JP2017511599A5 - - Google Patents

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Publication number
JP2017511599A5
JP2017511599A5 JP2016556865A JP2016556865A JP2017511599A5 JP 2017511599 A5 JP2017511599 A5 JP 2017511599A5 JP 2016556865 A JP2016556865 A JP 2016556865A JP 2016556865 A JP2016556865 A JP 2016556865A JP 2017511599 A5 JP2017511599 A5 JP 2017511599A5
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JP
Japan
Prior art keywords
phosphor
silicone
blend
layer
led package
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JP2016556865A
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English (en)
Japanese (ja)
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JP2017511599A (ja
JP6855245B2 (ja
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Priority claimed from US14/217,831 external-priority patent/US9680067B2/en
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Publication of JP2017511599A publication Critical patent/JP2017511599A/ja
Publication of JP2017511599A5 publication Critical patent/JP2017511599A5/ja
Application granted granted Critical
Publication of JP6855245B2 publication Critical patent/JP6855245B2/ja
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JP2016556865A 2014-03-18 2015-02-23 蛍光体充填ledパッケージ Active JP6855245B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/217,831 US9680067B2 (en) 2014-03-18 2014-03-18 Heavily phosphor loaded LED packages having higher stability
US14/217,831 2014-03-18
PCT/US2015/017010 WO2015142478A1 (en) 2014-03-18 2015-02-23 Heavily phosphor loaded led package

Publications (3)

Publication Number Publication Date
JP2017511599A JP2017511599A (ja) 2017-04-20
JP2017511599A5 true JP2017511599A5 (https=) 2018-03-22
JP6855245B2 JP6855245B2 (ja) 2021-04-07

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ID=52596638

Family Applications (1)

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JP2016556865A Active JP6855245B2 (ja) 2014-03-18 2015-02-23 蛍光体充填ledパッケージ

Country Status (10)

Country Link
US (1) US9680067B2 (https=)
EP (2) EP4332196A3 (https=)
JP (1) JP6855245B2 (https=)
KR (3) KR20220045236A (https=)
CN (2) CN113675322A (https=)
CA (1) CA2942044C (https=)
MX (1) MX2016012013A (https=)
MY (1) MY178038A (https=)
TW (1) TWI657600B (https=)
WO (1) WO2015142478A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9590148B2 (en) * 2014-03-18 2017-03-07 GE Lighting Solutions, LLC Encapsulant modification in heavily phosphor loaded LED packages for improved stability
US9680067B2 (en) 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability
EP3590307B1 (en) 2017-02-28 2023-09-27 Quarkstar LLC Lifetime color stabilization of color-shifting artificial light sources
RU2666578C1 (ru) * 2017-08-08 2018-09-11 Акционерное общество "Центральный научно-исследовательский институт "Электрон" Светоизлучающий диод
EP3752580B1 (en) * 2018-02-12 2021-06-09 Signify Holding B.V. Led light source with fluoride phosphor
US11056625B2 (en) * 2018-02-19 2021-07-06 Creeled, Inc. Clear coating for light emitting device exterior having chemical resistance and related methods
CN109668062A (zh) * 2018-12-11 2019-04-23 业成科技(成都)有限公司 发光二极体面光源结构
JP7638956B2 (ja) * 2019-07-30 2025-03-04 カレント・ライティング・ソルーションズ,エルエルシー 安定なリン光体変換型ledおよびそれを用いたシステム
GB2590450B (en) * 2019-12-18 2022-01-05 Plessey Semiconductors Ltd Light emitting diode precursor

