JP2017511682A - 物体を保持、位置決めおよび/または移動させるための装置 - Google Patents
物体を保持、位置決めおよび/または移動させるための装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Magnetic Bearings And Hydrostatic Bearings (AREA)
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Abstract
Description
10 磁気支承装置
11 制御回路
12 電磁石
14 鉄心
16 コイル
18 相手方部材
20 距離センサ
21 振動減衰部
22 コントローラ
23 振動減衰部
24 増幅器
25 設定値発信器
26 間隔
28 運動センサ
30 基礎
31 搬送方向
32 案内区間
34 案内区間
35 駆動装置
36 駆動ユニット
38 データ伝送装置
40 制御装置
50 支持体
52 物体
Claims (15)
- 少なくとも1個の制御可能な磁気支承装置(10)と、
基礎(30)と、支持体(50)とを具備し、前記支持体(50)が少なくとも1個の前記磁気支承装置(10)によって前記基礎(30)上で非接触支承され、
前記磁気支承装置(10)が電磁石(12)と、この電磁石(12)と磁気的に相互作用する相手方部材(18)と、距離センサ(20)とコントローラ(22)を有する制御回路(11)とを備え、前記電磁石(12)が前記制御回路(11)によって、前記基礎(30)と前記支持体(50)の間の設定された間隔(26)を維持するために制御可能であり、そして
前記制御回路(11)が前記基礎(30)または前記支持体(50)に配置された少なくとも1個の運動センサ(28)に接続されている、
物体(52)を保持、位置決めおよび/または移動させるための装置。 - 前記運動センサ(28)が前記制御回路(11)の前記コントローラ(22)に接続されている、請求項1に記載の装置。
- 前記運動センサ(28)が前記制御回路(11)の振動減衰部(21、23)に接続されている、請求項1または2に記載の装置。
- 前記電磁石(12)が前記基礎(30)または前記支持体(50)に配置され、これに対応して前記相手方部材(18)が前記支持体(50)または前記基礎(30)に配置されている、請求項1〜3のいずれか一項に記載の装置。
- 前記運動センサ(28)が前記電磁石(12)と共に前記基礎(30)または前記支持体(50)に配置されている、請求項1〜4のいずれか一項に記載の装置。
- 前記運動センサ(28)が加速度センサとしてまたは速度センサとして形成されている、請求項1〜5のいずれか一項に記載の装置。
- 前記装置が互いに離隔配置された多数の磁気支承装置(10)を備えている、請求項1〜6のいずれか一項に記載の装置。
- 前記各磁気支承装置(10)に少なくとも1個の運動センサ(28)が付設されているかあるいは前記各磁気支承装置(10)が1個の運動センサ(28)を備えている、請求項7に記載の装置。
- 前記基礎(30)と前記支持体(50)の少なくとも一方に、少なくとも2個の運動センサ(10)が配置されている、請求項1〜8のいずれか一項に記載の装置。
- さらに、中央制御装置(40)を具備し、この中央制御装置が少なくとも2個の前記磁気支承装置(10)と少なくとも1個の前記運動センサ(10)に接続されている、請求項7〜9のいずれか一項に記載の装置。
- 前記運動センサ(28)の数が前記磁気支承装置(10)の数よりも少ない、請求項7〜10のいずれか一項に記載の装置。
- 少なくとも1個の前記運動センサ(10)が前記基礎(30)または前記支持体(50)の固有振動の振幅零の点の範囲に配置されている、請求項1〜11のいずれか一項に記載の装置。
- 少なくとも1個の前記運動センサ(10)が前記基礎(30)または前記支持体(50)の固有振動の振幅零の点の外側に配置されている、請求項1〜12のいずれか一項に記載の装置。
- 設定された間隔(26)で支持体(50)を基礎(30)上で非接触支承するために、距離センサ(20)から提供された間隔信号に依存して少なくとも1個の磁気支承装置(10)の電磁石(12)を制御するステップと、
少なくとも1個の運動センサ(28)を用いて、前記基礎(30)と前記支持体(50)の少なくとも一方の運動状態を検出するステップと、
前記基礎(30)または前記支持体(50)の設定された運動状態を維持するために、検出された前記運動状態に依存して前記電磁石(12)を制御するステップと
を有する、請求項1〜13のいずれか一項に記載の装置を用いて、物体(52)を非接触支承するための方法。 - 設定された間隔(26)で支持体(50)を基礎(30)上で非接触支承するために、距離センサ(20)から提供された間隔信号に依存して少なくとも1個の磁気支承装置(10)の電磁石(12)を制御するためのプログラム手段と、
少なくとも1個の運動センサ(28)を用いて、前記基礎(30)と前記支持体(50)の少なくとも一方の運動状態を検出するためのプログラム手段と、
前記基礎(30)または前記支持体(50)の設定された運動状態を維持するために、検出された前記運動状態に依存して前記電磁石(12)を制御するためのプログラム手段と
を有する、請求項1〜11のいずれか一項に記載の装置を制御するためのコンピュータプログラム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102014005547.7A DE102014005547B4 (de) | 2014-04-16 | 2014-04-16 | Vorrichtung und Verfahren zum Halten, Positionieren und/oder Bewegen eines Objekts |
DE102014005547.7 | 2014-04-16 | ||
PCT/EP2015/058092 WO2015158725A1 (de) | 2014-04-16 | 2015-04-14 | Vorrichtung zum halten, positionieren und/oder bewegen eines objekts |
Publications (3)
Publication Number | Publication Date |
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JP2017511682A true JP2017511682A (ja) | 2017-04-20 |
JP2017511682A5 JP2017511682A5 (ja) | 2018-04-05 |
JP6605495B2 JP6605495B2 (ja) | 2019-11-13 |
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JP2016562777A Active JP6605495B2 (ja) | 2014-04-16 | 2015-04-14 | 物体を保持、位置決めおよび/または移動させるための装置 |
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JP (1) | JP6605495B2 (ja) |
KR (1) | KR101892138B1 (ja) |
DE (1) | DE102014005547B4 (ja) |
WO (1) | WO2015158725A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019532486A (ja) * | 2017-08-24 | 2019-11-07 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空処理システムにおけるデバイスの非接触搬送用の装置及び方法 |
JP2019533896A (ja) * | 2017-09-15 | 2019-11-21 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | キャリア浮揚システムの整列を判断する方法 |
Families Citing this family (7)
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DE102015016081A1 (de) * | 2015-12-10 | 2017-06-14 | Applied Materials, Inc. (N.D.Ges.D. Staates Delaware) | Verschluss- oder Schleusenvorrichtung für eine Vakuumkammer |
