JP2017520422A5 - - Google Patents
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- Publication number
- JP2017520422A5 JP2017520422A5 JP2017519211A JP2017519211A JP2017520422A5 JP 2017520422 A5 JP2017520422 A5 JP 2017520422A5 JP 2017519211 A JP2017519211 A JP 2017519211A JP 2017519211 A JP2017519211 A JP 2017519211A JP 2017520422 A5 JP2017520422 A5 JP 2017520422A5
- Authority
- JP
- Japan
- Prior art keywords
- porogens
- polishing
- polishing pad
- polymer matrix
- liquid filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 49
- 239000003361 porogen Substances 0.000 claims 42
- 239000000945 filler Substances 0.000 claims 19
- 229920000642 polymer Polymers 0.000 claims 18
- 239000007788 liquid Substances 0.000 claims 14
- 239000011159 matrix material Substances 0.000 claims 14
- 239000000203 mixture Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 5
- 239000002002 slurry Substances 0.000 claims 5
- 238000009835 boiling Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical group CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims 3
- 230000003750 conditioning effect Effects 0.000 claims 3
- 238000009826 distribution Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- 229920001400 block copolymer Polymers 0.000 claims 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 claims 2
- 239000012948 isocyanate Substances 0.000 claims 2
- 150000002513 isocyanates Chemical group 0.000 claims 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- 239000005033 polyvinylidene chloride Substances 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- -1 aromatic diamine compound Chemical class 0.000 claims 1
- 239000001273 butane Substances 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical group 0.000 claims 1
- 239000001282 iso-butane Substances 0.000 claims 1
- 235000013847 iso-butane Nutrition 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/307,846 US9238294B2 (en) | 2014-06-18 | 2014-06-18 | Polishing pad having porogens with liquid filler |
| US14/307,846 | 2014-06-18 | ||
| PCT/US2015/035662 WO2015195488A1 (en) | 2014-06-18 | 2015-06-12 | Polishing pad having porogens with liquid filler |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019211478A Division JP2020055103A (ja) | 2014-06-18 | 2019-11-22 | 液状充填材を含むポロゲンを有する研磨パッド |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017520422A JP2017520422A (ja) | 2017-07-27 |
| JP2017520422A5 true JP2017520422A5 (OSRAM) | 2018-07-05 |
| JP6810992B2 JP6810992B2 (ja) | 2021-01-13 |
Family
ID=53487453
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017519211A Active JP6810992B2 (ja) | 2014-06-18 | 2015-06-12 | 液状充填材を含むポロゲンを有する研磨パッド |
| JP2019211478A Withdrawn JP2020055103A (ja) | 2014-06-18 | 2019-11-22 | 液状充填材を含むポロゲンを有する研磨パッド |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019211478A Withdrawn JP2020055103A (ja) | 2014-06-18 | 2019-11-22 | 液状充填材を含むポロゲンを有する研磨パッド |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9238294B2 (OSRAM) |
| EP (1) | EP3157710B1 (OSRAM) |
| JP (2) | JP6810992B2 (OSRAM) |
| KR (1) | KR102391135B1 (OSRAM) |
| CN (2) | CN113276016A (OSRAM) |
| SG (1) | SG11201610140TA (OSRAM) |
| TW (1) | TWI599448B (OSRAM) |
| WO (1) | WO2015195488A1 (OSRAM) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015185815A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社東芝 | 研磨パッド、研磨方法、及び半導体装置の製造方法 |
| JP2016087770A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社東芝 | 研磨布および研磨方法 |
| US10946495B2 (en) * | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
| US10722999B2 (en) * | 2016-06-17 | 2020-07-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads and methods of making |
| US10195713B2 (en) | 2016-08-11 | 2019-02-05 | 3M Innovative Properties Company | Lapping pads and systems and methods of making and using the same |
| JP2019534833A (ja) * | 2016-08-19 | 2019-12-05 | ユニバーシティ オブ マサチューセッツ | ナノ多孔性構造およびそれを組み込んでいるアセンブリ |
| US10864612B2 (en) * | 2016-12-14 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad and method of using |
| KR102059647B1 (ko) * | 2018-06-21 | 2019-12-26 | 에스케이씨 주식회사 | 슬러리 유동성이 향상된 연마패드 및 이의 제조방법 |
| DE102018121626A1 (de) * | 2018-09-05 | 2020-03-05 | Rud. Starcke Gmbh & Co. Kg | Poliervorrichtung |
| CN114589620B (zh) * | 2020-12-03 | 2023-05-23 | 中国科学院微电子研究所 | 半导体研磨垫及制备方法 |
| US12459076B2 (en) | 2020-12-22 | 2025-11-04 | Cmc Materials Llc | Chemical-mechanical polishing subpad having porogens with polymeric shells |
| KR102518222B1 (ko) * | 2020-12-24 | 2023-04-05 | 주식회사 에스엠티 | 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치 |
| US12472602B2 (en) | 2021-09-02 | 2025-11-18 | Cmc Materials Llc | Textured CMP pad comprising polymer particles |
| KR102721631B1 (ko) * | 2021-09-17 | 2024-10-23 | 에스케이엔펄스 주식회사 | 연마패드의 리프레쉬 방법, 이를 이용한 반도체 소자의 제조방법 및 반도체 소자의 제조 장치 |
| KR102764254B1 (ko) * | 2022-02-25 | 2025-02-05 | 서울대학교산학협력단 | 리튬 금속 전지용 비수계 전해액 및 이를 포함하는 리튬 금속 전지 |
| US12447581B2 (en) * | 2022-07-11 | 2025-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features |
| CN120051356A (zh) * | 2022-09-22 | 2025-05-27 | Cmc材料有限责任公司 | 具有二硫键的化学机械抛光垫 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2375263A (en) * | 1944-06-27 | 1945-05-08 | Carborundum Co | Method of making abrasive articles |
