KR20160132388A - 터치 온도를 감소시키기 위한 스킨 재료 디자인 - Google Patents

터치 온도를 감소시키기 위한 스킨 재료 디자인 Download PDF

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Publication number
KR20160132388A
KR20160132388A KR1020167024234A KR20167024234A KR20160132388A KR 20160132388 A KR20160132388 A KR 20160132388A KR 1020167024234 A KR1020167024234 A KR 1020167024234A KR 20167024234 A KR20167024234 A KR 20167024234A KR 20160132388 A KR20160132388 A KR 20160132388A
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KR
South Korea
Prior art keywords
housing
conductive material
thermally conductive
density
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020167024234A
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English (en)
Korean (ko)
Inventor
운니크리쉬난 바다칸마루베두
존 제임스 앤더슨
비나이 미터
펑 왕
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20160132388A publication Critical patent/KR20160132388A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163—Indexing scheme relating to constructional details of the computer
    • G06F2200/1633—Protecting arrangement for the entire housing of the computer
    • Y02B60/1275—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020167024234A 2014-03-14 2015-03-13 터치 온도를 감소시키기 위한 스킨 재료 디자인 Withdrawn KR20160132388A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461953653P 2014-03-14 2014-03-14
US61/953,653 2014-03-14
US14/594,984 2015-01-12
US14/594,984 US10152099B2 (en) 2014-03-14 2015-01-12 Skin material design to reduce touch temperature
PCT/US2015/020559 WO2015138973A1 (en) 2014-03-14 2015-03-13 Skin material design to reduce touch temperature

Publications (1)

Publication Number Publication Date
KR20160132388A true KR20160132388A (ko) 2016-11-18

Family

ID=54068815

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167024234A Withdrawn KR20160132388A (ko) 2014-03-14 2015-03-13 터치 온도를 감소시키기 위한 스킨 재료 디자인

Country Status (6)

Country Link
US (1) US10152099B2 (enExample)
EP (1) EP3117174B1 (enExample)
JP (1) JP2017513214A (enExample)
KR (1) KR20160132388A (enExample)
CN (1) CN106133634B (enExample)
WO (1) WO2015138973A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12114453B2 (en) * 2019-01-29 2024-10-08 Apple Inc. Core shell with various filler materials for enhanced thermal conductivity
US11379023B2 (en) * 2019-07-15 2022-07-05 Microsoft Technology Licensing, Llc Regulating device surface temperature
CN119663395A (zh) 2020-05-20 2025-03-21 苹果公司 非水性铝阳极化
US12070797B1 (en) 2020-05-20 2024-08-27 Apple Inc. Direct metal deposition of electronic device components
US11716808B2 (en) * 2020-12-10 2023-08-01 International Business Machines Corporation Tamper-respondent assemblies with porous heat transfer element(s)
TWI816423B (zh) 2022-06-08 2023-09-21 和碩聯合科技股份有限公司 穿戴裝置及其製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114736A (ja) * 2004-10-15 2006-04-27 Sumitomo Chemical Co Ltd 携帯電子機器
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
US7355849B2 (en) * 2006-01-09 2008-04-08 Via Technologies, Inc. Of R.O.C. Non-metal mesh cover for metal chassis
US20070263352A1 (en) * 2006-05-15 2007-11-15 Motorola, Inc. Plastics Utilizing Thermally Conductive Film
JP2008277432A (ja) * 2007-04-26 2008-11-13 Kaneka Corp 放熱構造体
JP2010251463A (ja) * 2009-04-14 2010-11-04 Asahi Kasei E-Materials Corp 新規吸熱シート
US8800641B2 (en) 2009-06-01 2014-08-12 The Boeing Company Methods and apparatus for a micro-truss based structural insulation layer
JPWO2013108312A1 (ja) 2012-01-16 2015-05-11 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 携帯端末装置
US9165854B2 (en) * 2012-04-12 2015-10-20 Qualcomm Incorporated Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features

Also Published As

Publication number Publication date
US10152099B2 (en) 2018-12-11
CN106133634B (zh) 2019-11-29
WO2015138973A1 (en) 2015-09-17
EP3117174A1 (en) 2017-01-18
US20150261267A1 (en) 2015-09-17
JP2017513214A (ja) 2017-05-25
EP3117174B1 (en) 2019-09-18
CN106133634A (zh) 2016-11-16

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Date Code Title Description
PA0105 International application

Patent event date: 20160901

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination