JP2017216467A - Dicing tape, dicing/die-bonding double functioning tape, and semiconductor device manufacturing method by use of dicing/die-bonding double functioning tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dicing tape which can adequately suppress the chip skipping, and allows individual chips to be picked up adequately even with a small rising amount in a pickup step subsequent after that in dicing a semiconductor wafer into small-size chips.SOLUTION: A dicing/die-bonding double functioning tape 1 comprises a base material layer 10, an adhesive layer 20, and an adhesive layer 30 which are laminated in this order. A dicing tape is to be used as the base material layer 10 and the adhesive layer 20 in the dicing/die-bonding double functioning tape. In the dicing tape, a rupture elongation of the adhesive layer 20 before exposure to light is over 140% up to 200%.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a dicing tape (base material layer and adhesive layer) for a dicing die bonding integrated tape in which a base material layer, an adhesive layer and an adhesive layer are laminated in this order.

  In a conventional semiconductor manufacturing process, in order to bond a semiconductor chip separated by dicing to an object to be adhered (for example, a support substrate), a method of applying a die bond tape to the object to be adhered in advance, and applying a die bond paste The method to do was used. In this case, the semiconductor chip is mounted on the support substrate to which the die bond tape or the like is attached, and the semiconductor chip and the support substrate are bonded by curing the die bond tape and the die bond paste. However, this method requires a step of applying or affixing a die bond paste or a die bond tape for each piece in the die bonding step, and has a disadvantage that productivity is inferior.

  In order to improve productivity, a technique of laminating a die bond tape and a dicing tape sequentially on a semiconductor wafer before dicing and dicing has been proposed. Although this method can achieve a significant improvement in productivity in the die bonding process, the semiconductor wafer requires two laminating processes. In addition, depending on the combination of the dicing tape and the die bond tape, there is a problem that a defect occurs in the pickup process after dicing.

  In recent years, in order to further increase productivity, an adhesive sheet (dicing and die bonding integrated tape) that combines the function of fixing a semiconductor wafer in a dicing process and the function of bonding a semiconductor chip to a substrate or the like in the die bonding process has been devised. It was done. A dicing / die bonding integrated tape is an adhesive that bonds a chip-shaped work piece (for example, a semiconductor chip) and an object to be adhered to the work piece (for example, a semiconductor wafer) before dicing. It is used for dicing the workpiece in the pasted state. The semiconductor device manufacturing method using the dicing / die bonding integrated tape has a higher productivity than the method of sequentially laminating the die bonding tape and the dicing tape because the laminating process to the semiconductor wafer is performed only once.

  In addition to this, various dicing tapes used in semiconductor manufacturing have been proposed. For example, the dicing tape described in Patent Document 1 has a feature that a certain degree of fluidity remains in the adhesive even if the adhesive is irradiated with radiation after the dicing process and before the semiconductor chip pickup process. For this reason, when the dicing tape is stretched radially before picking up the semiconductor chip, the gap between the semiconductor chips is sufficiently widened to facilitate image recognition of the semiconductor chip during pick-up (see paragraph [0031] of Patent Document 1). ).

Japanese Patent No. 3495388

  However, if the adhesive used in the dicing tape described above is too strong, there is room for improvement in the machinability in the dicing process, although the fixing strength of the semiconductor chip is excellent. If the cutting performance in the dicing process is insufficient, the pick-up performance of the semiconductor chip tends to be insufficient even if light such as radiation is subsequently irradiated, and it is necessary to set a high push-up amount of the semiconductor chip in the pick-up process. A high push-up amount increases the stress applied to the semiconductor chip at the time of pick-up, and the thinned semiconductor chip (thickness of about 30 to 50 μm) is likely to crack. On the other hand, when the adhesive force of the adhesive is weakened to improve the machinability in the dicing process, the fixing force to the semiconductor chip is reduced. In this case, as the semiconductor chip is reduced in size (one side is about 1 to 5 mm), the problem of chip skipping in the dicing process becomes significant.

  Accordingly, the present invention is a dicing tape for dicing and die bonding integrated tape, which can sufficiently suppress chip jumping when dicing a semiconductor wafer into small-sized chips, and a small push-up amount is sufficient in the subsequent pick-up process. An object of the present invention is to provide a dicing tape that can ensure excellent pickup performance.

  The dicing tape of the present invention is used as a base material layer and an adhesive layer in a dicing die bonding integrated tape in which a base material layer, an adhesive layer and an adhesive layer are laminated in this order, and is an adhesive layer before light irradiation. The elongation at break is greater than 140% and not greater than 200%. In the invention, there is a correlation between the elongation at break of the adhesive layer of the dicing die-bonding integrated tape and the machinability in the dicing process, that is, the elongation at break of the adhesive layer is limited to a predetermined range. This is based on the knowledge of the present inventors that the machinability in the dicing process is improved, and that the subsequent pickup performance is improved.

  When manufacturing a semiconductor device using the integrated tape, dicing the semiconductor wafer with the semiconductor wafer attached to the adhesive layer side, and then reducing the adhesive strength of the adhesive layer of the integrated tape Light is applied to the adhesive layer. By making the breaking elongation of the adhesive layer before light irradiation greater than 140% and not more than 200%, it is possible to realize a sufficiently excellent cutting performance in the dicing process, and even when a small-sized semiconductor chip is used, the chip skips during dicing. Can be suppressed. The excellent machinability in the dicing process contributes to the improvement of the pick-up performance in the subsequent pick-up process, and the push-up amount during pick-up in the die bonding process can be made sufficiently small.

  The dicing tape before light irradiation preferably has a peel strength of 0.8 N / 25 mm to 1.3 N / 25 mm with respect to the SUS substrate. By using a dicing tape having a peel strength before light irradiation in the above range, the adhesive force between the pressure-sensitive adhesive layer and the adhesive layer after light irradiation can be easily adjusted to an appropriate range. Therefore, the pick-up property of the semiconductor chip can be further improved in the pick-up process performed after light irradiation.