| US3962154A (en) * | 1971-06-01 | 1976-06-08 | Standard Oil Company | Method for producing an improved molded thermoplastic article |
| US3922801A (en) * | 1973-07-16 | 1975-12-02 | Patrick Thomas Zente | Liquid filled orthopedic apparatus |
| US5147937A (en) * | 1990-03-22 | 1992-09-15 | Rohm And Haas Company | Process for making controlled, uniform-sized particles in the 1 to 50 micrometer range |
| US5534023A (en) * | 1992-12-29 | 1996-07-09 | Henley; Julian L. | Fluid filled prosthesis excluding gas-filled beads |
| US5976000A (en) * | 1996-05-28 | 1999-11-02 | Micron Technology, Inc. | Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers |
| US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
| US6231942B1 (en) * | 1998-01-21 | 2001-05-15 | Trexel, Inc. | Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby |
| JPH11322877A (ja) | 1998-05-12 | 1999-11-26 | Dainippon Ink & Chem Inc | 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物 |
| US6656018B1 (en) * | 1999-04-13 | 2003-12-02 | Freudenberg Nonwovens Limited Partnership | Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
| JP2000344902A (ja) | 1999-06-04 | 2000-12-12 | Fuji Spinning Co Ltd | 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物 |
| US6718703B2 (en) * | 2000-10-03 | 2004-04-13 | Lukley Holdings Pty Ltd. | Roofing tile assembly |
| WO2002030617A1 (en) * | 2000-10-06 | 2002-04-18 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
| US6531523B1 (en) * | 2000-10-10 | 2003-03-11 | Renal Tech International, Llc | Method of making biocompatible polymeric adsorbing material for purification of physiological fluids of organism |
| US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US7579071B2 (en) * | 2002-09-17 | 2009-08-25 | Korea Polyol Co., Ltd. | Polishing pad containing embedded liquid microelements and method of manufacturing the same |
| US7704125B2 (en) * | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US8864859B2 (en) * | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US20050042976A1 (en) * | 2003-08-22 | 2005-02-24 | International Business Machines Corporation | Low friction planarizing/polishing pads and use thereof |
| DE10348876B4 (de) * | 2003-10-21 | 2014-04-03 | Jnc Corporation | Poröse Polyolefinmembran |
| JP4555559B2 (ja) * | 2003-11-25 | 2010-10-06 | 富士紡ホールディングス株式会社 | 研磨布及び研磨布の製造方法 |
| US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
| US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
| US7435364B2 (en) | 2005-04-11 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for forming a porous polishing pad |
| TWI378844B (en) | 2005-08-18 | 2012-12-11 | Rohm & Haas Elect Mat | Polishing pad and method of manufacture |
| US20080057844A1 (en) * | 2006-02-01 | 2008-03-06 | Fred Miekka | Discontinuous Abrasive Surfaces Having Controlled Wear Properties |
| US20070212985A1 (en) * | 2006-03-07 | 2007-09-13 | Boler Lewyn B Jr | Wet sanding sponge; system and method for storing and using same |
| KR100804275B1 (ko) * | 2006-07-24 | 2008-02-18 | 에스케이씨 주식회사 | 고분자 쉘로 둘러싸인 액상 유기물 코어를 포함하는 ｃｍｐ연마패드 및 그 제조방법 |
| JP4986129B2 (ja) | 2007-01-15 | 2012-07-25 | 東洋ゴム工業株式会社 | 研磨パッド |
| CN102152232B (zh) | 2007-01-15 | 2013-06-26 | 东洋橡胶工业株式会社 | 研磨垫及其制造方法 |
| KR101186531B1 (ko) * | 2009-03-24 | 2012-10-08 | 차윤종 | 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드 |
| US9017140B2 (en) * | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| EP2569473B1 (en) * | 2010-05-10 | 2019-10-16 | Allergan, Inc. | Porous materials, methods of making and uses |
| US9156124B2 (en) * | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| CN103260828B (zh) | 2010-09-30 | 2017-08-15 | 嘉柏微电子材料股份公司 | 制作用于抛光半导体衬底的抛光垫的方法 |
| US8702479B2 (en) | 2010-10-15 | 2014-04-22 | Nexplanar Corporation | Polishing pad with multi-modal distribution of pore diameters |
| US9211628B2 (en) * | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
| US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
| US8920219B2 (en) * | 2011-07-15 | 2014-12-30 | Nexplanar Corporation | Polishing pad with alignment aperture |
| JP5945874B2 (ja) | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| US9067298B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
| US9597769B2 (en) * | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
| US9238296B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer |
-
2014
- 2014-06-18 US US14/307,846 patent/US9238294B2/en active Active
-
2015
- 2015-06-12 CN CN202110193495.4A patent/CN113276016A/zh active Pending
- 2015-06-12 JP JP2017519211A patent/JP6810992B2/ja active Active
- 2015-06-12 KR KR1020177001076A patent/KR102391135B1/ko active Active
- 2015-06-12 WO PCT/US2015/035662 patent/WO2015195488A1/en not_active Ceased
- 2015-06-12 SG SG11201610140TA patent/SG11201610140TA/en unknown
- 2015-06-12 CN CN201580032943.5A patent/CN106470799A/zh active Pending
- 2015-06-12 EP EP15731467.5A patent/EP3157710B1/en active Active
- 2015-06-17 TW TW104119621A patent/TWI599448B/zh active
-
2019
- 2019-11-22 JP JP2019211478A patent/JP2020055103A/ja not_active Withdrawn
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