JP2017513344A5 - - Google Patents

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Publication number
JP2017513344A5
JP2017513344A5 JP2016557627A JP2016557627A JP2017513344A5 JP 2017513344 A5 JP2017513344 A5 JP 2017513344A5 JP 2016557627 A JP2016557627 A JP 2016557627A JP 2016557627 A JP2016557627 A JP 2016557627A JP 2017513344 A5 JP2017513344 A5 JP 2017513344A5
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JP
Japan
Prior art keywords
dielectric layer
region
stack
forming
substrate
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JP2016557627A
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English (en)
Japanese (ja)
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JP6422991B2 (ja
JP2017513344A (ja
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Priority claimed from PCT/EP2015/054801 external-priority patent/WO2015139979A1/en
Publication of JP2017513344A publication Critical patent/JP2017513344A/ja
Publication of JP2017513344A5 publication Critical patent/JP2017513344A5/ja
Application granted granted Critical
Publication of JP6422991B2 publication Critical patent/JP6422991B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016557627A 2014-03-21 2015-03-09 Ｃｍｕｔデバイス及び製造方法 Expired - Fee Related JP6422991B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14161057.6 2014-03-21
EP14161057 2014-03-21
PCT/EP2015/054801 WO2015139979A1 (en) 2014-03-21 2015-03-09 Cmut device and manufacturing method

Publications (3)

Publication Number Publication Date
JP2017513344A JP2017513344A (ja) 2017-05-25
JP2017513344A5 true JP2017513344A5 (enExample) 2017-09-21
JP6422991B2 JP6422991B2 (ja) 2018-11-14

Family

ID=50391021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016557627A Expired - Fee Related JP6422991B2 (ja) 2014-03-21 2015-03-09 Ｃｍｕｔデバイス及び製造方法

Country Status (5)

Country Link
US (1) US9889472B2 (enExample)
EP (1) EP3119533B1 (enExample)
JP (1) JP6422991B2 (enExample)
CN (1) CN106132568B (enExample)
WO (1) WO2015139979A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6495545B2 (ja) * 2015-11-02 2019-04-03 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスジューサアレイ、プローブ及びシステム
CN106744642A (zh) * 2017-01-06 2017-05-31 中北大学 收发平衡的宽频带混合式超声换能器面阵探头及制备方法
CN106865483A (zh) * 2017-01-06 2017-06-20 中北大学 医用微电容超声换能器面阵探头及其制备方法
US11440794B2 (en) * 2018-09-12 2022-09-13 Stmicroelectronics S.R.L. Process for manufacturing a microelectromechanical device with a mobile structure, in particular a micromirror
US11329098B2 (en) * 2018-11-08 2022-05-10 Vanguard International Semiconductor Singapore Pte. Ltd. Piezoelectric micromachined ultrasonic transducers and methods for fabricating thereof
DE102018222749A1 (de) * 2018-12-21 2020-06-25 Robert Bosch Gmbh Verfahren zum Verschließen von Zugängen in einem MEMS-Element
US11050012B2 (en) * 2019-04-01 2021-06-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method to protect electrodes from oxidation in a MEMS device
CN110174453B (zh) * 2019-05-08 2021-08-03 中国科学院微电子研究所 一种微电极结构及其制作方法及包括该器件的电子设备
CN114302774B (zh) * 2019-08-30 2023-05-23 维蒙股份公司 Cmut换能器
WO2025188908A1 (en) * 2024-03-06 2025-09-12 Shifamed Holdings, Llc Micro electrical mechanical system ultrasound transducer and methods of fabricating the same

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Publication number Priority date Publication date Assignee Title
US5591678A (en) 1993-01-19 1997-01-07 He Holdings, Inc. Process of manufacturing a microelectric device using a removable support substrate and etch-stop
US6165896A (en) * 1998-06-25 2000-12-26 Siemens Aktiengesellschaft Self-aligned formation and method for semiconductors
DE602004031959D1 (de) * 2003-09-22 2011-05-05 Tpo Hong Kong Holding Ltd Zeigebauelements
JP2007528153A (ja) * 2004-02-06 2007-10-04 ジョージア テック リサーチ コーポレイション Ｃｍｕｔデバイス及び製造方法
WO2005114820A2 (en) * 2004-05-14 2005-12-01 The University Of Georgia Research Foundation, Inc. Implantable ultrasonic transducer systems and methods
EP1789816A1 (en) * 2004-08-18 2007-05-30 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound transducer arrays
US8309428B2 (en) 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
JP4891182B2 (ja) * 2007-08-28 2012-03-07 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ、超音波診断装置及び超音波顕微鏡
US8047995B2 (en) * 2007-08-28 2011-11-01 Olympus Medical Systems Corp. Ultrasonic transducer, method of manufacturing ultrasonic transducer, ultrasonic diagnostic apparatus, and ultrasonic microscope
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US7898081B2 (en) * 2008-07-03 2011-03-01 United Microelectronics Corp. MEMS device and method of making the same
JP5317826B2 (ja) * 2009-05-19 2013-10-16 キヤノン株式会社 容量型機械電気変換素子の製造方法
JP5875243B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP2013219303A (ja) * 2012-04-12 2013-10-24 Hitachi Ltd 半導体装置およびその製造方法
JP6262496B2 (ja) * 2013-11-08 2018-01-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US9067779B1 (en) * 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods

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