  The pressure-sensitive adhesive layer used in the dicing tape has a radiation-curable carbon-carbon double bond-containing group and a hydroxyl group with respect to the main chain and is a main component of the pressure-sensitive adhesive layer, and reacts with the hydroxyl group. The acrylic copolymer is chain-polymerized by irradiation with one or more kinds of light selected from the group consisting of a cross-linking agent having two or more functional groups in one molecule and ultraviolet rays, electron beams and visible rays. It is preferable that the content of the crosslinking agent is 5 to 9 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

  By setting the amount of the crosslinking agent to 5 parts by mass or more, it is easy to maintain the elongation at break of the adhesive layer before light irradiation at a low value, and it is easier to realize excellent machinability during the dicing process. In addition to this, the peel strength between the pressure-sensitive adhesive layer and the adhesive layer can be sufficiently reduced after light irradiation, and the adhesive layer is easily peeled off from the pressure-sensitive adhesive layer even if the protrusion amount in the pickup process is made smaller. On the other hand, by setting the amount of the crosslinking agent to 9 parts by mass or less, it is easy to sufficiently secure the adhesive force of the adhesive layer before the light irradiation, such as peeling of the die bonding sheet and chip fly of a small size semiconductor chip in the dicing process. Defects can be sufficiently suppressed.

  The cross-linking agent is preferably made of an aromatic isocyanate. In this case, even if the dicing / die bonding integrated tape is excessively irradiated with light, an increase in peeling force between the adhesive layer and the adhesive layer after the light irradiation can be sufficiently suppressed. That is, excellent pick-up performance can be secured in the subsequent pick-up process without strictly controlling the light irradiation amount to the integrated tape.

  The content of the photoinitiator in the adhesive layer is 0.5 to 1.5 parts by mass with respect to 100 parts by mass of the acrylic copolymer from the viewpoint of setting the adhesive strength of the adhesive layer after light irradiation to an appropriate range. It is preferable.

  According to the present invention, a dicing tape for dicing and die bonding integrated tape, which can sufficiently suppress chip jumping when a semiconductor wafer is diced into small-sized chips and can be used even in a small pick-up amount in a subsequent pick-up process. A dicing tape that can sufficiently pick up a chip is provided.

1 is a schematic cross-sectional view showing a preferred embodiment of a dicing / die bonding integrated tape according to the present invention. It is sectional drawing which shows suitable one Embodiment of the manufacturing method of the semiconductor device of this invention. It is sectional drawing which shows suitable one Embodiment of the semiconductor device of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant descriptions are omitted. For the convenience of the drawings, the dimensional ratios in the drawings do not necessarily match those described. In this specification, “(meth) acrylic acid” means “acrylic acid” and its corresponding “methacrylic acid”, and “(meth) acrylate” means “acrylate” and its corresponding “methacrylate”. , (Meth) acrylic ester means "acrylic ester" and "methacrylic ester" corresponding thereto.

<Integrated dicing and die bonding tape>
The dicing die bonding integrated tape 1 provides a function as a dicing film for separating a semiconductor wafer into semiconductor chips and an adhesive layer for connecting the separated semiconductor chips to a support substrate. It is the film which has the function to do.

  FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of the dicing die bonding integrated tape of the present invention. The dicing / die bonding integrated tape 1 has a configuration in which a base material layer 10, an adhesive layer 20, and an adhesive layer 30 are laminated in this order. The base material layer 10 and the pressure-sensitive adhesive layer 20 are dicing tapes, and the adhesive layer 30 is a die bonding tape. Hereinafter, each layer constituting the dicing / die bonding integrated tape 1 will be described in detail. In addition, although the case where an ultraviolet-ray is employ | adopted as light irradiated to the adhesion layer 20 is mentioned here, an electron beam and / or a visible light may be employ | adopted instead of an ultraviolet-ray, and an electron beam and / or a visible light may be used with an ultraviolet-ray. It may be adopted.

(Base material layer)
The base material layer 10 is a portion that supports the semiconductor wafer during dicing. As the base material layer 10, a known polymer sheet or polymer tape can be used. As a preferable compound which comprises the base material layer 10, what can be expanded (radial extending | stretching) is mentioned during a die-bonding process. Specifically, polyolefins such as crystalline polypropylene, amorphous polypropylene, high-density polyethylene, medium-density polyethylene, low-density polyethylene, ultra-low-density polyethylene, low-density linear polyethylene, polybutene, and polymethylpentene, ethylene-vinyl acetate Copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, polyurethane Polyester such as polyethylene terephthalate and polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyetherimide, polyamide, wholly aromatic polyamide, polyphenylsulfide, aramid (paper), glass, glass Scan, fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, or these plasticizers, silica, antiblocking, slip agents, and the like mixture obtained by mixing an antistatic agent or the like. Among these mixtures, polypropylene, polyethylene-polypropylene random copolymer, and polyethylene-polypropylene block copolymer have properties such as Young's modulus, stress relaxation, melting point, etc., as well as price and waste material recycling after use. From the viewpoint, it is a more preferable base material because it is a good base material and a surface modification effect by ultraviolet rays is easily obtained. In addition, the base material layer 10 may be composed of one kind of the above components, or may be composed of two or more kinds of components.

  The base material layer 10 may be a single layer, but may have a multilayer structure in which layers made of different materials are laminated as necessary. For example, the base material layer 10 has a layer containing as a main component at least one selected from polypropylene, a polyethylene-polypropylene random copolymer, and a polyethylene-polypropylene block copolymer, and this layer is in contact with the adhesive layer 20. Is preferably provided. The base material layer 10 having a multi-layer structure may be made of a base material layer having different layers by a multi-layer extrusion method, or a tape made by an inflation method, a single-layer extrusion method or the like is bonded using an adhesive. Or it can manufacture by obtaining by the method of pasting together by heat welding. Moreover, in order to control the adhesiveness with the adhesion layer 20 to the base material layer 10, you may perform surface roughening processes, such as a mat | matte process and a corona treatment, as needed.

  The thickness of the base material layer 10 is preferably 50 to 150 μm, more preferably 70 to 140 μm. When the thickness is less than 50 μm, the rigidity of the base material layer 10 is lowered, and when the adhesive layer 20 and the adhesive layer 30 are peeled off, a peeling failure is likely to occur, and the strength of the base material layer 10 itself is reduced. Therefore, the handling of the dicing / die bonding integrated tape 1 is likely to be difficult. On the other hand, if the thickness exceeds 150 μm, the total thickness of the dicing die bonding integrated tape 1 becomes too thick, making it difficult to handle during use or to be stored in a reel shape. Cheap.

