JP2017512331A5 - - Google Patents

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Publication number
JP2017512331A5
JP2017512331A5 JP2016549733A JP2016549733A JP2017512331A5 JP 2017512331 A5 JP2017512331 A5 JP 2017512331A5 JP 2016549733 A JP2016549733 A JP 2016549733A JP 2016549733 A JP2016549733 A JP 2016549733A JP 2017512331 A5 JP2017512331 A5 JP 2017512331A5
Authority
JP
Japan
Prior art keywords
expected
route
endpoint
routes
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016549733A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017512331A (ja
Filing date
Publication date
Priority claimed from US14/175,429 external-priority patent/US20150227667A1/en
Application filed filed Critical
Publication of JP2017512331A publication Critical patent/JP2017512331A/ja
Publication of JP2017512331A5 publication Critical patent/JP2017512331A5/ja
Pending legal-status Critical Current

Links

JP2016549733A 2014-02-07 2015-02-06 温度ベースのワイヤルーティング Pending JP2017512331A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/175,429 2014-02-07
US14/175,429 US20150227667A1 (en) 2014-02-07 2014-02-07 Temperature-based wire routing
PCT/US2015/014770 WO2015120244A1 (en) 2014-02-07 2015-02-06 Temperature-based wire routing

Publications (2)

Publication Number Publication Date
JP2017512331A JP2017512331A (ja) 2017-05-18
JP2017512331A5 true JP2017512331A5 (enExample) 2018-03-08

Family

ID=52577974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016549733A Pending JP2017512331A (ja) 2014-02-07 2015-02-06 温度ベースのワイヤルーティング

Country Status (5)

Country Link
US (1) US20150227667A1 (enExample)
EP (1) EP3103041A1 (enExample)
JP (1) JP2017512331A (enExample)
CN (1) CN106030584A (enExample)
WO (1) WO2015120244A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018057454A1 (en) * 2016-09-20 2018-03-29 Octavo Systems Llc Method for routing bond wires in system in a package (sip) devices
US10515181B2 (en) * 2017-05-10 2019-12-24 International Business Machines Corporation Integrated circuit identification
CN119528602B (zh) * 2025-01-22 2025-05-23 成都工业学院 多孔碳化硅-碳化硼陶瓷基复合材料的致密化生产工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3986717B2 (ja) 1999-12-01 2007-10-03 富士通株式会社 パス決定方法及び記憶媒体
US6766502B1 (en) * 1999-12-30 2004-07-20 Intel Corporation Method and apparatus for routing using deferred merging
EP1754986B1 (en) * 2002-04-01 2012-12-05 Ibiden Co., Ltd. Optical communication device and optical communication device manufacturing method
JP2005141679A (ja) * 2003-11-10 2005-06-02 Toshiba Microelectronics Corp 半導体集積回路装置、半導体集積回路装置のレイアウト方法および半導体集積回路装置のレイアウト設計プログラム
US7155686B2 (en) 2004-03-09 2006-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Placement and routing method to reduce Joule heating
US7725861B2 (en) 2006-05-15 2010-05-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method, apparatus, and system for LPC hot spot fix
US8104007B2 (en) * 2008-06-24 2012-01-24 Cadence Design Systems, Inc. Method and apparatus for thermal analysis
JP5390168B2 (ja) 2008-11-10 2014-01-15 ルネサスエレクトロニクス株式会社 配線のレイアウト方法及びプログラム

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