JP2015535395A5 - - Google Patents

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Publication number
JP2015535395A5
JP2015535395A5 JP2015539692A JP2015539692A JP2015535395A5 JP 2015535395 A5 JP2015535395 A5 JP 2015535395A5 JP 2015539692 A JP2015539692 A JP 2015539692A JP 2015539692 A JP2015539692 A JP 2015539692A JP 2015535395 A5 JP2015535395 A5 JP 2015535395A5
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JP
Japan
Prior art keywords
container
atmospheric gas
thermal conductivity
layer
atmospheric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015539692A
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English (en)
Japanese (ja)
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JP6374391B2 (ja
JP2015535395A (ja
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Publication date
Priority claimed from US13/662,030 external-priority patent/US9606587B2/en
Application filed filed Critical
Publication of JP2015535395A publication Critical patent/JP2015535395A/ja
Publication of JP2015535395A5 publication Critical patent/JP2015535395A5/ja
Application granted granted Critical
Publication of JP6374391B2 publication Critical patent/JP6374391B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015539692A 2012-10-26 2013-10-21 大気圧ガスを封じ込める構造を持つインシュレータ・モジュール Active JP6374391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/662,030 US9606587B2 (en) 2012-10-26 2012-10-26 Insulator module having structure enclosing atomspheric pressure gas
US13/662,030 2012-10-26
PCT/US2013/065961 WO2014066261A1 (en) 2012-10-26 2013-10-21 Insulator module having structure enclosing atomspheric pressure gas

Publications (3)

Publication Number Publication Date
JP2015535395A JP2015535395A (ja) 2015-12-10
JP2015535395A5 true JP2015535395A5 (enExample) 2016-12-01
JP6374391B2 JP6374391B2 (ja) 2018-08-15

Family

ID=50545152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015539692A Active JP6374391B2 (ja) 2012-10-26 2013-10-21 大気圧ガスを封じ込める構造を持つインシュレータ・モジュール

Country Status (6)

Country Link
US (1) US9606587B2 (enExample)
EP (1) EP2912533B1 (enExample)
JP (1) JP6374391B2 (enExample)
KR (1) KR102168099B1 (enExample)
CN (1) CN104798001B (enExample)
WO (1) WO2014066261A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9466335B2 (en) 2011-04-28 2016-10-11 Entrotech, Inc. Hermetic hard disk drives comprising integrally molded filters and related methods
GB2505538B (en) * 2013-02-20 2014-07-23 Amino Comm Ltd Housing, apparatus and method
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
WO2015164551A1 (en) 2014-04-22 2015-10-29 Entrotech, Inc. Re-workable sealed hard disk drives, cover seals therefor, and related methods
US10002645B2 (en) 2014-06-09 2018-06-19 Entrotech, Inc. Laminate-wrapped hard disk drives and related methods
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
US9601161B2 (en) * 2015-04-15 2017-03-21 entroteech, inc. Metallically sealed, wrapped hard disk drives and related methods
EP4260367B1 (en) * 2020-12-09 2026-06-03 Hella Gmbh & Co. Kgaa Heat sink arrangement, heat sink and electronic control unit