(Adhesive layer)
The adhesive layer 20 has a breaking elongation before UV irradiation of more than 140% and 200% or less, preferably 150 to 190%, more preferably 150 to 180%. When the elongation at break prior to UV irradiation is less than 200%, the machinability during the dicing process is good, so that sufficient pick-up performance can be obtained even when the amount of push-up is small during pick-up. In addition, when the breaking elongation before ultraviolet irradiation is 140% or less, the adhesive force of the adhesive layer 20 before ultraviolet irradiation is lowered, and the force for fixing the adherend is weakened. For this reason, ring peeling and chip jump are likely to occur, particularly when dicing a small chip size adherend.

  The adhesive layer 20 contains an acrylic copolymer as a main component, a crosslinking agent, and a photoinitiator. Hereinafter, these components will be described. In addition, the “main component” in the present specification means a component whose content exceeds 50 parts by mass with respect to 100 parts by mass of the composition constituting the target layer.

  The acrylic copolymer has at least a radiation-curable carbon-carbon double bond-containing group and a hydroxyl group with respect to the main chain.

  An acrylic resin or a methacrylic resin (hereinafter referred to as “(meth) acrylic resin”) as an acrylic copolymer may contain an unsaturated bond in the side chain and the resin itself has adhesiveness. There is no limit. By using such a resin, a layer having good pick-up properties can be obtained even if the push-up amount is low. Specifically, the glass transition temperature is −40 ° C. or less, the hydroxyl value is 20 to 150 mgKOH / g, the chain-polymerizable functional group is 0.3 to 1.5 mmol / g, and the acid value is Examples include resins that are not substantially detected and have a weight average molecular weight of 300,000 or more. By using a (meth) acrylic resin satisfying such a structure, the pressure-sensitive adhesive layer 20 having excellent pickup properties can be obtained.

  The (meth) acrylic resin having such characteristics can be obtained by synthesis by a known method. For example, solution polymerization method, suspension polymerization method, emulsion polymerization method, bulk polymerization method, precipitation polymerization method Gas phase polymerization method, plasma polymerization method, supercritical polymerization method and the like are used. As a kind of the polymerization reaction, radical polymerization, cation polymerization, anion polymerization, living radical polymerization, living cation polymerization, living anion polymerization, coordination polymerization, immodal polymerization, and other methods such as ATRP or RAFT can be used. Among these, synthesis by radical polymerization using a solution polymerization method can be compounded using the resin solution obtained by polymerization as it is, in addition to economic efficiency, high reaction rate, ease of polymerization control, etc. It is preferable because of the ease of blending.

  Here, a method for obtaining a (meth) acrylic resin by radical polymerization using a solution polymerization method will be described in detail as an example.

  The monomer used when synthesizing the (meth) acrylic resin is not particularly limited as long as it has one (meth) acryl group in one molecule, but if specifically exemplified, Methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octyl heptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) Acry , Tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate, methoxy Aliphatic (meth) acrylates such as polypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, mono (2- (meth) acryloyloxyethyl) succinate; cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentyl (Meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobol Cyclo (meth) acrylate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydrophthalate, etc .; benzyl (meth) Acrylate, phenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) acrylate, 2-naphthoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (me ) Acrylate, phenoxypolypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- ( Aromatic (meth) acrylates such as 1-naphthoxy) propyl (meth) acrylate and 2-hydroxy-3- (2-naphthoxy) propyl (meth) acrylate; 2-tetrahydrofurfuryl (meth) acrylate, N- (meth) Heterocyclic (meth) acrylates such as acryloyloxyethyl hexahydrophthalimide, 2- (meth) acryloyloxyethyl-N-carbazole, these caprolactone modified products, ω-carboxy-polycaprolactone mono (meth) acrylate, glycy (Meth) acrylate, α-ethylglycidyl (meth) acrylate, α-propylglycidyl (meth) acrylate, α-butylglycidyl (meth) acrylate, 2-methylglycidyl (meth) acrylate, 2-ethylglycidyl (meth) acrylate 2-propylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl-6,7-epoxyheptyl (meth) acrylate, 3,4 Compounds having an ethylenically unsaturated group and an epoxy group, such as epoxy cyclohexyl methyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether; (2-ethyl-2- Oh Cetanyl) methyl (meth) acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, 2- (2-ethyl-2-oxetanyl) ethyl (meth) acrylate, 2- (2-methyl-2-oxetanyl) ) Ethylenically unsaturated groups and oxetanyl groups such as ethyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, 3- (2-methyl-2-oxetanyl) propyl (meth) acrylate A compound having an ethylenically unsaturated group such as 2- (meth) acryloyloxyethyl isocyanate and an isocyanate group; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl ( (Meth) acrylate, 3-chloro-2-hydride Kishipuropiru (meth) acrylate, a compound having an ethylenically unsaturated group and a hydroxyl group such as 2-hydroxybutyl (meth) acrylate., It is possible to obtain a composition intended appropriately combined.

