JP2017508019A - レーザー焼結にとって好適な優れた鋳造性/癒合性バランスを可能にするポリアリーレンエーテルケトンケトンの粉末組成物 - Google Patents
レーザー焼結にとって好適な優れた鋳造性/癒合性バランスを可能にするポリアリーレンエーテルケトンケトンの粉末組成物 Download PDFInfo
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- -1 ether ketone ketone Chemical class 0.000 title claims abstract description 26
- 239000000203 mixture Substances 0.000 title claims abstract description 26
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 229920000412 polyarylene Polymers 0.000 title claims abstract description 22
- 238000000149 argon plasma sintering Methods 0.000 title claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 62
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 claims abstract description 6
- 238000003795 desorption Methods 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 76
- 239000000377 silicon dioxide Substances 0.000 claims description 31
- 229920001652 poly(etherketoneketone) Polymers 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 14
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 12
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical group OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 8
- 229920002530 polyetherether ketone Polymers 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 5
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 229920001660 poly(etherketone-etherketoneketone) Polymers 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 238000004581 coalescence Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 230000002209 hydrophobic effect Effects 0.000 description 6
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910021485 fumed silica Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229920011674 Kepstan® 6003 Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 125000004958 1,4-naphthylene group Chemical group 0.000 description 1
- 125000004959 2,6-naphthylene group Chemical group [H]C1=C([H])C2=C([H])C([*:1])=C([H])C([H])=C2C([H])=C1[*:2] 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000037406 food intake Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229910002011 hydrophilic fumed silica Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- IJAPPYDYQCXOEF-UHFFFAOYSA-N phthalazin-1(2H)-one Chemical compound C1=CC=C2C(=O)NN=CC2=C1 IJAPPYDYQCXOEF-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001657 poly(etheretherketoneketone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/03—Powdery paints
- C09D5/033—Powdery paints characterised by the additives
- C09D5/037—Rheology improving agents, e.g. flow control agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
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- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group
- C08G2650/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing oxygen in addition to the ether group containing ketone groups, e.g. polyarylethylketones, PEEK or PEK
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Composite Materials (AREA)
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- Mechanical Engineering (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
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- Processes Of Treating Macromolecular Substances (AREA)
- Paints Or Removers (AREA)
Abstract
Description
(−Ar−X−)及び(−Ar1−Y−)
を有する単位を含み、式中、
Ar及びAr1はそれぞれ、二価芳香族基を意味し、
これらの単位のうちの少ない割合(<10%)を2を超える結合価をもつ基で置き換えて、分岐を導入してもよい。
Ar及びAr1は、好ましくは、1,3−フェニレン、1,4−フェニレン、4,4’−ビフェニレン、1,4−ナフチレン、1,5−ナフチレン、及び2,6−ナフチレンから選択され得、
Xは電子求引基を意味し、好ましくは、カルボニル基及びスルホニル基から選択され得、
Yは酸素原子、硫黄原子、−CH2−及びイソプロピリデンなどのアルキレン基から選択される基を意味する。
式Iの単位を含む、PEEKとしても知られるポリエーテルエーテルケトン
式I
又は
式IIの単位を含む、PEKとしても知られるポリエーテルケトン
式II
又は
式IIIA、式IIIB、及びそれらの混合物の単位を含む、PEKKとしても知られるポリエーテルケトンケトン
式IIIA
式IIIB
並びに、式IVの単位を含む、PEEKKとしても知られるポリエーテルエーテルケトンケトン
式IV
これらの粉末の流動性は、以下の様式で、ガラス漏斗中で決定された。
− 17又は12mmの開口部をもつガラス漏斗(図1)を、周縁から5mmまで粉末で充填する。底部の開口部を指で栓をする。
12mmの漏斗の場合:
de=39.2mm
do=12mm
h=106mm
h1=83mm
並びに、17mmの漏斗の場合:
de=42.0mm
do=17mm
h=112mm
h1=67mm
− 粉末の流下時間をクロノメーターで測定する。
