JP2017512866A5 - - Google Patents

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Publication number
JP2017512866A5
JP2017512866A5 JP2016559343A JP2016559343A JP2017512866A5 JP 2017512866 A5 JP2017512866 A5 JP 2017512866A5 JP 2016559343 A JP2016559343 A JP 2016559343A JP 2016559343 A JP2016559343 A JP 2016559343A JP 2017512866 A5 JP2017512866 A5 JP 2017512866A5
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JP
Japan
Prior art keywords
composition
polymerizable
group
thiol
ethylenically unsaturated
Prior art date
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Application number
JP2016559343A
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English (en)
Japanese (ja)
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JP6694823B2 (ja
JP2017512866A (ja
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Publication date
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Priority claimed from PCT/US2015/021838 external-priority patent/WO2015148319A1/en
Publication of JP2017512866A publication Critical patent/JP2017512866A/ja
Publication of JP2017512866A5 publication Critical patent/JP2017512866A5/ja
Application granted granted Critical
Publication of JP6694823B2 publication Critical patent/JP6694823B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016559343A 2014-03-27 2015-03-20 有機ホウ素を含む組成物、及びその使用方法 Active JP6694823B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461971352P 2014-03-27 2014-03-27
US61/971,352 2014-03-27
PCT/US2015/021838 WO2015148319A1 (en) 2014-03-27 2015-03-20 Organoborane-containing compositions, and methods of using same

Publications (3)

Publication Number Publication Date
JP2017512866A JP2017512866A (ja) 2017-05-25
JP2017512866A5 true JP2017512866A5 (enExample) 2019-07-25
JP6694823B2 JP6694823B2 (ja) 2020-05-20

Family

ID=52811263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016559343A Active JP6694823B2 (ja) 2014-03-27 2015-03-20 有機ホウ素を含む組成物、及びその使用方法

Country Status (7)

Country Link
US (1) US10513583B2 (enExample)
EP (1) EP3122787B1 (enExample)
JP (1) JP6694823B2 (enExample)
KR (1) KR102335364B1 (enExample)
CN (1) CN106133001B (enExample)
TW (1) TWI659067B (enExample)
WO (1) WO2015148319A1 (enExample)

Families Citing this family (14)

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CN107001861B (zh) 2014-11-14 2020-10-13 3M创新有限公司 两部分粘合剂组合物和制备粘合剂组合物的方法
WO2016101129A1 (en) * 2014-12-23 2016-06-30 Henkel (China) Company Limited 1k high temperature debondable adhesive
US10889687B2 (en) * 2015-09-10 2021-01-12 3M Innovative Properties Company Polymerizable compositions, polymerized compositions, and methods of making and using the same
WO2017177095A1 (en) * 2016-04-07 2017-10-12 Basf Se Dual-curable sealant composition
WO2017177089A1 (en) * 2016-04-07 2017-10-12 Basf Se Curable sealant composition
WO2018077973A1 (en) * 2016-10-27 2018-05-03 Michael Malkoch A composition comprising thiol, alkene and phosphonic acid containing compounds for use as a primer for adhesion improvement
CN110741050B (zh) * 2017-06-14 2021-05-14 综研化学株式会社 涂布用固化性组合物和层叠体
US20210062858A1 (en) * 2017-09-26 2021-03-04 3M Innovative Properties Company Curable sealant compositions, seal cap, and methods of making and using the same
EP3807043A1 (en) * 2018-06-15 2021-04-21 3M Innovative Properties Company Assemblies and methods of making a shim
US11667734B2 (en) 2019-02-14 2023-06-06 Drexel University Oxygen tolerant and room temperature raft through alkylborane initiation
US11015057B2 (en) * 2019-04-03 2021-05-25 Prc-Desoto International, Inc. Dual-cure compositions
FR3098815B1 (fr) * 2019-07-18 2021-06-25 Bostik Sa Procédé de polymérisation avec un complexe de borane-amine
FR3104588B1 (fr) 2019-12-17 2021-12-24 Chryso Composés fluidifiants pour compositions hydrauliques
CN116735784A (zh) * 2023-06-14 2023-09-12 北京林业大学 一种定量检测微塑料的方法

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JP5039567B2 (ja) 2005-02-16 2012-10-03 ダウ・コーニング・コーポレイション ポリマー粒子、および、有機ボランアミン錯体を用いた封入(encapsulated)組成物
US8742050B2 (en) * 2008-03-28 2014-06-03 Henkel US IP LLC Two part hybrid adhesive
WO2010091001A1 (en) * 2009-02-04 2010-08-12 Dow Corning Corporation Method of forming a non-random copolymer
KR101760530B1 (ko) 2009-06-26 2017-07-31 바스프 에스이 페인트 코팅계 및 다층 페인트 코팅의 제조 방법
AU2010264690B2 (en) 2009-06-26 2015-12-24 Basf Se Method of forming a cured coating composition on an automobile component
US8835915B2 (en) 2010-11-22 2014-09-16 3M Innovative Properties Company Assembly and electronic devices including the same
US20130261228A1 (en) 2010-12-17 2013-10-03 Dow Global Technologies Llc Curable compositions

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