  If necessary, styrene, N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-isopropylmaleimide, N-butylmaleimide, N-isobutylmaleimide, N-2-methyl can be copolymerized with the above-mentioned monomers. 2-propylmaleimide, N-pentylmaleimide, N-2-pentylmaleimide, N-3-pentylmaleimide, N-2-methyl-1-butylmaleimide, N-2-methyl-2-butylmaleimide, N-3 -Methyl-1-butylmaleimide, N-3-methyl-2-butylmaleimide, N-hexylmaleimide, N-2-hexylmaleimide, N-3-hexylmaleimide, N-2-methyl-1-pentylmaleimide, N 2-methyl-2-pentylmaleimide, N-2-methyl-3-pentylmaleimi N-3-methyl-1-pentylmaleimide, N-3-methyl-2-pentylmaleimide, N-3-methyl-3-pentylmaleimide, N-4-methyl-1-pentylmaleimide, N-4-methyl 2-pentylmaleimide, N-2,2-dimethyl-1-butylmaleimide, N-3,3-dimethyl-1-butylmaleimide, N-3,3-dimethyl-2-butylmaleimide, N-2,3 -Dimethyl-1-butylmaleimide, N-2,3-dimethyl-2-butylmaleimide, N-hydroxymethylmaleimide, N-1-hydroxyethylmaleimide, N-2-hydroxyethylmaleimide, N-1-hydroxy-1 -Propylmaleimide, N-2-hydroxy-1-propylmaleimide, N-3-hydroxy-1-propylmaleimide, N-1 Hydroxy-2-propylmaleimide, N-2-hydroxy-2-propylmaleimide, N-1-hydroxy-1-butylmaleimide, N-2-hydroxy-1-butylmaleimide, N-3-hydroxy-1-butylmaleimide N-4-hydroxy-1-butylmaleimide, N-1-hydroxy-2-butylmaleimide, N-2-hydroxy-2-butylmaleimide, N-3-hydroxy-2-butylmaleimide, N-4-hydroxy -2-butylmaleimide, N-2-methyl-3-hydroxy-1-propylmaleimide, N-2-methyl-3-hydroxy-2-propylmaleimide, N-2-methyl-2-hydroxy-1-propylmaleimide N-1-hydroxy-1-pentylmaleimide, N-2-hydroxy-1-pentylmaleimide , N-3-hydroxy-1-pentylmaleimide, N-4-hydroxy-1-pentylmaleimide, N-5-hydroxy-1-pentylmaleimide, N-1-hydroxy-2-pentylmaleimide, N-2- Hydroxy-2-pentylmaleimide, N-3-hydroxy-2-pentylmaleimide, N-4-hydroxy-2-pentylmaleimide, N-5-hydroxy-2-pentylmaleimide, N-1-hydroxy-3-pentylmaleimide N-2-hydroxy-3-pentylmaleimide, N-3-hydroxy-3-pentylmaleimide, N-1-hydroxy-2-methyl-1-butylmaleimide, N-1-hydroxy-2-methyl-2- Butylmaleimide, N-1-hydroxy-2-methyl-3-butylmaleimide, N-1-hydro Si-2-methyl-4-butylmaleimide, N-2-hydroxy-2-methyl-1-butylmaleimide, N-2-hydroxy-2-methyl-3-butylmaleimide, N-2-hydroxy-2-methyl -4-butylmaleimide, N-2-hydroxy-3-methyl-1-butylmaleimide, N-2-hydroxy-3-methyl-2-butylmaleimide, N-2-hydroxy-3-methyl-3-butylmaleimide N-2-hydroxy-3-methyl-4-butylmaleimide, N-4-hydroxy-2-methyl-1-butylmaleimide, N-4-hydroxy-2-methyl-2-butylmaleimide, N-1- Hydroxy-3-methyl-2-butylmaleimide, N-1-hydroxy-3-methyl-1-butylmaleimide, N-1-hydroxy-2,2-dimethyl Ru-1-propylmaleimide, N-3-hydroxy-2,2-dimethyl-1-propylmaleimide, N-1-hydroxy-1-hexylmaleimide, N-1-hydroxy-2-hexylmaleimide, N-1- Hydroxy-3-hexylmaleimide, N-1-hydroxy-4-hexylmaleimide, N-1-hydroxy-5-hexylmaleimide, N-1-hydroxy-6-hexylmaleimide, N-2-hydroxy-1-hexylmaleimide N-2-hydroxy-2-hexylmaleimide, N-2-hydroxy-3-hexylmaleimide, N-2-hydroxy-4-hexylmaleimide, N-2-hydroxy-5-hexylmaleimide, N-2-hydroxy -6-hexylmaleimide, N-3-hydroxy-1-hexylmaleimide, N- 3-hydroxy-2-hexylmaleimide, N-3-hydroxy-3-hexylmaleimide, N-3-hydroxy-4-hexylmaleimide, N-3-hydroxy-5-hexylmaleimide, N-3-hydroxy-6- Hexylmaleimide, N-1-hydroxy-2-methyl-1-pentylmaleimide, N-1-hydroxy-2-methyl-2-pentylmaleimide, N-1-hydroxy-2-methyl-3-pentylmaleimide, N- 1-hydroxy-2-methyl-4-pentylmaleimide, N-1-hydroxy-2-methyl-5-pentylmaleimide, N-2-hydroxy-2-methyl-1-pentylmaleimide, N-2-hydroxy-2 -Methyl-2-pentylmaleimide, N-2-hydroxy-2-methyl-3-pentylmaleimide, N 2-hydroxy-2-methyl-4-pentylmaleimide, N-2-hydroxy-2-methyl-5-pentylmaleimide, N-2-hydroxy-3-methyl-1-pentylmaleimide, N-2-hydroxy-3 -Methyl-2-pentylmaleimide, N-2-hydroxy-3-methyl-3-pentylmaleimide, N-2-hydroxy-3-methyl-4-pentylmaleimide, N-2-hydroxy-3-methyl-5- Pentylmaleimide, N-2-hydroxy-4-methyl-1-pentylmaleimide, N-2-hydroxy-4-methyl-2-pentylmaleimide, N-2-hydroxy-4-methyl-3-pentylmaleimide, N- 2-hydroxy-4-methyl-4-pentylmaleimide, N-2-hydroxy-4-methyl-5-pentylmaleimide N-3-hydroxy-2-methyl-1-pentylmaleimide, N-3-hydroxy-2-methyl-2-pentylmaleimide, N-3-hydroxy-2-methyl-3-pentylmaleimide, N-3- Hydroxy-2-methyl-4-pentylmaleimide, N-3-hydroxy-2-methyl-5-pentylmaleimide, N-1-hydroxy-4-methyl-1-pentylmaleimide, N-1-hydroxy-4-methyl 2-pentylmaleimide, N-1-hydroxy-4-methyl-3-pentylmaleimide, N-1-hydroxy-4-methyl, N-1-hydroxy-3-methyl-1-pentylmaleimide, N-1- Hydroxy-3-methyl-2-pentylmaleimide, N-1-hydroxy-3-methyl-3-pentylmaleimide, N-1-hydroxy Ci-3-methyl-4-pentylmaleimide, N-1-hydroxy-3-methyl-5-pentylmaleimide, N-3-hydroxy-3-methyl-1-pentylmaleimide, N-3-hydroxy-3-methyl 2-pentylmaleimide, N-1-hydroxy-3-ethyl-4-butylmaleimide, N-2-hydroxy-3-ethyl-4-butylmaleimide, N-2-hydroxy-2-ethyl-1-butylmaleimide N-4-hydroxy-3-ethyl-1-butylmaleimide, N-4-hydroxy-3-ethyl-2-butylmaleimide, N-4-hydroxy-3-ethyl-3-butylmaleimide, N-4- Hydroxy-3-ethyl-4-butylmaleimide, N-1-hydroxy-2,3-dimethyl-1-butylmaleimide, N-1-hydroxy- , 3-dimethyl-2-butylmaleimide, N-1-hydroxy-2,3-dimethyl-3-butylmaleimide, N-1-hydroxy-2,3-dimethyl-4-butylmaleimide, N-2-hydroxy- 2,3-dimethyl-1-butylmaleimide, N-2-hydroxy-2,3-dimethyl-3-butylmaleimide, N-2-hydroxy-2,3-dimethyl-4-butylmaleimide, N-1-hydroxy -2,2-dimethyl-1-butylmaleimide, N-1-hydroxy-2,2-dimethyl-3-butylmaleimide, N-1-hydroxy-2,2-dimethyl-4-butylmaleimide, N-2- Hydroxy-3,3-dimethyl-1-butylmaleimide, N-2-hydroxy-3,3-dimethyl-2-butylmaleimide, N-2-hydroxy-3,3 Dimethyl-4-butylmaleimide, N-1-hydroxy-3,3-dimethyl-1-butylmaleimide, N-1-hydroxy-3,3-dimethyl-2-butylmaleimide, N-1-hydroxy-3,3 -Alkyl maleimides such as dimethyl-4-butylmaleimide; N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide, N-2- Cycloalkylmaleimides such as methylcyclohexylmaleimide, N-2-ethylcyclohexylmaleimide, N-2-chlorocyclohexylmaleimide; N-phenylmaleimide, N-2-methylphenylmaleimide, N-2-ethylphenylmaleimide, N-2- Chloro An arylmaleimide such as phenylmaleimide can be used as appropriate.