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JP4271747B2 (ja) 1997-07-07 2009-06-03 株式会社朝日ラバー 発光ダイオード用透光性被覆材及び蛍光カラー光源
US6204523B1 (en) 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
KR100923804B1 (ko) 2001-09-03 2009-10-27 파나소닉 주식회사 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법
TWI245436B (en) 2003-10-30 2005-12-11 Kyocera Corp Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
US7497973B2 (en) * 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
WO2006098450A1 (ja) * 2005-03-18 2006-09-21 Mitsubishi Chemical Corporation 発光装置、白色発光装置、照明装置及び画像表示装置
JP2007123390A (ja) * 2005-10-26 2007-05-17 Kyocera Corp 発光装置
US7521728B2 (en) 2006-01-20 2009-04-21 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
KR100785492B1 (ko) 2006-04-17 2007-12-13 한국과학기술원 새로운 조성의 황색 발광 Ce3+부활 실리케이트황색형광체, 그 제조방법 및 상기 형광체를 포함하는 백색발광 다이오드
JP5205724B2 (ja) * 2006-08-04 2013-06-05 日亜化学工業株式会社 発光装置
JP5578597B2 (ja) * 2007-09-03 2014-08-27 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
US8491816B2 (en) 2008-02-07 2013-07-23 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
WO2009118985A2 (en) * 2008-03-25 2009-10-01 Kabushiki Kaisha Toshiba Light emitting device, and method and apparatus for manufacturing same
US9287469B2 (en) * 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
KR101503499B1 (ko) * 2008-09-11 2015-03-18 서울반도체 주식회사 멀티칩 발광 다이오드 패키지
JP2010093132A (ja) 2008-10-09 2010-04-22 Sharp Corp 半導体発光装置およびそれを用いた画像表示装置、液晶表示装置
JP5308773B2 (ja) 2008-10-30 2013-10-09 スタンレー電気株式会社 半導体発光装置
US8039862B2 (en) 2009-03-10 2011-10-18 Nepes Led Corporation White light emitting diode package having enhanced white lighting efficiency and method of making the same
US8058667B2 (en) 2009-03-10 2011-11-15 Nepes Led Corporation Leadframe package for light emitting diode device
JP5423120B2 (ja) 2009-04-17 2014-02-19 三菱化学株式会社 半導体発光装置
JP2011054958A (ja) * 2009-08-06 2011-03-17 Mitsubishi Chemicals Corp 半導体発光装置、並びに画像表示装置及び照明装置
US20110031516A1 (en) 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
US20100276712A1 (en) * 2009-11-03 2010-11-04 Alexander Shaikevitch Light emitting diode with thin multilayer phosphor film
JP5076017B2 (ja) * 2010-08-23 2012-11-21 株式会社東芝 発光装置
JP5861636B2 (ja) * 2010-08-31 2016-02-16 日亜化学工業株式会社 発光装置とその製造方法
JP5622494B2 (ja) 2010-09-09 2014-11-12 スタンレー電気株式会社 発光装置およびその製造方法
WO2012050199A1 (ja) 2010-10-15 2012-04-19 三菱化学株式会社 白色発光装置及び照明器具
DE102010063760B4 (de) 2010-12-21 2022-12-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
CN103328605B (zh) * 2011-01-28 2015-04-08 昭和电工株式会社 包含量子点荧光体的组合物、量子点荧光体分散树脂成型体、包含量子点荧光体的结构物、发光装置、电子设备、机械装置及量子点荧光体分散树脂成型体的制造方法
DE102011003969B4 (de) 2011-02-11 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauelements
JP5762044B2 (ja) * 2011-02-23 2015-08-12 三菱電機株式会社 発光装置及び発光装置群及び製造方法
US8252613B1 (en) 2011-03-23 2012-08-28 General Electric Company Color stable manganese-doped phosphors
EP2503606B1 (en) 2011-03-25 2020-02-26 Samsung Electronics Co., Ltd. Light Emitting Diode, Manufacturing Method Thereof, Light Emitting Diode Module, and Manufacturing Method Thereof
JP5105132B1 (ja) 2011-06-02 2012-12-19 三菱化学株式会社 半導体発光装置、半導体発光システムおよび照明器具
CN103608938B (zh) 2011-06-03 2017-03-08 西铁城电子株式会社 半导体发光装置、展示物照射用照明装置、肉照射用照明装置、蔬菜照射用照明装置、鲜鱼照射用照明装置、一般用照明装置和半导体发光系统
JP5919504B2 (ja) * 2011-06-30 2016-05-18 パナソニックIpマネジメント株式会社 発光装置
DE102011081083A1 (de) 2011-08-17 2013-02-21 Osram Ag Presswerkzeug und verfahren zum pressen eines silikonelements
US8841689B2 (en) * 2012-02-03 2014-09-23 Shin-Etsu Chemical Co., Ltd. Heat-curable silicone resin sheet having phosphor-containing layer and phosphor-free layer, method of producing light emitting device utilizing same and light emitting semiconductor device obtained by the method
US9343441B2 (en) * 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
JP5840540B2 (ja) * 2012-03-15 2016-01-06 株式会社東芝 白色照明装置
DE102012208900A1 (de) 2012-05-25 2013-11-28 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen optoelektronischer Bauelemente und Vorrichtung zum Herstellen optoelektronischer Bauelemente
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
JP2014041993A (ja) * 2012-07-24 2014-03-06 Toyoda Gosei Co Ltd 発光装置及びその製造方法
DE102012213195A1 (de) 2012-07-26 2014-01-30 Osram Gmbh Verfahren zum Belegen einer Oberfläche mit Leuchtstoff
US9761763B2 (en) * 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
US9680067B2 (en) 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability

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