JP2017505986A - 半導体素子の製造方法、半導体素子、およびフィン型電界効果トランジスタ(FinFET) - Google Patents
半導体素子の製造方法、半導体素子、およびフィン型電界効果トランジスタ(FinFET) Download PDFInfo
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- JP2017505986A JP2017505986A JP2016541277A JP2016541277A JP2017505986A JP 2017505986 A JP2017505986 A JP 2017505986A JP 2016541277 A JP2016541277 A JP 2016541277A JP 2016541277 A JP2016541277 A JP 2016541277A JP 2017505986 A JP2017505986 A JP 2017505986A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 230000005669 field effect Effects 0.000 title claims description 5
- 125000006850 spacer group Chemical group 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000000137 annealing Methods 0.000 claims abstract description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000000407 epitaxy Methods 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- RJCRUVXAWQRZKQ-UHFFFAOYSA-N oxosilicon;silicon Chemical compound [Si].[Si]=O RJCRUVXAWQRZKQ-UHFFFAOYSA-N 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 2
- 229920005591 polysilicon Polymers 0.000 claims description 2
- -1 oxide Chemical compound 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 12
- 239000002019 doping agent Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02694—Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
- H01L29/66818—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the channel being thinned after patterning, e.g. sacrificial oxidation on fin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
Claims (20)
- 半導体素子を製造する方法であって、
少なくとも1つのフィン、ゲート、およびスペーサを備える構造を形成するステップと、
前記構造にアニール処理を施して、前記少なくとも1つのフィンと前記スペーサとの間に隙間を形成するステップと、
前記スペーサと前記少なくとも1つのフィンとの間の前記隙間にエピタキシャル半導体層を成長させるステップと
を含む方法。 - 前記少なくとも1つのフィンがシリコンを含む、請求項1に記載の方法。
- 前記スペーサが、前記構造のソース・ドレイン領域から前記ゲートを絶縁する、請求項1に記載の方法。
- 前記少なくとも1つのフィン、前記スペーサ、および前記ゲートが、シリコン、酸化物、シリコン積層の一部である、埋め込み酸化(box)層上に形成された、請求項1に記載の方法。
- 前記アニール処理が、水素アニール処理である、請求項1に記載の方法。
- 前記アニール処理が、750℃および10トルで5分間施される、請求項5に記載の方法。
- 半導体素子であって、
フィンと、
前記フィン上に形成されたゲートと、
前記ゲートおよび前記フィン上に形成されたスペーサと、
前記素子にアニール処理を施したことによる前記フィンと前記スペーサとの間の隙間に形成されたエピタキシャル層と
を含む半導体素子。 - 前記フィンがシリコンを含む、請求項7に記載の半導体素子。
- 前記スペーサが前記素子に付随するソース・ドレイン領域から前記ゲートを絶縁する、請求項7に記載の半導体素子。
- 前記フィンが埋め込み酸化(box)層上に形成され、前記box層がシリコン・酸化物・シリコン積層の一部である、請求項7に記載の半導体素子。
- 前記アニール処理が、水素アニール処理である、請求項7に記載の半導体素子。
- 前記アニール処理が、750℃および10トルで5分間施される、請求項11に記載の半導体素子。
- フィン型電界効果トランジスタ(FinFET)であって、
複数のシリコン・フィンと、
前記フィンの上方に形成されたゲートと、
前記ゲート、および前記フィンの少なくとも一部の上方に形成されたスペーサと、
前記フィンのそれぞれと前記スペーサとの間の隙間に形成されたエピタキシ層と
を含み、前記隙間が前記トランジスタにアニール処理を施すことにより形成される、
フィン型電界効果トランジスタ(FinFET)。 - 前記スペーサが、前記FinFETのソース・ドレイン領域から前記ゲートを絶縁する、請求項13に記載のFinFET。
- 前記フィンが埋め込み酸化(box)層上に形成され、前記box層がシリコン・酸化物・シリコン積層の一部である、請求項13に記載のFinFET。
- 前記アニール処理が、水素アニール処理である、請求項13に記載のFinFET。
- 前記アニール処理が、750℃および10トルで5分間施される、請求項13に記載のFinFET。
- 前記FinFETがn型素子であり、前記エピタキシ層に関してリンドープ・ポリシリコンが使用される、請求項13に記載のFinFET。
- 前記FinFETがp型素子であり、前記エピタキシ層に関してホウ素が使用される、請求項13に記載のFinFET。
- 前記フィンが前記アニール処理を施されることにより動かされない、請求項13に記載のFinFET。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US14/141,051 US9711645B2 (en) | 2013-12-26 | 2013-12-26 | Method and structure for multigate FinFET device epi-extension junction control by hydrogen treatment |
US14/141,051 | 2013-12-26 | ||
PCT/US2014/060000 WO2015099862A1 (en) | 2013-12-26 | 2014-10-10 | Method and structure for multigate finfet device epi-extension junction control by hydrogen treatment |
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JP2017505986A true JP2017505986A (ja) | 2017-02-23 |
JP6444414B2 JP6444414B2 (ja) | 2018-12-26 |
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JP2016541277A Active JP6444414B2 (ja) | 2013-12-26 | 2014-10-10 | 半導体素子の製造方法、半導体素子、およびフィン型電界効果トランジスタ(FinFET) |
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US (2) | US9711645B2 (ja) |
JP (1) | JP6444414B2 (ja) |
CN (1) | CN105849874B (ja) |
DE (1) | DE112014005373T5 (ja) |
GB (1) | GB2537069B (ja) |
WO (1) | WO2015099862A1 (ja) |
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US9496225B1 (en) | 2016-02-08 | 2016-11-15 | International Business Machines Corporation | Recessed metal liner contact with copper fill |
CN107546127B (zh) * | 2016-06-28 | 2022-06-21 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
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- 2014-10-10 GB GB1612148.5A patent/GB2537069B/en active Active
- 2014-10-10 DE DE112014005373.2T patent/DE112014005373T5/de not_active Ceased
- 2014-10-10 WO PCT/US2014/060000 patent/WO2015099862A1/en active Application Filing
- 2014-10-10 CN CN201480070807.0A patent/CN105849874B/zh active Active
- 2014-10-10 JP JP2016541277A patent/JP6444414B2/ja active Active
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US9853158B2 (en) | 2017-12-26 |
GB201612148D0 (en) | 2016-08-24 |
US9711645B2 (en) | 2017-07-18 |
US20160315183A1 (en) | 2016-10-27 |
GB2537069B (en) | 2017-02-22 |
US20150187577A1 (en) | 2015-07-02 |
CN105849874A (zh) | 2016-08-10 |
DE112014005373T5 (de) | 2016-08-11 |
WO2015099862A1 (en) | 2015-07-02 |
CN105849874B (zh) | 2019-10-11 |
GB2537069A (en) | 2016-10-05 |
JP6444414B2 (ja) | 2018-12-26 |
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