  Among these, it is preferable to use at least one selected from (meth) acrylic esters which are C8 to C23 aliphatic esters. The (meth) acrylic resin obtained by copolymerizing such monomer components has a low glass transition temperature, so it not only exhibits excellent adhesive properties, but also has strong hydrophobic interaction, so it is irradiated with ultraviolet rays or electron beams. Is preferable because the peelability at the interface between the pressure-sensitive adhesive layer 20 and the adhesive layer 30 is excellent.

  The polymerization initiator necessary for obtaining such a (meth) acrylic resin is not particularly limited as long as it is a compound that generates radicals by heating at 30 ° C. or higher. For example, methyl ethyl ketone peroxide, cyclohexanone peroxide , Ketone peroxides such as methylcyclohexanone peroxide; 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy) -2-methylcyclohexane, 1,1-bis (t -Butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane Peroxyketals such as p-menthane hydroperoxide Α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide and the like dialkyl peroxides; octanoyl peroxide, lauroyl peroxide Diacyl peroxides such as oxide, stearyl peroxide, benzoyl peroxide; bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, Peroxycarbonates such as di-3-methoxybutylperoxycarbonate; t-butylperoxypivalate, t-hexylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexano Eate, 2, -Dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy Isobutyrate, t-hexyl peroxyisopropyl monocarbonate, t-butyl peroxy-3,5,5-trimethylhexanoate, t-butyl peroxylaurate, t-butyl peroxyisopropyl monocarbonate, t-butyl Peroxy-2-ethylhexyl monocarbonate, t-butyl peroxybenzoate, t-hexyl peroxybenzoate, 2,5-dimethyl-2,5-bis (benzoylperoxy) hexane, t-butyl peroxyacetate, etc. Oxyester; 2,2'-azobis Sobuchironitoriru, 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (4-methoxy-2'-dimethylvaleronitrile) and the like.

  The reaction solvent used in the solution polymerization is not particularly limited as long as it can dissolve the (meth) acrylic resin. For example, aromatics such as toluene, xylene, mesitylene, cumene, and p-cymene are used. Group hydrocarbons; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; alcohols such as methanol, ethanol, isopropanol, butanol, ethylene glycol, and propylene glycol; acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl Ketones such as -2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate and γ-butyrolactone; carbonates such as ethylene carbonate and propylene carbonate; ethylene glycol monomethyl ester Ter, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether Polyhydric alcohol alkyl ethers such as diethylene glycol monobutyl ether, diethylene glycol dimethyl ether and diethylene glycol diethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether Polyacetate alkyl ether acetates such as ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate; N, N-dimethylformamide, N, N-dimethylacetamide, N- Examples include amides such as methylpyrrolidone, and these organic solvents can be used alone or in combination of two or more. Furthermore, it can also superpose | polymerize using a supercritical carbon dioxide etc. as a solvent.

  Photosensitivity can be imparted to the (meth) acrylic resin by chemically bonding a functional group capable of reacting with irradiation of ultraviolet rays, electron beams, and / or visible rays. The functional group capable of reacting by irradiation with ultraviolet rays, electron beams, and / or visible rays as used herein is, for example, a (meth) acryl group, a vinyl group, an allyl group, a glycidyl group, an oil. Examples thereof include a cyclic epoxy group and an oxetane group.

  The method for imparting photosensitivity to the (meth) acrylic resin is not particularly limited. For example, when the above (meth) acrylic resin is synthesized, a functional group that can undergo an addition reaction in advance, such as a hydroxyl group or a carboxyl group. , A functional group capable of addition reaction is introduced into a (meth) acrylic resin by copolymerizing with a monomer having a maleic anhydride group, a glycidyl group, an amino group, etc., and at least one ethylenically unsaturated group and an epoxy (Meth) acrylic resin by introducing an ethylenically unsaturated group into the side chain by addition reaction of a compound having at least one functional group selected from a group, oxetanyl group, isocyanate group, hydroxyl group, carboxyl group, etc. Photosensitivity can be imparted to.

