CN106030584A - 基于温度的导线布线 - Google Patents

基于温度的导线布线 Download PDF

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Publication number
CN106030584A
CN106030584A CN201580006885.9A CN201580006885A CN106030584A CN 106030584 A CN106030584 A CN 106030584A CN 201580006885 A CN201580006885 A CN 201580006885A CN 106030584 A CN106030584 A CN 106030584A
Authority
CN
China
Prior art keywords
prospective
temperature
lines
line
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580006885.9A
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English (en)
Chinese (zh)
Inventor
C·刘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN106030584A publication Critical patent/CN106030584A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/12—Timing analysis or timing optimisation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201580006885.9A 2014-02-07 2015-02-06 基于温度的导线布线 Pending CN106030584A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/175,429 2014-02-07
US14/175,429 US20150227667A1 (en) 2014-02-07 2014-02-07 Temperature-based wire routing
PCT/US2015/014770 WO2015120244A1 (en) 2014-02-07 2015-02-06 Temperature-based wire routing

Publications (1)

Publication Number Publication Date
CN106030584A true CN106030584A (zh) 2016-10-12

Family

ID=52577974

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580006885.9A Pending CN106030584A (zh) 2014-02-07 2015-02-06 基于温度的导线布线

Country Status (5)

Country Link
US (1) US20150227667A1 (enExample)
EP (1) EP3103041A1 (enExample)
JP (1) JP2017512331A (enExample)
CN (1) CN106030584A (enExample)
WO (1) WO2015120244A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11157676B2 (en) * 2016-09-20 2021-10-26 Octavo Systems Llc Method for routing bond wires in system in a package (SiP) devices
US10515181B2 (en) * 2017-05-10 2019-12-24 International Business Machines Corporation Integrated circuit identification
CN119528602B (zh) * 2025-01-22 2025-05-23 成都工业学院 多孔碳化硅-碳化硼陶瓷基复合材料的致密化生产工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6766502B1 (en) * 1999-12-30 2004-07-20 Intel Corporation Method and apparatus for routing using deferred merging
CN1619550A (zh) * 2003-11-10 2005-05-25 株式会社东芝 具有倾斜布线的半导体集成电路、及其布图方法和布图设计程序
US20060012967A1 (en) * 2002-04-01 2006-01-19 Ibiden Co., Ltd. Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
US20090319964A1 (en) * 2008-06-24 2009-12-24 Vinod Kariat Method and apparatus for thermal analysis

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3986717B2 (ja) 1999-12-01 2007-10-03 富士通株式会社 パス決定方法及び記憶媒体
US7155686B2 (en) 2004-03-09 2006-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Placement and routing method to reduce Joule heating
US7725861B2 (en) 2006-05-15 2010-05-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method, apparatus, and system for LPC hot spot fix
JP5390168B2 (ja) 2008-11-10 2014-01-15 ルネサスエレクトロニクス株式会社 配線のレイアウト方法及びプログラム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6766502B1 (en) * 1999-12-30 2004-07-20 Intel Corporation Method and apparatus for routing using deferred merging
US20060012967A1 (en) * 2002-04-01 2006-01-19 Ibiden Co., Ltd. Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
CN1619550A (zh) * 2003-11-10 2005-05-25 株式会社东芝 具有倾斜布线的半导体集成电路、及其布图方法和布图设计程序
US20090319964A1 (en) * 2008-06-24 2009-12-24 Vinod Kariat Method and apparatus for thermal analysis

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHUNCHEN LIU等: "Temperature-Aware Clock Tree Synthesis Considering Spatiotemporal Hot Spot Correlations", 《2008 IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN》 *
TIANPEI ZHANG等: "Temperature-Aware Routing in 3D ICs", 《DESIGN AUTOMATION ON，2006. ASIA AND SOUTH PACIFIC CONFERENCE ON》 *

Also Published As

Publication number Publication date
WO2015120244A1 (en) 2015-08-13
EP3103041A1 (en) 2016-12-14
JP2017512331A (ja) 2017-05-18
US20150227667A1 (en) 2015-08-13

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Application publication date: 20161012

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