US11029612B2 (en) * | 2017-03-16 | 2021-06-08 | Asml Netherlands B.V. | Bearing device, magnetic gravity compensator, vibration isolation system, lithographic apparatus, and method to control a gravity compensator having a negative stiffness |
KR102253018B1 (ko) * | 2017-10-25 | 2021-05-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 진공 챔버 내에서 사용하기 위한 캐리어, 진공 챔버 내의 이송 어레인지먼트를 테스트하기 위한 시스템, 진공 프로세싱 시스템, 및 진공 챔버 내의 이송 어레인지먼트를 테스트하기 위한 방법 |
CN109801868A (zh) * | 2019-01-15 | 2019-05-24 | 严光能 | 芯片转移装置及其制作方法、led芯片转移方法 |
KR20210134015A (ko) * | 2019-03-01 | 2021-11-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 자기 부상 시스템, 자기 부상 시스템을 위한 캐리어, 및 자기 부상 시스템을 동작시키는 방법 |
WO2020253937A1 (en) * | 2019-06-17 | 2020-12-24 | Applied Materials, Inc. | Magnetic levitation system and method of levitating a carrier |
CN110676210B (zh) * | 2019-09-04 | 2021-11-26 | 深圳市晨兴达电子有限公司 | 一种芯片固定装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07107779A (ja) * | 1993-09-30 | 1995-04-21 | Ebara Corp | 停止位置決め装置 |
JP2000182931A (ja) * | 1998-12-16 | 2000-06-30 | Nikon Corp | 露光装置 |
JP2001352746A (ja) * | 2000-06-08 | 2001-12-21 | Mitsui High Tec Inc | リニアモータ |
JP2003120747A (ja) * | 2001-10-12 | 2003-04-23 | Canon Inc | 除振装置及び露光装置 |
JP2009284567A (ja) * | 2008-05-19 | 2009-12-03 | Yaskawa Electric Corp | 磁気浮上制御装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4415248A1 (de) * | 1994-04-30 | 1995-11-02 | Horst Dipl Ing Loeffler | Magnetlager mit integrierten Sensoren zur berührungslosen Führung gegeneinander bewegter Teile |
JP2001257143A (ja) * | 2000-03-09 | 2001-09-21 | Nikon Corp | ステージ装置及び露光装置、並びにデバイス製造方法 |
JP2004193425A (ja) * | 2002-12-12 | 2004-07-08 | Nikon Corp | 移動制御方法及び装置、露光装置、並びにデバイス製造方法 |
KR100745371B1 (ko) | 2006-10-23 | 2007-08-02 | 삼성전자주식회사 | 자기부상형 웨이퍼 스테이지 |
DE202008017717U1 (de) * | 2008-05-13 | 2010-09-23 | Mecatronix Gmbh | Vorrichtung zum Schweben, Transportieren und/oder Positionieren von mit Gütern beladenen Carriern |
TWI526787B (zh) * | 2009-05-15 | 2016-03-21 | 尼康股份有限公司 | A moving body device, a power transmission device, and an exposure device, and a device manufacturing method |
DE102009038756A1 (de) * | 2009-05-28 | 2010-12-09 | Semilev Gmbh | Vorrichtung zur partikelfreien Handhabung von Substraten |
-
2014
- 2014-04-16 DE DE102014005547.7A patent/DE102014005547B4/de not_active Expired - Fee Related
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2015
- 2015-04-14 WO PCT/EP2015/058092 patent/WO2015158725A1/de active Application Filing
- 2015-04-14 JP JP2016562777A patent/JP6605495B2/ja active Active
- 2015-04-14 KR KR1020167028696A patent/KR101892138B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07107779A (ja) * | 1993-09-30 | 1995-04-21 | Ebara Corp | 停止位置決め装置 |
JP2000182931A (ja) * | 1998-12-16 | 2000-06-30 | Nikon Corp | 露光装置 |
JP2001352746A (ja) * | 2000-06-08 | 2001-12-21 | Mitsui High Tec Inc | リニアモータ |
JP2003120747A (ja) * | 2001-10-12 | 2003-04-23 | Canon Inc | 除振装置及び露光装置 |
JP2009284567A (ja) * | 2008-05-19 | 2009-12-03 | Yaskawa Electric Corp | 磁気浮上制御装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019532486A (ja) * | 2017-08-24 | 2019-11-07 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空処理システムにおけるデバイスの非接触搬送用の装置及び方法 |
JP2019533896A (ja) * | 2017-09-15 | 2019-11-21 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | キャリア浮揚システムの整列を判断する方法 |
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KR20160145586A (ko) | 2016-12-20 |
DE102014005547A1 (de) | 2015-10-22 |
WO2015158725A1 (de) | 2015-10-22 |
JP6605495B2 (ja) | 2019-11-13 |
DE102014005547B4 (de) | 2016-09-15 |
KR101892138B1 (ko) | 2018-08-27 |
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