  There is no restriction | limiting in particular as such a compound, Glycidyl (meth) acrylate, (alpha) -ethyl glycidyl (meth) acrylate, (alpha) -propyl glycidyl (meth) acrylate, (alpha) -butyl glycidyl (meth) acrylate, 2-methyl glycidyl (meta) ) Acrylate, 2-ethylglycidyl (meth) acrylate, 2-propylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl-6,7 -Ethylenically unsaturated groups such as epoxy heptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether Compounds having an epoxy group; (2-ethyl-2-oxetanyl) methyl (meth) acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, 2- (2-ethyl-2-oxetanyl) ethyl (meta ) Acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, 3- (2-methyl-2-oxetanyl) propyl ( Compounds having an ethylenically unsaturated group such as (meth) acrylate and an oxetanyl group; ethylenic groups such as methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate Unsaturated groups and iso Compounds having an ate group; ethylenic groups such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate and 2-hydroxybutyl (meth) acrylate Compounds having a saturated group and a hydroxyl group; (meth) acrylic acid, crotonic acid, cinnamic acid, succinic acid (2- (meth) acryloyloxyethyl), 2-phthaloylethyl (meth) acrylate, 2-tetrahydrophthalo Ethylenically unsaturated groups such as ylethyl (meth) acrylate, 2-hexahydrophthaloylethyl (meth) acrylate, ω-carboxy-polycaprolactone mono (meth) acrylate, 3-vinylbenzoic acid, 4-vinylbenzoic acid and the like Examples include compounds having a carboxyl group

  Among these, from the viewpoint of cost and / or reactivity, 2- (meth) acryloyloxyethyl isocyanate, glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, ethyl isocyanate (meth) acrylate, 2 -Using hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, (meth) acrylic acid, crotonic acid, 2-hexahydrophthaloylethyl (meth) acrylate, etc. It is preferable to react with (meth) acrylic resin to impart photosensitivity. These compounds can be used alone or in combination of two or more. If necessary, a catalyst that promotes the addition reaction may be added, or a polymerization inhibitor may be added for the purpose of avoiding cleavage of the double bond during the reaction. More preferably, it is a reaction product of a (meth) acrylic resin containing an OH group and at least one selected from 2-methacryloyloxyethyl isocyanate and 2-acryloyloxyethyl isocyanate.

  The cross-linking agent has at least one selected from a hydroxyl group, a glycidyl group, an amino group, and the like introduced into a (meth) acrylic resin, and two or more functional groups capable of reacting with these functional groups in one molecule. There is no limitation on the structure of the compound. Examples of the bond formed by such a crosslinking agent include an ester bond, an ether bond, an amide bond, an imide bond, a urethane bond, and a urea bond. Among them, when the crosslinking agent has an aromatic group-containing isocyanate group, it is preferable because the peeling force between the pressure-sensitive adhesive layer 20 and the adhesive layer 30 does not easily increase even when the amount of ultraviolet irradiation increases.

  It is preferable that the quantity of the crosslinking agent contained in the adhesion layer 20 is 5-9 mass parts with respect to 100 mass parts of acrylic copolymers. When the amount of the crosslinking agent is less than 5 parts by mass, the elongation at break of the pressure-sensitive adhesive layer 20 before ultraviolet irradiation is increased, and the machinability during the dicing process tends to be insufficient. In addition to this, the peeling force between the pressure-sensitive adhesive layer 20 and the adhesive layer 30 after ultraviolet irradiation is not sufficiently reduced, and it is likely that the push-up amount during the pickup process needs to be set relatively large. On the other hand, when the amount of the crosslinking agent exceeds 9 parts by mass, the adhesive force of the adhesive layer 20 before ultraviolet irradiation tends to be weakened, and the force for fixing the semiconductor chip tends to be insufficient. For this reason, in the dicing process, in addition to peeling of the die bonding sheet, in the case of a semiconductor chip of a small chip size, problems such as chip fly are likely to occur.

  As the crosslinking agent, those having two or more isocyanate groups in one molecule of the crosslinking agent are preferable. When such a compound is used, it easily reacts with a hydroxyl group, glycidyl group, amino group, etc. introduced into the (meth) acrylic resin to form a strong cross-linked structure, and adheres to the semiconductor chip after the die bonding process. The adhesion of the layer 20 can be suppressed.

  Here, specifically, the crosslinking agent having two or more isocyanate groups in one molecule is 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate. 1,4-xylene diisocyanate, diphenylmethane-4,4′-diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexyl Isocyanate compounds such as methane-2,4′-diisocyanate and lysine isocyanate are listed.

  Furthermore, an isocyanate group-containing oligomer obtained by reacting the above-described isocyanate compound with a polyhydric alcohol having two or more OH groups in one molecule can also be used. In the case of obtaining such an oligomer, examples of the polyhydric alcohol having two or more OH groups in one molecule include ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, and 1,8-octanediol. 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, glycerin, pentaerythritol, dipentaerythritol, 1,4-cyclohexanediol, 1,3-cyclohexane Examples include diols.

  Among these, it is more desirable that the crosslinking agent is a reaction product of a polyfunctional isocyanate having two or more isocyanate groups in one molecule and a polyhydric alcohol having three or more OH groups in one molecule. By using such an isocyanate group-containing oligomer, the pressure-sensitive adhesive layer 20 forms a dense cross-linked structure, and adhesion of the pressure-sensitive adhesive layer 20 to the semiconductor chip after the die bonding step can be suppressed.

  The photoinitiator is not particularly limited as long as it generates an active species capable of causing chain polymerization of the acrylic copolymer by irradiation with one or more kinds of light selected from ultraviolet rays, electron beams and visible rays. For example, it may be a radical photopolymerization initiator or a cationic photopolymerization initiator. The active species capable of chain polymerization is not particularly limited as long as the polymerization reaction is initiated by reacting with the functional group of the acrylic copolymer.

