CN106132568B - Cmut设备、制造方法及包括该设备的装置 - Google Patents

Cmut设备、制造方法及包括该设备的装置 Download PDF

Info

Publication number
CN106132568B
CN106132568B CN201580015010.5A CN201580015010A CN106132568B CN 106132568 B CN106132568 B CN 106132568B CN 201580015010 A CN201580015010 A CN 201580015010A CN 106132568 B CN106132568 B CN 106132568B
Authority
CN
China
Prior art keywords
dielectric layer
area
equipment
substrate
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580015010.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN106132568A (zh
Inventor
R·毛奇斯措克
B·马赛利斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN106132568A publication Critical patent/CN106132568A/zh
Application granted granted Critical
Publication of CN106132568B publication Critical patent/CN106132568B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00388—Etch mask forming
    • B81C1/00428—Etch mask forming processes not provided for in groups B81C1/00396 - B81C1/0042
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
CN201580015010.5A 2014-03-21 2015-03-09 Cmut设备、制造方法及包括该设备的装置 Active CN106132568B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14161057 2014-03-21
EP14161057.6 2014-03-21
PCT/EP2015/054801 WO2015139979A1 (en) 2014-03-21 2015-03-09 Cmut device and manufacturing method

Publications (2)

Publication Number Publication Date
CN106132568A CN106132568A (zh) 2016-11-16
CN106132568B true CN106132568B (zh) 2019-06-07

Family

ID=50391021

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580015010.5A Active CN106132568B (zh) 2014-03-21 2015-03-09 Cmut设备、制造方法及包括该设备的装置

Country Status (5)

Country Link
US (1) US9889472B2 (enExample)
EP (1) EP3119533B1 (enExample)
JP (1) JP6422991B2 (enExample)
CN (1) CN106132568B (enExample)
WO (1) WO2015139979A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108348217B (zh) * 2015-11-02 2021-07-20 皇家飞利浦有限公司 超声换能器阵列、探头和系统
CN106744642A (zh) * 2017-01-06 2017-05-31 中北大学 收发平衡的宽频带混合式超声换能器面阵探头及制备方法
CN106865483A (zh) * 2017-01-06 2017-06-20 中北大学 医用微电容超声换能器面阵探头及其制备方法
US11440794B2 (en) * 2018-09-12 2022-09-13 Stmicroelectronics S.R.L. Process for manufacturing a microelectromechanical device with a mobile structure, in particular a micromirror
US11329098B2 (en) * 2018-11-08 2022-05-10 Vanguard International Semiconductor Singapore Pte. Ltd. Piezoelectric micromachined ultrasonic transducers and methods for fabricating thereof
DE102018222749A1 (de) * 2018-12-21 2020-06-25 Robert Bosch Gmbh Verfahren zum Verschließen von Zugängen in einem MEMS-Element
US11050012B2 (en) * 2019-04-01 2021-06-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method to protect electrodes from oxidation in a MEMS device
CN110174453B (zh) * 2019-05-08 2021-08-03 中国科学院微电子研究所 一种微电极结构及其制作方法及包括该器件的电子设备
EP4021649A1 (en) * 2019-08-30 2022-07-06 Vermon S.A. Cmut transducer
WO2025188908A1 (en) * 2024-03-06 2025-09-12 Shifamed Holdings, Llc Micro electrical mechanical system ultrasound transducer and methods of fabricating the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006018805A1 (en) * 2004-08-18 2006-02-23 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound transducer arrays
CN1856731A (zh) * 2003-09-22 2006-11-01 皇家飞利浦电子股份有限公司 制造液晶显示器的方法
CN102728535A (zh) * 2011-04-06 2012-10-17 佳能株式会社 电气机械换能器及其制造方法
JP2013219303A (ja) * 2012-04-12 2013-10-24 Hitachi Ltd 半導体装置およびその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5591678A (en) 1993-01-19 1997-01-07 He Holdings, Inc. Process of manufacturing a microelectric device using a removable support substrate and etch-stop
US6165896A (en) 1998-06-25 2000-12-26 Siemens Aktiengesellschaft Self-aligned formation and method for semiconductors
WO2005077012A2 (en) * 2004-02-06 2005-08-25 Georgia Tech Research Corporation Cmut devices and fabrication methods
WO2005114820A2 (en) * 2004-05-14 2005-12-01 The University Of Georgia Research Foundation, Inc. Implantable ultrasonic transducer systems and methods
US8309428B2 (en) 2004-09-15 2012-11-13 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer
JP4891182B2 (ja) * 2007-08-28 2012-03-07 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ、超音波診断装置及び超音波顕微鏡
US8047995B2 (en) * 2007-08-28 2011-11-01 Olympus Medical Systems Corp. Ultrasonic transducer, method of manufacturing ultrasonic transducer, ultrasonic diagnostic apparatus, and ultrasonic microscope
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US7898081B2 (en) * 2008-07-03 2011-03-01 United Microelectronics Corp. MEMS device and method of making the same
JP5317826B2 (ja) * 2009-05-19 2013-10-16 キヤノン株式会社 容量型機械電気変換素子の製造方法
JP6262496B2 (ja) * 2013-11-08 2018-01-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US9067779B1 (en) * 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1856731A (zh) * 2003-09-22 2006-11-01 皇家飞利浦电子股份有限公司 制造液晶显示器的方法
WO2006018805A1 (en) * 2004-08-18 2006-02-23 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound transducer arrays
CN102728535A (zh) * 2011-04-06 2012-10-17 佳能株式会社 电气机械换能器及其制造方法
JP2013219303A (ja) * 2012-04-12 2013-10-24 Hitachi Ltd 半導体装置およびその製造方法

Also Published As

Publication number Publication date
WO2015139979A1 (en) 2015-09-24
JP2017513344A (ja) 2017-05-25
CN106132568A (zh) 2016-11-16
EP3119533B1 (en) 2022-06-29
US20170080460A1 (en) 2017-03-23
JP6422991B2 (ja) 2018-11-14
US9889472B2 (en) 2018-02-13
EP3119533A1 (en) 2017-01-25

Similar Documents

Publication Publication Date Title
CN106132568B (zh) Cmut设备、制造方法及包括该设备的装置
EP3132470B1 (en) Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
US9809444B2 (en) System and method for a differential comb drive MEMS
US9938133B2 (en) System and method for a comb-drive MEMS device
US9487386B2 (en) Comb MEMS device and method of making a comb MEMS device
US9481570B2 (en) Method of manufacturing an integrated circuit comprising a pressure sensor
US11750980B2 (en) MEMS device with enhanced membrane structure and method of forming the same
TW201738169A (zh) 壓電微機電系統
US9154886B2 (en) Capacitive transducer manufacturing method, and multi-function device
CN105592940B (zh) Cmut装置制造方法、cmut装置和设备
CN110798788B (zh) 一种mems结构及其形成方法
WO2012122869A1 (zh) Mems麦克风及其形成方法
US9499399B2 (en) Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer
CN117069053B (zh) 半导体器件及其制备方法
EP3682210B1 (en) Capacitive pressure sensors and other devices having a suspended membrane and having rounded corners at an anchor edge
CN105439075B (zh) 一种mems器件及其制备方法、电子装置
CN108203075A (zh) 一种mems器件及其制备方法、电子装置
CN220149225U (zh) 集成芯片
CN105439078B (zh) 一种mems器件及其制备方法、电子装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant