JP2017520104A5 - - Google Patents

Download PDF

Info

Publication number
JP2017520104A5
JP2017520104A5 JP2016561718A JP2016561718A JP2017520104A5 JP 2017520104 A5 JP2017520104 A5 JP 2017520104A5 JP 2016561718 A JP2016561718 A JP 2016561718A JP 2016561718 A JP2016561718 A JP 2016561718A JP 2017520104 A5 JP2017520104 A5 JP 2017520104A5
Authority
JP
Japan
Prior art keywords
resistance
circuit
resistance value
die
resistor switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016561718A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017520104A (ja
JP6509904B2 (ja
Filing date
Publication date
Priority claimed from US14/250,150 external-priority patent/US9377804B2/en
Application filed filed Critical
Publication of JP2017520104A publication Critical patent/JP2017520104A/ja
Publication of JP2017520104A5 publication Critical patent/JP2017520104A5/ja
Application granted granted Critical
Publication of JP6509904B2 publication Critical patent/JP6509904B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016561718A 2014-04-10 2015-03-09 電荷保存及び直列抵抗のための切替え可能なパッケージキャパシタ Active JP6509904B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/250,150 2014-04-10
US14/250,150 US9377804B2 (en) 2014-04-10 2014-04-10 Switchable package capacitor for charge conservation and series resistance
PCT/US2015/019526 WO2015156940A2 (en) 2014-04-10 2015-03-09 Switchable package capacitor for charge conservation and series resistance

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019071181A Division JP2019145814A (ja) 2014-04-10 2019-04-03 電荷保存及び直列抵抗のための切替え可能なパッケージキャパシタ

Publications (3)

Publication Number Publication Date
JP2017520104A JP2017520104A (ja) 2017-07-20
JP2017520104A5 true JP2017520104A5 (enExample) 2018-03-29
JP6509904B2 JP6509904B2 (ja) 2019-05-08

Family

ID=52697567

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016561718A Active JP6509904B2 (ja) 2014-04-10 2015-03-09 電荷保存及び直列抵抗のための切替え可能なパッケージキャパシタ
JP2019071181A Ceased JP2019145814A (ja) 2014-04-10 2019-04-03 電荷保存及び直列抵抗のための切替え可能なパッケージキャパシタ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019071181A Ceased JP2019145814A (ja) 2014-04-10 2019-04-03 電荷保存及び直列抵抗のための切替え可能なパッケージキャパシタ

Country Status (7)

Country Link
US (2) US9377804B2 (enExample)
EP (1) EP3130008B1 (enExample)
JP (2) JP6509904B2 (enExample)
KR (1) KR102154089B1 (enExample)
CN (1) CN106170739B (enExample)
BR (1) BR112016023615A2 (enExample)
WO (1) WO2015156940A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377804B2 (en) 2014-04-10 2016-06-28 Qualcomm Incorporated Switchable package capacitor for charge conservation and series resistance
US20160173082A1 (en) * 2014-12-12 2016-06-16 Mediatek Inc. Method for performing impedance profile control of a power delivery network in an electronic device, and associated apparatus
US10581414B2 (en) * 2015-10-14 2020-03-03 Mediatek Inc. Semiconductor integrated circuit device
US10664035B2 (en) * 2017-08-31 2020-05-26 Qualcomm Incorporated Reconfigurable power delivery networks
WO2019066952A1 (en) * 2017-09-29 2019-04-04 Intel Corporation CONDUCTIVE PASSIVE SEMICONDUCTOR ELEMENTS
JP6652998B1 (ja) * 2018-09-03 2020-02-26 レノボ・シンガポール・プライベート・リミテッド 情報処理装置および制御方法
WO2022027403A1 (en) * 2020-08-06 2022-02-10 Yangtze Memory Technologies Co., Ltd. Multi-die peak power management for three-dimensional memory
EP4513487A3 (en) 2020-11-26 2025-05-21 Yangtze Memory Technologies Co., Ltd. Dynamic peak power management for multi-die operations
KR20220127451A (ko) * 2021-03-11 2022-09-20 삼성전자주식회사 시스템 온 칩 및 이를 포함하는 전자 시스템