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586102A (en) * 1969-02-17 1971-06-22 Teledyne Inc Heat sink pillow
US3741292A (en) * 1971-06-30 1973-06-26 Ibm Liquid encapsulated air cooled module
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4155402A (en) * 1977-01-03 1979-05-22 Sperry Rand Corporation Compliant mat cooling
US4262045A (en) * 1979-03-16 1981-04-14 Cheng Chen Yen Cellular air bag insulation and insulator
US4284674A (en) * 1979-11-08 1981-08-18 American Can Company Thermal insulation
EP0128154B1 (de) * 1982-12-16 1986-10-22 Hasler AG Mit wärmeleitfähiger paste oder flüssigkeit gefüllter flachbeutel
DE3418637A1 (de) * 1984-05-18 1985-11-21 Wacker-Chemie GmbH, 8000 München Waermedaemmformkoerper mit umhuellung
US4618517A (en) * 1984-06-29 1986-10-21 Simko Jr Frank A Thermal insulating material
EP0184415B1 (en) * 1984-12-04 1990-12-05 Nippon Sanso Kabushiki Kaisha Evacuated heat insulation unit
US4825089A (en) * 1987-07-13 1989-04-25 Lindsay Brad H Radiant barrier apparatus
US4997032A (en) * 1987-09-25 1991-03-05 Minnesota Mining And Manufacturing Company Thermal transfer bag
US5107649A (en) * 1988-04-15 1992-04-28 Midwest Research Institute Compact vacuum insulation embodiments
US5018328A (en) * 1989-12-18 1991-05-28 Whirlpool Corporation Multi-compartment vacuum insulation panels
US5270092A (en) * 1991-08-08 1993-12-14 The Regents, University Of California Gas filled panel insulation
US5792539A (en) * 1996-07-08 1998-08-11 Oceaneering International, Inc. Insulation barrier
US6037033A (en) * 1996-07-08 2000-03-14 Hunter; Rick Cole Insulation panel
JP3106120B2 (ja) 1997-05-16 2000-11-06 三菱電機株式会社 携帯型電子機器
JP3366244B2 (ja) * 1998-02-04 2003-01-14 富士通株式会社 電子機器
US6055155A (en) 1998-02-18 2000-04-25 International Business Machines Corporation Case for portable computers for enhanced heat dissipation
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
TW470837B (en) * 2000-04-21 2002-01-01 Matsushita Refrigeration Vacuum heat insulator
US6809413B1 (en) * 2000-05-16 2004-10-26 Sandia Corporation Microelectronic device package with an integral window mounted in a recessed lip
US6859364B2 (en) * 2000-06-06 2005-02-22 Matsushita Refrigeration Company Portable information appliance
KR100538854B1 (ko) * 2000-11-16 2005-12-23 마쓰시타 레키 가부시키가이샤 휴대 정보 기기
US20020191373A1 (en) 2001-06-18 2002-12-19 Williams John W. Heat dissipation system
JP4654546B2 (ja) * 2001-07-12 2011-03-23 パナソニック株式会社 ノート型パソコン
US7832177B2 (en) * 2002-03-22 2010-11-16 Electronics Packaging Solutions, Inc. Insulated glazing units
US8684274B2 (en) * 2003-05-16 2014-04-01 Kambix Innovations, Llc Cooling enhancements in thin films using flexible complex seal due to temperature increase or thermal load increase
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
US7118801B2 (en) 2003-11-10 2006-10-10 Gore Enterprise Holdings, Inc. Aerogel/PTFE composite insulating material
US20050270746A1 (en) * 2004-06-04 2005-12-08 Reis Bradley E Insulating structure having combined insulating and heat spreading capabilities
EP1884704A4 (en) * 2005-05-23 2011-11-30 Panasonic Corp VACUUM HEAT INSULATOR AND TEST PROCEDURE FOR THE ISOLATOR TO USE GLASS FIBER LAMINATE
EP2484952B1 (en) * 2005-09-26 2014-06-11 Panasonic Corporation Gas absorbing device and vacuum heat insulator making use of the gas absorbing device
US20070115635A1 (en) * 2005-11-18 2007-05-24 Low Andrew G Passive cooling for fiber to the premise (FTTP) electronics
US8174828B2 (en) * 2006-02-06 2012-05-08 Parker-Hannifin Corporation Narrow gap spray cooling in a globally cooled enclosure
US7545644B2 (en) * 2006-05-16 2009-06-09 Georgia Tech Research Corporation Nano-patch thermal management devices, methods, & systems
US7378618B1 (en) * 2006-12-14 2008-05-27 Applied Materials, Inc. Rapid conductive cooling using a secondary process plane
US7729108B2 (en) * 2007-12-11 2010-06-01 Dell Products, Lp Information handling systems having coatings with porous particles and processes of forming the same
US20090154113A1 (en) * 2007-12-12 2009-06-18 Inter Corporation Thermal energy storage for mobile computing thermal management
JP4678025B2 (ja) 2007-12-17 2011-04-27 カシオ計算機株式会社 反応装置及び電子機器
JP2011509452A (ja) * 2007-12-19 2011-03-24 クラスタード システムズ カンパニー 接触冷却される電子モジュールのための冷却システム
EP2151316B1 (en) * 2008-07-31 2012-06-06 E.I. Du Pont De Nemours And Company Multi-film structures for thermal insulation
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US20100083417A1 (en) 2008-10-07 2010-04-08 Argon Technologies, Inc. Thin insulative material with layered gas-filled cellular structure
US8526179B2 (en) * 2008-12-11 2013-09-03 Hewlett-Packard Development Company, L.P. Laptop computer user thermal isolation apparatus
US8950162B2 (en) * 2010-06-02 2015-02-10 Eversealed Windows, Inc. Multi-pane glass unit having seal with adhesive and hermetic coating layer
US8789743B2 (en) * 2011-11-30 2014-07-29 Component Re-Engineering Company, Inc. Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials

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