JP2017513393A - 熱発生を緩和すると同時にｐｃｄの性能を最適化するための方法およびシステム - Google Patents

熱発生を緩和すると同時にｐｃｄの性能を最適化するための方法およびシステム Download PDF

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JP2017513393A
JP2017513393A JP2016559577A JP2016559577A JP2017513393A JP 2017513393 A JP2017513393 A JP 2017513393A JP 2016559577 A JP2016559577 A JP 2016559577A JP 2016559577 A JP2016559577 A JP 2016559577A JP 2017513393 A JP2017513393 A JP 2017513393A
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temperature
parameter
threshold
computing device
portable computing
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JP2017513393A5 (enExample
Inventor
ヴィジャイ・ラマン
エイミー・ダービーシャー
クリストファー・メドラノ
シジュ・アブラハム・マシュー
ロナルド・フランク・アルトン
ジョン・ジェームズ・アンダーソン
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クアルコム，インコーポレイテッド
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B11/00—Automatic controllers
    • G05B11/01—Automatic controllers electric
    • G05B11/36—Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential
    • G05B11/42—Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential for obtaining a characteristic which is both proportional and time-dependent, e.g. P. I., P. I. D.
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/324—Power saving characterised by the action undertaken by lowering clock frequency
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3296—Power saving characterised by the action undertaken by lowering the supply or operating voltage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Power Sources (AREA)
  • Feedback Control In General (AREA)
  • Telephone Function (AREA)
JP2016559577A 2014-04-01 2015-03-31 熱発生を緩和すると同時にｐｃｄの性能を最適化するための方法およびシステム Pending JP2017513393A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461973772P 2014-04-01 2014-04-01
US61/973,772 2014-04-01
US14/289,675 2014-05-29
US14/289,675 US10082847B2 (en) 2014-04-01 2014-05-29 Method and system for optimizing performance of a PCD while mitigating thermal generation
PCT/US2015/023638 WO2015153643A1 (en) 2014-04-01 2015-03-31 Method and system for optimizing performance of a pcd while mitigating thermal generation

Publications (2)

Publication Number Publication Date
JP2017513393A true JP2017513393A (ja) 2017-05-25
JP2017513393A5 JP2017513393A5 (enExample) 2018-04-26

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JP2016559577A Pending JP2017513393A (ja) 2014-04-01 2015-03-31 熱発生を緩和すると同時にｐｃｄの性能を最適化するための方法およびシステム

Country Status (6)

Country Link
US (1) US10082847B2 (enExample)
EP (1) EP3126927B1 (enExample)
JP (1) JP2017513393A (enExample)
KR (1) KR20160138479A (enExample)
CN (1) CN106537282B (enExample)
WO (1) WO2015153643A1 (enExample)

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US9791904B2 (en) * 2014-08-15 2017-10-17 Intel Corporation Balanced control of processor temperature
US10114432B2 (en) * 2014-12-29 2018-10-30 Mediatek Inc. Thermal control system and thermal control method for electronic device
US10216246B2 (en) * 2016-09-30 2019-02-26 Intel Corporation Multi-level loops for computer processor control
KR102643797B1 (ko) * 2017-01-10 2024-03-05 삼성전자주식회사 동적 발열 관리 방법
CN107506010A (zh) * 2017-08-25 2017-12-22 深圳天珑无线科技有限公司 一种温度控制方法、装置及计算机可读存储介质
CN110113479B (zh) * 2019-04-15 2020-10-30 珠海格力电器股份有限公司 智能终端降温策略的制定方法、降温方法、系统、终端
CN110836197B (zh) * 2019-11-05 2021-05-25 英业达科技有限公司 一种能耗自动优化的策略
WO2024019280A1 (ko) * 2022-07-19 2024-01-25 삼성전자주식회사 Pid 제어기에 기초하여 전자 장치의 발열을 제어하는 방법 및 장치
CN118795761A (zh) * 2024-03-27 2024-10-18 中国移动通信集团设计院有限公司 数据中心机房智能温控方法、系统、电子设备及存储介质
CN120353122B (zh) * 2025-06-16 2025-08-29 山东泰开检测有限公司 一种气体试验变压器的水冷控制方法、终端及存储介质

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JP2002529806A (ja) * 1998-10-30 2002-09-10 インテル・コーポレーション 閉ループ・フィードバック・システムを使用したマイクロプロセッサにおけるパワー・スロットリングのための装置および方法
JP2006011548A (ja) * 2004-06-22 2006-01-12 Sony Computer Entertainment Inc プロセッサ、情報処理装置およびプロセッサの制御方法
JP2009522688A (ja) * 2006-01-03 2009-06-11 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド 独立周波数及び／又は電圧で集積回路の構成要素を動作させるシステムならびに方法
JP2013033469A (ja) * 2011-07-29 2013-02-14 Samsung Electronics Co Ltd 端末機温度制御方法及びこれをサポートする端末機
US20130293269A1 (en) * 2012-04-26 2013-11-07 Huawei Technologies Co., Ltd. Method and apparatus for controlling chip performance

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* Cited by examiner, † Cited by third party
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JPH0619504A (ja) * 1992-05-08 1994-01-28 Tel Varian Ltd 制御システム
JP2002529806A (ja) * 1998-10-30 2002-09-10 インテル・コーポレーション 閉ループ・フィードバック・システムを使用したマイクロプロセッサにおけるパワー・スロットリングのための装置および方法
JP2006011548A (ja) * 2004-06-22 2006-01-12 Sony Computer Entertainment Inc プロセッサ、情報処理装置およびプロセッサの制御方法
JP2009522688A (ja) * 2006-01-03 2009-06-11 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド 独立周波数及び／又は電圧で集積回路の構成要素を動作させるシステムならびに方法
JP2013033469A (ja) * 2011-07-29 2013-02-14 Samsung Electronics Co Ltd 端末機温度制御方法及びこれをサポートする端末機
US20130293269A1 (en) * 2012-04-26 2013-11-07 Huawei Technologies Co., Ltd. Method and apparatus for controlling chip performance

Also Published As

Publication number Publication date
CN106537282A (zh) 2017-03-22
EP3126927A1 (en) 2017-02-08
CN106537282B (zh) 2019-11-19
WO2015153643A1 (en) 2015-10-08
KR20160138479A (ko) 2016-12-05
US10082847B2 (en) 2018-09-25
US20150277395A1 (en) 2015-10-01
EP3126927B1 (en) 2019-10-30

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