JP2017513393A5 - - Google Patents

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Publication number
JP2017513393A5
JP2017513393A5 JP2016559577A JP2016559577A JP2017513393A5 JP 2017513393 A5 JP2017513393 A5 JP 2017513393A5 JP 2016559577 A JP2016559577 A JP 2016559577A JP 2016559577 A JP2016559577 A JP 2016559577A JP 2017513393 A5 JP2017513393 A5 JP 2017513393A5
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JP
Japan
Prior art keywords
parameter
temperature
error value
computing device
portable computing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016559577A
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English (en)
Japanese (ja)
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JP2017513393A (ja
Filing date
Publication date
Priority claimed from US14/289,675 external-priority patent/US10082847B2/en
Application filed filed Critical
Publication of JP2017513393A publication Critical patent/JP2017513393A/ja
Publication of JP2017513393A5 publication Critical patent/JP2017513393A5/ja
Pending legal-status Critical Current

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JP2016559577A 2014-04-01 2015-03-31 熱発生を緩和すると同時にｐｃｄの性能を最適化するための方法およびシステム Pending JP2017513393A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461973772P 2014-04-01 2014-04-01
US61/973,772 2014-04-01
US14/289,675 2014-05-29
US14/289,675 US10082847B2 (en) 2014-04-01 2014-05-29 Method and system for optimizing performance of a PCD while mitigating thermal generation
PCT/US2015/023638 WO2015153643A1 (en) 2014-04-01 2015-03-31 Method and system for optimizing performance of a pcd while mitigating thermal generation

Publications (2)

Publication Number Publication Date
JP2017513393A JP2017513393A (ja) 2017-05-25
JP2017513393A5 true JP2017513393A5 (enExample) 2018-04-26

Family

ID=54190210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016559577A Pending JP2017513393A (ja) 2014-04-01 2015-03-31 熱発生を緩和すると同時にｐｃｄの性能を最適化するための方法およびシステム

Country Status (6)

Country Link
US (1) US10082847B2 (enExample)
EP (1) EP3126927B1 (enExample)
JP (1) JP2017513393A (enExample)
KR (1) KR20160138479A (enExample)
CN (1) CN106537282B (enExample)
WO (1) WO2015153643A1 (enExample)

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US10114432B2 (en) * 2014-12-29 2018-10-30 Mediatek Inc. Thermal control system and thermal control method for electronic device
US10216246B2 (en) * 2016-09-30 2019-02-26 Intel Corporation Multi-level loops for computer processor control
KR102643797B1 (ko) * 2017-01-10 2024-03-05 삼성전자주식회사 동적 발열 관리 방법
CN107506010A (zh) * 2017-08-25 2017-12-22 深圳天珑无线科技有限公司 一种温度控制方法、装置及计算机可读存储介质
CN110113479B (zh) * 2019-04-15 2020-10-30 珠海格力电器股份有限公司 智能终端降温策略的制定方法、降温方法、系统、终端
CN110836197B (zh) * 2019-11-05 2021-05-25 英业达科技有限公司 一种能耗自动优化的策略
EP4485136A4 (en) * 2022-07-19 2025-06-25 Samsung Electronics Co., Ltd Method and device for controlling heat caused by electronic device on basis of pid controller
CN118795761A (zh) * 2024-03-27 2024-10-18 中国移动通信集团设计院有限公司 数据中心机房智能温控方法、系统、电子设备及存储介质
CN120353122B (zh) * 2025-06-16 2025-08-29 山东泰开检测有限公司 一种气体试验变压器的水冷控制方法、终端及存储介质

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US8972759B2 (en) 2012-06-29 2015-03-03 Qualcomm Incorporated Adaptive thermal management in a portable computing device including monitoring a temperature signal and holding a performance level during a penalty period
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