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072690A (en) 1998-01-15 2000-06-06 International Business Machines Corporation High k dielectric capacitor with low k sheathed signal vias
US6806569B2 (en) 2001-09-28 2004-10-19 Intel Corporation Multi-frequency power delivery system
US6700390B2 (en) 2002-05-31 2004-03-02 Sun Microsystems, Inc. Adjustment and calibration system to store resistance settings to control chip/package resonance
JP4107052B2 (ja) * 2002-10-30 2008-06-25 株式会社デンソー 多出力電源装置
US6949810B2 (en) 2003-10-14 2005-09-27 Intel Corporation Active phase cancellation for power delivery
JP2006271182A (ja) * 2005-02-25 2006-10-05 Rohm Co Ltd 昇降圧レギュレータ回路及びこれを用いた液晶表示装置
JP2007304698A (ja) * 2006-05-09 2007-11-22 Nec Electronics Corp 電源回路及び液晶表示装置
JP2008251571A (ja) * 2007-03-29 2008-10-16 Fujitsu Microelectronics Ltd 半導体集積回路の設計方法および設計用プログラム
US7701277B2 (en) * 2007-12-12 2010-04-20 Synopsys, Inc. Variable-impedance gated decoupling cell
US8164916B1 (en) 2008-01-10 2012-04-24 Altera Corportation Techniques for attenuating resonance induced impedance in integrated circuits
JP5579369B2 (ja) 2008-01-24 2014-08-27 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
JP5139171B2 (ja) * 2008-02-05 2013-02-06 日本特殊陶業株式会社 ビアアレイ型積層セラミックコンデンサ及びその製造方法、コンデンサ内蔵配線基板
KR100974213B1 (ko) 2008-08-12 2010-08-06 주식회사 하이닉스반도체 전원 잡음 검출 장치 및 이를 이용한 전원 잡음 제어 장치
CN101807105B (zh) * 2009-02-17 2014-12-10 国家电网公司 时序控制电路
JP2010226224A (ja) * 2009-03-19 2010-10-07 Toshiba Corp 半導体装置
JP2011014629A (ja) * 2009-06-30 2011-01-20 Yamaha Corp 半導体装置
JP2011155144A (ja) * 2010-01-27 2011-08-11 Toshiba Corp 半導体装置
WO2012014014A2 (en) 2010-07-27 2012-02-02 Freescale Semiconductor, Inc. Multi-Core Processor and Method of Power Management of a Multi-Core Processor
US20120105129A1 (en) * 2010-10-28 2012-05-03 Naffziger Samuel D Apparatus for monolithic power gating on an integrated circuit
JP5691670B2 (ja) 2011-03-09 2015-04-01 日本電気株式会社 半導体集積回路の電源制御システムおよび電源制御方法
US8531194B2 (en) * 2011-03-24 2013-09-10 Freescale Semiconductor, Inc. Selectable threshold reset circuit
JP2012205408A (ja) * 2011-03-25 2012-10-22 Denso Corp 電源回路
WO2013038511A1 (ja) * 2011-09-13 2013-03-21 富士通株式会社 半導体集積回路の設計方法及び半導体集積回路の設計プログラム
US9337722B2 (en) * 2012-01-27 2016-05-10 Invensense, Inc. Fast power-up bias voltage circuit
JP6065480B2 (ja) * 2012-09-14 2017-01-25 株式会社リコー 半導体集積回路および電子回路
US9377804B2 (en) 2014-04-10 2016-06-28 Qualcomm Incorporated Switchable package capacitor for charge conservation and series resistance

Similar Documents

Publication Publication Date Title
JP2017520104A5 (enExample)
JP2018041170A5 (enExample)
WO2018019533A8 (en) Heater management
JP2016506708A5 (enExample)
JP2014103664A5 (enExample)
WO2016069884A3 (en) E-vaping section for an e-vaping device
TWI465891B (zh) 供電延遲電路
WO2016102972A3 (en) Method and apparatus for manipulating the shape of hair
MX2017015178A (es) Dispositivo de control de temperatura con iluminacion de fondo automaticamente ajustable.
WO2017151274A3 (en) Voltage adjustment for thermal mitigation
JP2015503806A5 (enExample)
IN2013MU01204A (enExample)
JP2015534448A5 (enExample)
TW201612907A (en) Apparatuses and methods for detecting write completion for resistive memory
WO2013066592A3 (en) A mixed voltage non-volatile memory integrated circuit with power saving
EP3059114A3 (en) Connection detecting circuit
WO2015156940A3 (en) Die with resistor switch having an adjustable resistance
JP2015214174A5 (enExample)
GB2570614A (en) Electric power devices with automatically established input voltage connection configuration
JP2015111968A5 (enExample)
JP2017514389A5 (enExample)
JP2015106162A5 (enExample)
WO2017050042A1 (zh) 电容式感测系统以及电子设备
JP2015069652A5 (ja) 半導体デバイス及び動作初期化方法
EP2827482A3 (en) Power control device and image forming apparatus inlcuding the same