華為技術有限公司 | 放熱器、電子デバイス、および車両 |
Also Published As
Publication number | Publication date |
---|---|
US20170097196A1 (en) | 2017-04-06 |
JP6526067B2 (ja) | 2019-06-05 |
KR20150145084A (ko) | 2015-12-29 |
WO2015194897A1 (ko) | 2015-12-23 |
CN206371029U (zh) | 2017-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6526067B2 (ja) | 放熱装置 | |
KR102098802B1 (ko) | 방열 장치 | |
TWI636724B (zh) | 具有散熱功能的電子設備及其水冷排總成 | |
US9268377B2 (en) | Electronic device having a passive heat exchange device | |
US7561417B2 (en) | Thermal module and fin assembly thereof | |
TWI463939B (zh) | 電子裝置 | |
WO2021129443A1 (zh) | 无线充电设备 | |
JP6632061B2 (ja) | インバータ | |
KR100981155B1 (ko) | 히트싱크 | |
US20120043058A1 (en) | Heat dissipation device | |
JP2011191974A (ja) | 情報機器 | |
JP2017069499A (ja) | ヒートシンク | |
US20140218864A1 (en) | Electronic device with cooling assembly | |
TW201443624A (zh) | 散熱結構及應用該散熱結構之電子裝置 | |
JP6523207B2 (ja) | ヒートシンクおよび筐体 | |
JP6265949B2 (ja) | ヒートシンク | |
US20110073283A1 (en) | Heat dissipation device | |
TWI643189B (zh) | 機箱 | |
TW201522894A (zh) | 散熱裝置 | |
TWM444548U (zh) | 電子裝置 | |
JP2015011045A (ja) | ディスプレイ装置の冷却構造 | |
JP2015114914A (ja) | 消熱ブランクパネル及びそれを用いたサーバラック | |
TWI576559B (zh) | 扁平散熱裝置 | |
TWI566079B (zh) | 電子裝置 | |
US20140092557A1 (en) | Electronic device with heat dissipating module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20171027 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20171030 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171127 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171205 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180301 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180529 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180817 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180829 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181205 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190416 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190507 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6526067 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |