CN106133634B - 减少触摸温度的方法和设计为减少触摸温度的外表材料 - Google Patents

减少触摸温度的方法和设计为减少触摸温度的外表材料 Download PDF

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Publication number
CN106133634B
CN106133634B CN201580013484.6A CN201580013484A CN106133634B CN 106133634 B CN106133634 B CN 106133634B CN 201580013484 A CN201580013484 A CN 201580013484A CN 106133634 B CN106133634 B CN 106133634B
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China
Prior art keywords
housing
thermally conductive
conductive material
density
thermal conductivity
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Expired - Fee Related
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CN201580013484.6A
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English (en)
Chinese (zh)
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CN106133634A (zh
Inventor
U·瓦达坎马鲁韦杜
J·J·安德森
V·米特
P·王
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Qualcomm Inc
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Qualcomm Inc
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163—Indexing scheme relating to constructional details of the computer
    • G06F2200/1633—Protecting arrangement for the entire housing of the computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201580013484.6A 2014-03-14 2015-03-13 减少触摸温度的方法和设计为减少触摸温度的外表材料 Expired - Fee Related CN106133634B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461953653P 2014-03-14 2014-03-14
US61/953,653 2014-03-14
US14/594,984 US10152099B2 (en) 2014-03-14 2015-01-12 Skin material design to reduce touch temperature
US14/594,984 2015-01-12
PCT/US2015/020559 WO2015138973A1 (en) 2014-03-14 2015-03-13 Skin material design to reduce touch temperature

Publications (2)

Publication Number Publication Date
CN106133634A CN106133634A (zh) 2016-11-16
CN106133634B true CN106133634B (zh) 2019-11-29

Family

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CN201580013484.6A Expired - Fee Related CN106133634B (zh) 2014-03-14 2015-03-13 减少触摸温度的方法和设计为减少触摸温度的外表材料

Country Status (6)

Country Link
US (1) US10152099B2 (enExample)
EP (1) EP3117174B1 (enExample)
JP (1) JP2017513214A (enExample)
KR (1) KR20160132388A (enExample)
CN (1) CN106133634B (enExample)
WO (1) WO2015138973A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12114453B2 (en) * 2019-01-29 2024-10-08 Apple Inc. Core shell with various filler materials for enhanced thermal conductivity
US11379023B2 (en) * 2019-07-15 2022-07-05 Microsoft Technology Licensing, Llc Regulating device surface temperature
CN119663395A (zh) 2020-05-20 2025-03-21 苹果公司 非水性铝阳极化
US12070797B1 (en) 2020-05-20 2024-08-27 Apple Inc. Direct metal deposition of electronic device components
US11716808B2 (en) * 2020-12-10 2023-08-01 International Business Machines Corporation Tamper-respondent assemblies with porous heat transfer element(s)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1942063A (zh) * 2006-01-09 2007-04-04 威盛电子股份有限公司 用于金属机壳的非金属网栅遮盖物
CN101305646A (zh) * 2005-11-07 2008-11-12 3M创新有限公司 热传递涂层
WO2013108312A1 (ja) * 2012-01-16 2013-07-25 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 携帯端末装置
TW201350007A (zh) * 2012-04-12 2013-12-01 高通公司 熱消散特徵，併入有熱消散特徵之電子器件及製造熱消散特徵之方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114736A (ja) * 2004-10-15 2006-04-27 Sumitomo Chemical Co Ltd 携帯電子機器
US20070263352A1 (en) * 2006-05-15 2007-11-15 Motorola, Inc. Plastics Utilizing Thermally Conductive Film
JP2008277432A (ja) * 2007-04-26 2008-11-13 Kaneka Corp 放熱構造体
JP2010251463A (ja) * 2009-04-14 2010-11-04 Asahi Kasei E-Materials Corp 新規吸熱シート
US8800641B2 (en) 2009-06-01 2014-08-12 The Boeing Company Methods and apparatus for a micro-truss based structural insulation layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101305646A (zh) * 2005-11-07 2008-11-12 3M创新有限公司 热传递涂层
CN1942063A (zh) * 2006-01-09 2007-04-04 威盛电子股份有限公司 用于金属机壳的非金属网栅遮盖物
WO2013108312A1 (ja) * 2012-01-16 2013-07-25 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 携帯端末装置
TW201350007A (zh) * 2012-04-12 2013-12-01 高通公司 熱消散特徵，併入有熱消散特徵之電子器件及製造熱消散特徵之方法

Also Published As

Publication number Publication date
WO2015138973A1 (en) 2015-09-17
US10152099B2 (en) 2018-12-11
CN106133634A (zh) 2016-11-16
US20150261267A1 (en) 2015-09-17
JP2017513214A (ja) 2017-05-25
KR20160132388A (ko) 2016-11-18
EP3117174A1 (en) 2017-01-18
EP3117174B1 (en) 2019-09-18

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