JP2017513214A5 - - Google Patents
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- Publication number
- JP2017513214A5 JP2017513214A5 JP2016555573A JP2016555573A JP2017513214A5 JP 2017513214 A5 JP2017513214 A5 JP 2017513214A5 JP 2016555573 A JP2016555573 A JP 2016555573A JP 2016555573 A JP2016555573 A JP 2016555573A JP 2017513214 A5 JP2017513214 A5 JP 2017513214A5
- Authority
- JP
- Japan
- Prior art keywords
- housing
- porous
- conductive material
- thermally conductive
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 11
- 239000000463 material Substances 0.000 claims 2
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461953653P | 2014-03-14 | 2014-03-14 | |
| US61/953,653 | 2014-03-14 | ||
| US14/594,984 US10152099B2 (en) | 2014-03-14 | 2015-01-12 | Skin material design to reduce touch temperature |
| US14/594,984 | 2015-01-12 | ||
| PCT/US2015/020559 WO2015138973A1 (en) | 2014-03-14 | 2015-03-13 | Skin material design to reduce touch temperature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017513214A JP2017513214A (ja) | 2017-05-25 |
| JP2017513214A5 true JP2017513214A5 (enExample) | 2018-04-05 |
Family
ID=54068815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016555573A Pending JP2017513214A (ja) | 2014-03-14 | 2015-03-13 | 接触温度を低減するための表皮材料設計 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10152099B2 (enExample) |
| EP (1) | EP3117174B1 (enExample) |
| JP (1) | JP2017513214A (enExample) |
| KR (1) | KR20160132388A (enExample) |
| CN (1) | CN106133634B (enExample) |
| WO (1) | WO2015138973A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12114453B2 (en) * | 2019-01-29 | 2024-10-08 | Apple Inc. | Core shell with various filler materials for enhanced thermal conductivity |
| US11379023B2 (en) * | 2019-07-15 | 2022-07-05 | Microsoft Technology Licensing, Llc | Regulating device surface temperature |
| CN119663395A (zh) | 2020-05-20 | 2025-03-21 | 苹果公司 | 非水性铝阳极化 |
| US12070797B1 (en) | 2020-05-20 | 2024-08-27 | Apple Inc. | Direct metal deposition of electronic device components |
| US11716808B2 (en) * | 2020-12-10 | 2023-08-01 | International Business Machines Corporation | Tamper-respondent assemblies with porous heat transfer element(s) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006114736A (ja) * | 2004-10-15 | 2006-04-27 | Sumitomo Chemical Co Ltd | 携帯電子機器 |
| US7695808B2 (en) * | 2005-11-07 | 2010-04-13 | 3M Innovative Properties Company | Thermal transfer coating |
| US7355849B2 (en) * | 2006-01-09 | 2008-04-08 | Via Technologies, Inc. Of R.O.C. | Non-metal mesh cover for metal chassis |
| US20070263352A1 (en) * | 2006-05-15 | 2007-11-15 | Motorola, Inc. | Plastics Utilizing Thermally Conductive Film |
| JP2008277432A (ja) * | 2007-04-26 | 2008-11-13 | Kaneka Corp | 放熱構造体 |
| JP2010251463A (ja) * | 2009-04-14 | 2010-11-04 | Asahi Kasei E-Materials Corp | 新規吸熱シート |
| US8800641B2 (en) | 2009-06-01 | 2014-08-12 | The Boeing Company | Methods and apparatus for a micro-truss based structural insulation layer |
| US20150005043A1 (en) * | 2012-01-16 | 2015-01-01 | Nec Casio Modile Communications, Ltd. | Portable terminal device |
| US9165854B2 (en) * | 2012-04-12 | 2015-10-20 | Qualcomm Incorporated | Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features |
-
2015
- 2015-01-12 US US14/594,984 patent/US10152099B2/en active Active
- 2015-03-13 KR KR1020167024234A patent/KR20160132388A/ko not_active Withdrawn
- 2015-03-13 WO PCT/US2015/020559 patent/WO2015138973A1/en not_active Ceased
- 2015-03-13 JP JP2016555573A patent/JP2017513214A/ja active Pending
- 2015-03-13 EP EP15718646.1A patent/EP3117174B1/en active Active
- 2015-03-13 CN CN201580013484.6A patent/CN106133634B/zh not_active Expired - Fee Related
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