JP2017513214A - 接触温度を低減するための表皮材料設計 - Google Patents

接触温度を低減するための表皮材料設計 Download PDF

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Publication number
JP2017513214A
JP2017513214A JP2016555573A JP2016555573A JP2017513214A JP 2017513214 A JP2017513214 A JP 2017513214A JP 2016555573 A JP2016555573 A JP 2016555573A JP 2016555573 A JP2016555573 A JP 2016555573A JP 2017513214 A JP2017513214 A JP 2017513214A
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JP
Japan
Prior art keywords
housing
porous
thermally conductive
conductive material
electronic device
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Pending
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JP2016555573A
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English (en)
Japanese (ja)
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JP2017513214A5 (enExample
Inventor
ウンニクリシュナン・ヴァダッカンマルヴィードゥ
ジョン・ジェームズ・アンダーソン
ヴィナイ・ミッター
ペン・ワン
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クアルコム，インコーポレイテッド
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Publication of JP2017513214A publication Critical patent/JP2017513214A/ja
Publication of JP2017513214A5 publication Critical patent/JP2017513214A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163—Indexing scheme relating to constructional details of the computer
    • G06F2200/1633—Protecting arrangement for the entire housing of the computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2016555573A 2014-03-14 2015-03-13 接触温度を低減するための表皮材料設計 Pending JP2017513214A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201461953653P 2014-03-14 2014-03-14
US61/953,653 2014-03-14
US14/594,984 US10152099B2 (en) 2014-03-14 2015-01-12 Skin material design to reduce touch temperature
US14/594,984 2015-01-12
PCT/US2015/020559 WO2015138973A1 (en) 2014-03-14 2015-03-13 Skin material design to reduce touch temperature

Publications (2)

Publication Number Publication Date
JP2017513214A true JP2017513214A (ja) 2017-05-25
JP2017513214A5 JP2017513214A5 (enExample) 2018-04-05

Family

ID=54068815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016555573A Pending JP2017513214A (ja) 2014-03-14 2015-03-13 接触温度を低減するための表皮材料設計

Country Status (6)

Country Link
US (1) US10152099B2 (enExample)
EP (1) EP3117174B1 (enExample)
JP (1) JP2017513214A (enExample)
KR (1) KR20160132388A (enExample)
CN (1) CN106133634B (enExample)
WO (1) WO2015138973A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12114453B2 (en) * 2019-01-29 2024-10-08 Apple Inc. Core shell with various filler materials for enhanced thermal conductivity
US11379023B2 (en) * 2019-07-15 2022-07-05 Microsoft Technology Licensing, Llc Regulating device surface temperature
CN119663395A (zh) 2020-05-20 2025-03-21 苹果公司 非水性铝阳极化
US12070797B1 (en) 2020-05-20 2024-08-27 Apple Inc. Direct metal deposition of electronic device components
US11716808B2 (en) * 2020-12-10 2023-08-01 International Business Machines Corporation Tamper-respondent assemblies with porous heat transfer element(s)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114736A (ja) * 2004-10-15 2006-04-27 Sumitomo Chemical Co Ltd 携帯電子機器
JP2008277432A (ja) * 2007-04-26 2008-11-13 Kaneka Corp 放熱構造体
JP2010251463A (ja) * 2009-04-14 2010-11-04 Asahi Kasei E-Materials Corp 新規吸熱シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
US7355849B2 (en) * 2006-01-09 2008-04-08 Via Technologies, Inc. Of R.O.C. Non-metal mesh cover for metal chassis
US20070263352A1 (en) * 2006-05-15 2007-11-15 Motorola, Inc. Plastics Utilizing Thermally Conductive Film
US8800641B2 (en) 2009-06-01 2014-08-12 The Boeing Company Methods and apparatus for a micro-truss based structural insulation layer
US20150005043A1 (en) * 2012-01-16 2015-01-01 Nec Casio Modile Communications, Ltd. Portable terminal device
US9165854B2 (en) * 2012-04-12 2015-10-20 Qualcomm Incorporated Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114736A (ja) * 2004-10-15 2006-04-27 Sumitomo Chemical Co Ltd 携帯電子機器
JP2008277432A (ja) * 2007-04-26 2008-11-13 Kaneka Corp 放熱構造体
JP2010251463A (ja) * 2009-04-14 2010-11-04 Asahi Kasei E-Materials Corp 新規吸熱シート

Also Published As

Publication number Publication date
KR20160132388A (ko) 2016-11-18
CN106133634B (zh) 2019-11-29
US20150261267A1 (en) 2015-09-17
US10152099B2 (en) 2018-12-11
EP3117174A1 (en) 2017-01-18
EP3117174B1 (en) 2019-09-18
WO2015138973A1 (en) 2015-09-17
CN106133634A (zh) 2016-11-16

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