− 流動が起こらない場合、漏斗をスパチュラを用いて軽く叩く。必要な場合、作業を繰り返す。
− 流下時間及びスパチュラで叩いた数を書き留める。
粉末の癒合性を、以下のプロトコルによって評価する。
− 鋼板上への粉末の堆積
− 粉末でコーティングされた板の340℃、15分間の焼成
− オーブンから取り出した後の冷却後のコーティングされた板の観察
テレフタル酸単位とイソフタル酸単位との合計に対して60%のテレフタル酸単位を含有し、粒径が50μmプラス又はマイナス5μmのDv50を有するArkema社のKepstan(登録商標)6003 PL粉末を、100秒間、高速におけるMagimixキッチンブレンダー内で、0.4%のCab−O−Sil(登録商標)TS−610シリカで補充する。
テレフタル酸単位とイソフタル酸単位との合計に対して60%のテレフタル酸単位を含有し、粒径が50μmプラス又はマイナス5μmのDv50を有するArkema社のKepstan(登録商標)6003 PL粉末を、100秒間、高速におけるMagimixキッチンブレンダー内で、0.4%のCab−O−Sil(登録商標)TS−610シリカで補充する。
Magimixブレンダー内で、Arkema社の別のKepstan(登録商標)6003 PL粉末を、0.05%のCab−O−Sil(登録商標)TS−610シリカで、あるいは0.05%のCab−O−Sil(登録商標)M−5シリカの何れかで補充する。
実施例2の3つの試料(補充無し、0.2%の疎水性シリカ(TS−610)による補充、0.2%の親水性シリカ(M−5)による補充)を、3枚の鋼板上に堆積させる。
Claims (9)
- 99.6重量%〜99.99重量%の少なくとも1種のポリアリーレンエーテルケトンの少なくとも1種の粉末と、0.01重量%〜0.4重量%の親水性流動化剤とを含む組成物であって、前記親水性流動化剤が、相対湿度95%における5日間の調整後の0.5%超の質量増加(吸収された水の量)によって特徴付けられ、流動化剤の前記質量増加が、170℃における15分間の処理による水の脱離後にカールフィッシャー測定によって決定される、組成物。
- 親水性流動化剤が親水性シリカである、請求項1に記載の組成物。
- 少なくとも1種のポリアリーレンエーテルケトンがPEKKである、請求項1に記載の組成物。
- PEKKが、テレフタル酸単位とイソフタル酸単位との合計に対して55%〜85%のテレフタル酸単位の質量百分率を有する、請求項3に記載の組成物。
- PEKKに加えて、異なる化学構造のPEK、PEEKEK、PEEK、PEKEKK又はPEKK粉末が添加され、PEKKが50質量%超に相当し、限界値は含まれる、請求項3に記載の組成物。
- 充填剤を含有する、請求項1に記載の組成物。
- 少なくとも1種の添加剤を含有する、請求項1に記載の組成物。
- レーザー焼結プロセスにおける、請求項1から7の何れか一項に記載の組成物の使用。
- 請求項1から7の何れか一項に記載の組成物を用いて得られる物体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1363201A FR3015506B1 (fr) | 2013-12-20 | 2013-12-20 | Composition de poudres de poly-arylene-ether-cetone-cetones autorisant un excellent compromis coulabilite et coalescence adaptees au frittage laser |
FR1363201 | 2013-12-20 | ||
PCT/FR2014/053386 WO2015092272A1 (fr) | 2013-12-20 | 2014-12-17 | Composition de poudres de poly-arylene-ether-cetone-cetones autorisant un excellent compromis coulabilite et coalescence adaptees au frittage laser |
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JP2020534185A (ja) * | 2017-09-15 | 2020-11-26 | アーケマ・インコーポレイテッド | Pekk押出積層造形法及び製品 |
JP2021507077A (ja) * | 2017-12-20 | 2021-02-22 | ソルベイ スペシャルティ ポリマーズ ユーエスエー, エルエルシー | 少なくとも1種のPEEK−PEmEKコポリマーを含むポリマー組成物の層を印刷することを含む、造形品を製造する方法 |
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FR3029830B1 (fr) * | 2014-12-16 | 2017-07-28 | Arkema France | Procede de fabrication d'un objet par fusion d'une poudre de polymere dans un dispositif de frittage de poudre |
US11186717B2 (en) | 2015-12-21 | 2021-11-30 | Shpp Global Technologies B.V. | Enhanced powder flow and melt flow of polymers for additive manufacturing applications |
US11998977B2 (en) | 2018-03-15 | 2024-06-04 | Hewlett-Packard Development Company, L.P. | Build material composition with metal powder and freeze-dried heteropolymer |
EP3659785A1 (en) * | 2018-11-29 | 2020-06-03 | Ricoh Company, Ltd. | Powder for forming three-dimensional object, forming device, forming method, and powder |
FR3101634B1 (fr) * | 2019-10-08 | 2022-06-03 | Arkema France | Poudre de poly-aryl-éther-cétone(s) chargée, procédé de fabrication et utilisation correspondants |
FR3109848B1 (fr) * | 2020-04-30 | 2022-12-16 | Arkema France | Conducteur isolé apte à être utilisé dans un bobinage, bobinage en dérivant et procédés de fabrication correspondants. |
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JP7246380B2 (ja) | 2017-09-15 | 2023-03-27 | アーケマ・インコーポレイテッド | Pekk押出積層造形法及び製品 |
JP2021507077A (ja) * | 2017-12-20 | 2021-02-22 | ソルベイ スペシャルティ ポリマーズ ユーエスエー, エルエルシー | 少なくとも1種のPEEK−PEmEKコポリマーを含むポリマー組成物の層を印刷することを含む、造形品を製造する方法 |
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FR3015506B1 (fr) | 2017-04-21 |
US20160333190A1 (en) | 2016-11-17 |
US20190040269A1 (en) | 2019-02-07 |
EP3083793A1 (fr) | 2016-10-26 |
JP6591420B2 (ja) | 2019-10-16 |
WO2015092272A1 (fr) | 2015-06-25 |
EP3083793B1 (fr) | 2021-04-07 |
RU2016129183A (ru) | 2018-01-25 |
US11407906B2 (en) | 2022-08-09 |
FR3015506A1 (fr) | 2015-06-26 |
CN106103564B (zh) | 2018-08-14 |
CN106103564A (zh) | 2016-11-09 |
RU2685320C1 (ru) | 2019-04-17 |
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