  Examples of the photo radical polymerization initiator include benzoin ketals such as 2,2-dimethoxy-1,2-diphenylethane-1-one; 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane- Α-hydroxy ketones such as 1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one; 2-benzyl-2-dimethylamino-1 Α-amino ketones such as-(4-morpholinophenyl) -butan-1-one, 1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one; Oxime esters such as (4-phenylthio) phenyl] -1,2-octadion-2- (benzoyl) oxime; bis (2,4,6-trime Phosphine oxides such as butylbenzoyl) phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 2- (o-chlorophenyl) ) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer 2,4,5-triaryl such as 2-mer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer Imidazole dimer; benzophenone, N, N, N ′, N-tetramethyl-4,4 ′ Benzophenone compounds such as diaminobenzophenone, N, N, N ′, N-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy-4′-dimethylaminobenzophenone; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butyl Anthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9, Quinone compounds such as 10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone; benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc. Benzoin ether; benzoin compounds such as benzoin, methylbenzoin, and ethylbenzoin; benzyl compounds such as benzyldimethyl ketal; acridine compounds such as 9-phenylacridine, 1,7-bis (9,9′-acridinylheptane); N -Phenylglycine, coumarin and the like.

  In the 2,4,5-triarylimidazole dimer described above, the substituents of the aryl groups at the two triarylimidazole sites may give the same and symmetric compounds, but differently asymmetric compounds. May be given. Also. A thioxanthone compound and a tertiary amine may be combined, such as a combination of diethylthioxanthone and dimethylaminobenzoic acid.

  Examples of the cationic photopolymerization initiator include aryl diazonium salts such as p-methoxybenzenediazonium hexafluorophosphate; diaryliodonium salts such as diphenyliodonium hexafluorophosphate and diphenyliodonium hexafluoroantimonate; triphenylsulfonium hexafluorophosphate, triphenyl Triarylsulfonium salts such as sulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium hexafluorophosphate, diphenyl-4-thiophenoxyphenylsulfonium hexafluoroantimonate, diphenyl-4-thiophenoxyphenylsulfonium pentafluorohydroxyantimonate ; Triphenylselenonium hexa Triarylselenonium salts such as fluorophosphate, triphenylselenonium tetrafluoroborate, triphenylselenonium hexafluoroantimonate; dialkylphenacyl such as dimethylphenacylsulfonium hexafluoroantimonate, diethylphenacylsulfonium hexafluoroantimonate Sulfonium salts; dialkyl-4-hydroxy salts such as 4-hydroxyphenyldimethylsulfonium hexafluoroantimonate and 4-hydroxyphenylbenzylmethylsulfonium hexafluoroantimonate; α-hydroxymethylbenzoin sulfonate, N-hydroxyimide sulfonate, α -Sulphonyl esters such as sulfonyloxyketone and β-sulfoniloxyketone These cationic polymerization initiators may be used alone or in combination of two or more. Furthermore, it can also be used in combination with a suitable sensitizer.

  Among them, when strict insulation and insulation reliability are required for the adhesive layer 20, it is preferable to use a photo radical initiator, and among them, benzoin such as 2,2-dimethoxy-1,2-diphenylethane-1-one 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1- Α-hydroxy ketones such as propan-1-one; benzophenone, 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenyl Anthraquinone, 2,3-diphenylanthraquinone Quinone compounds such as 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone; benzoin methyl ether; Benzoin ethers such as benzoin ethyl ether and benzoin phenyl ether; benzoin compounds such as benzoin, methyl benzoin and ethyl benzoin; benzyl compounds such as benzyl dimethyl ketal; 9-phenylacridine, 1,7-bis (9,9′-acridini Aluidine compounds such as luheptane; N-phenylglycine, coumarin and the like are preferable because they have excellent storage stability in a dicing / die bonding integrated tape, and 2,2-dimethoxy-1,2-diphenylethane-1-o is preferable. 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1- Propan-1-one and benzophenone are more preferable because they can be handled under a general ultraviolet light-shielding fluorescent lamp and do not require equipment such as a yellow room.

The optimum amount of the photoinitiator is preferably 0.5 to 1.5 parts by mass, although the optimum value varies depending on the thickness of the target adhesive layer 20 and / or the light source used. When the amount of the photoinitiator is less than 0.5 parts by mass, the peeling force from the adhesive layer 30 after the ultraviolet irradiation is not sufficiently lowered, and a problem is likely to occur when the push-up amount is low at the time of pickup. When the amount of the photoinitiator is larger than 1.5 parts by mass, when the ultraviolet ray is irradiated at 1000 mJ / cm ² , the pressure-sensitive adhesive layer 20 is decomposed and the peeling force with respect to the adhesive layer 30 is increased. Sometimes prone to problems.

  The thickness of the adhesive layer 20 is preferably 5 to 30 μm. When the thickness is less than 5 μm, the adhesive force between the adhesive layer 20 and the adhesive layer 30 before UV irradiation is reduced, and the semiconductor element may be scattered during dicing. On the other hand, if the thickness exceeds 30 μm, the total thickness of the dicing die bonding integrated tape 1 becomes too thick, making it difficult to handle at the time of use or to be stored in a reel shape. It is easy to become.

  The peel strength of the pressure-sensitive adhesive layer 20 before the light irradiation with respect to the SUS substrate is preferably 0.8 N / 25 mm to 1.3 N / 25 mm. By setting the peel strength before light irradiation within the above range, the adhesive force between the pressure-sensitive adhesive layer 20 and the adhesive layer 30 after light irradiation can be easily adjusted to an appropriate range. Therefore, the pick-up property of the semiconductor chip can be further improved in the pick-up process performed after light irradiation.

(Adhesive layer)
The adhesive layer 30 is for adhering / connecting a semiconductor chip separated after dicing to a support substrate. The adhesive layer 30 is a layer made of a thermosetting adhesive that is cured by heat, and preferably contains an epoxy group-containing acrylic copolymer, an epoxy resin, and an epoxy resin curing agent. The adhesive layer 30 having such a composition is excellent in adhesiveness between the semiconductor chip / supporting substrate and between the semiconductor chip / semiconductor chip, and can be provided with electrode embedding property and / or wire embedding property, and the die bonding process. Is preferable because it can be bonded at a low temperature and excellent curing can be obtained in a short time, and it has excellent reliability after molding with a sealant.

