JP2017512331A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017512331A5 JP2017512331A5 JP2016549733A JP2016549733A JP2017512331A5 JP 2017512331 A5 JP2017512331 A5 JP 2017512331A5 JP 2016549733 A JP2016549733 A JP 2016549733A JP 2016549733 A JP2016549733 A JP 2016549733A JP 2017512331 A5 JP2017512331 A5 JP 2017512331A5
- Authority
- JP
- Japan
- Prior art keywords
- expected
- route
- endpoint
- routes
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 14
- 239000011159 matrix material Substances 0.000 claims 5
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/175,429 | 2014-02-07 | ||
| US14/175,429 US20150227667A1 (en) | 2014-02-07 | 2014-02-07 | Temperature-based wire routing |
| PCT/US2015/014770 WO2015120244A1 (en) | 2014-02-07 | 2015-02-06 | Temperature-based wire routing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017512331A JP2017512331A (ja) | 2017-05-18 |
| JP2017512331A5 true JP2017512331A5 (enExample) | 2018-03-08 |
Family
ID=52577974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016549733A Pending JP2017512331A (ja) | 2014-02-07 | 2015-02-06 | 温度ベースのワイヤルーティング |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150227667A1 (enExample) |
| EP (1) | EP3103041A1 (enExample) |
| JP (1) | JP2017512331A (enExample) |
| CN (1) | CN106030584A (enExample) |
| WO (1) | WO2015120244A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018057454A1 (en) * | 2016-09-20 | 2018-03-29 | Octavo Systems Llc | Method for routing bond wires in system in a package (sip) devices |
| US10515181B2 (en) * | 2017-05-10 | 2019-12-24 | International Business Machines Corporation | Integrated circuit identification |
| CN119528602B (zh) * | 2025-01-22 | 2025-05-23 | 成都工业学院 | 多孔碳化硅-碳化硼陶瓷基复合材料的致密化生产工艺 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3986717B2 (ja) | 1999-12-01 | 2007-10-03 | 富士通株式会社 | パス決定方法及び記憶媒体 |
| US6766502B1 (en) * | 1999-12-30 | 2004-07-20 | Intel Corporation | Method and apparatus for routing using deferred merging |
| EP1754986B1 (en) * | 2002-04-01 | 2012-12-05 | Ibiden Co., Ltd. | Optical communication device and optical communication device manufacturing method |
| JP2005141679A (ja) * | 2003-11-10 | 2005-06-02 | Toshiba Microelectronics Corp | 半導体集積回路装置、半導体集積回路装置のレイアウト方法および半導体集積回路装置のレイアウト設計プログラム |
| US7155686B2 (en) | 2004-03-09 | 2006-12-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Placement and routing method to reduce Joule heating |
| US7725861B2 (en) | 2006-05-15 | 2010-05-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method, apparatus, and system for LPC hot spot fix |
| US8104007B2 (en) * | 2008-06-24 | 2012-01-24 | Cadence Design Systems, Inc. | Method and apparatus for thermal analysis |
| JP5390168B2 (ja) | 2008-11-10 | 2014-01-15 | ルネサスエレクトロニクス株式会社 | 配線のレイアウト方法及びプログラム |
-
2014
- 2014-02-07 US US14/175,429 patent/US20150227667A1/en not_active Abandoned
-
2015
- 2015-02-06 CN CN201580006885.9A patent/CN106030584A/zh active Pending
- 2015-02-06 WO PCT/US2015/014770 patent/WO2015120244A1/en not_active Ceased
- 2015-02-06 EP EP15706324.9A patent/EP3103041A1/en not_active Withdrawn
- 2015-02-06 JP JP2016549733A patent/JP2017512331A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017512331A5 (enExample) | ||
| RU2016111099A (ru) | Способ и устройство для вывоза такси | |
| JP2017506386A5 (enExample) | ||
| RU2018135300A (ru) | Выбор ресурса для обмена данными транспортным средством с транспортным средством или инфраструктурой (v2x) | |
| JP2016508003A5 (enExample) | ||
| EP2981895A4 (en) | RRAM AND METHOD FOR STORING AND RECALLING INFORMATION FOR THE RRAM | |
| EP2722740A3 (en) | Touch screen panel | |
| JP2014131041A5 (enExample) | ||
| RU2017107456A (ru) | Способ и аппарат для получения информации о местоположении | |
| HK1225785A1 (zh) | 选择路由 | |
| WO2018075388A3 (en) | ENHANCED LOGISTIC MANAGEMENT SYSTEM | |
| WO2013071254A3 (en) | Circuit and method for generating a reference level for a magnetic random access memory element | |
| RU2016113285A (ru) | Терминальное устройство с функцией идентификации отпечатка пальца | |
| CN105097778A (zh) | 用于改进斜坡电流测试检测能力的通孔阵列测试结构 | |
| JP2016057616A5 (enExample) | ||
| MX2018015701A (es) | Metodo de rastreo de objetos y aparato de rastreo de objetos. | |
| MX2019000101A (es) | Recoleccion de informacion a partir de usuario de sistemas de computadora. | |
| GB2497041A9 (en) | Method, program, and device for grouping pluralityof elements | |
| WO2015104638A3 (en) | Systems and methods for destriping seismic data | |
| EP2829960A3 (en) | Touch screen panel and fabricating method thereof | |
| RU2017125242A (ru) | Способ и система для уточненного позиционирования через пересечение гиперзон | |
| MX362272B (es) | Ajuste de la fabricacion de elementos computacionales integrados. | |
| JP2013195155A5 (ja) | 電子装置、プログラム及び経路探索方法 | |
| TW201829996A (zh) | 無線壓力偵測器、無線壓力量測系統及壓力量測方法 | |
| WO2014195806A3 (en) | Methods and systems for insertion of spare wiring structures for improved engineering change orders |