  Here, the epoxy resin is, for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, an alicyclic epoxy resin, an aliphatic chain epoxy resin, a phenol novolac type epoxy resin, or a cresol novolak type. Epoxy resin, bisphenol A novolak type epoxy resin, diglycidyl etherified product of biphenol, diglycidyl etherified product of naphthalenediol, diglycidyl etherified product of phenol, diglycidyl etherified product of alcohol, and alkyl substitution products thereof , Bifunctional epoxy resins such as halides and hydrogenated products, and novolac type epoxy resins. Moreover, what is generally known, such as a polyfunctional epoxy resin and a heterocyclic ring-containing epoxy resin, can also be applied. These can be used alone or in combination of two or more. Furthermore, components other than the epoxy resin may be included as impurities within a range that does not impair the characteristics.

  Moreover, as an epoxy resin hardening | curing agent, the thing like the phenol resin which can be obtained by making the xylylene compound which is a phenol compound and a bivalent coupling group react in the presence of a catalyst or an acid catalyst, for example is mentioned.

  Examples of the phenol compound used for the production of the phenol resin include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, on-propylphenol, mn-propylphenol, p-n-propylphenol, o-isopropylphenol, m-isopropylphenol, p-isopropylphenol, on-butylphenol, mn-butylphenol, pn-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol, 2,4-xylenol, 2,6-xylenol, 3,5-xylenol, 2,4,6-trimethylphenol, resorcin, catechol, hydroquinone, 4 Methoxyphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, p-cyclohexylphenol, o-allylphenol, p-allylphenol, o-benzylphenol, p-benzylphenol, o-chlorophenol, p- Examples include chlorophenol, o-bromophenol, p-bromophenol, o-iodophenol, p-iodophenol, o-fluorophenol, m-fluorophenol, p-fluorophenol and the like. These phenol compounds may be used alone or in combination of two or more.

  The following xylylene dihalide, xylylene diglycol and derivatives thereof can be used as the xylylene compound which is a divalent linking group used in the production of the phenol resin. Α, α′-dichloro-p-xylene, α, α′-dichloro-m-xylene, α, α′-dichloro-o-xylene, α, α′-dibromo-p-xylene, α, α ′ -Dibromo-m-xylene, α, α'-dibromo-o-xylene, α, α'-diiodo-p-xylene, α, α'-diiodo-m-xylene, α, α'-diiodo-o-xylene Α, α′-dihydroxy-p-xylene, α, α′-dihydroxy-m-xylene, α, α′-dihydroxy-o-xylene, α, α′-dimethoxy-p-xylene, α, α′- Dimethoxy-m-xylene, α, α'-dimethoxy-o-xylene, α, α'-diethoxy-p-xylene, α, α'-diethoxy-m-xylene, α, α'-diethoxy-o-xylene, α, α′-di-n-propoxy-p-xylene, α α'-di-n-propoxy-m-xylene, α, α'-di-n-propoxy-o-xylene, α, α'-di-isopropoxy-p-xylene, α, α'-diisopropoxy -M-xylene, α, α'-diisopropoxy-o-xylene, α, α'-di-n-butoxy-p-xylene, α, α'-di-n-butoxy-m-xylene, α, α'-di-n-butoxy-o-xylene, α, α'-diisobutoxy-p-xylene, α, α'-diisobutoxy-m-xylene, α, α'-diisobutoxy-o-xylene, α, α ' -Di-tert-butoxy-p-xylene, α, α'-di-tert-butoxy-m-xylene, α, α'-di-tert-butoxy-o-xylene. These can be used alone or in combination of two or more.

  When the above phenol compound and xylylene compound are reacted, mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid and polyphosphoric acid; organic compounds such as dimethyl sulfuric acid, diethyl sulfuric acid, p-toluenesulfonic acid, methanesulfonic acid and ethanesulfonic acid Carboxylic acids; Super strong acids such as trifluoromethanesulfonic acid; Strong acidic ion exchange resins such as alkane sulfonic acid type ion exchange resin; Super strong acidic ion exchange such as perfluoroalkane sulfonic acid type ion exchange resin Resins (trade names: Nafion, Nafion, manufactured by DuPont); natural and synthetic zeolites; xylylene compounds that are essentially raw materials disappear at 50 to 250 ° C using acidic catalysts such as activated clay (acid clay) And the reaction is obtained until the reaction composition becomes constant. The reaction time depends on the raw materials and / or the reaction temperature, but is generally about 1 to 15 hours. In practice, the reaction time may be determined while tracking the reaction composition by GPC (gel permeation chromatography) or the like.

  The epoxy group-containing acrylic copolymer is an epoxy group-containing acrylic copolymer containing 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate having an epoxy group. In order to obtain a high adhesive force, 0.5% by mass or more is preferable, and gelation can be suppressed if it is 6% by mass or less. The glass transition point (Tg) of the epoxy group-containing acrylic copolymer is preferably −50 ° C. or higher and 30 ° C. or lower, more preferably −10 ° C. or higher and 30 ° C. or lower.

  The amount of glycidyl acrylate or glycidyl methacrylate used as the functional group monomer is a copolymer ratio of 0.5 to 6% by mass. That is, in the present invention, the epoxy group-containing acrylic copolymer is a copolymer obtained by using glycidyl acrylate or glycidyl methacrylate as a raw material in an amount of 0.5 to 6% by mass with respect to the obtained copolymer. Say. The remainder can be a mixture of alkyl acrylate having 1 to 8 carbon atoms such as methyl acrylate and methyl methacrylate, alkyl methacrylate, styrene, acrylonitrile and the like. Among these, ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferable. The mixing ratio is preferably adjusted in consideration of the Tg of the copolymer. When Tg is less than −10 ° C., the tackiness of the adhesive layer or the dicing die bond sheet in the B-stage state tends to increase, and the handleability may deteriorate. There is no restriction | limiting in particular in a polymerization method, For example, pearl polymerization, solution polymerization, etc. are mentioned, A copolymer is obtained by these methods. Examples of such an epoxy group-containing acrylic copolymer include HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corporation).

  The weight average molecular weight of the epoxy group-containing acrylic copolymer is 100,000 or more, and adhesiveness and heat resistance are high in this range, preferably 300,000 to 3,000,000, and 500,000 to 2,000,000. Is more preferable. If it is 3 million or less, the flowability is lowered, so that the possibility that the filling property to the wiring circuit formed on the support substrate to which the semiconductor element is attached is lowered as required can be reduced. In addition, a weight average molecular weight is a polystyrene conversion value using the calibration curve by a standard polystyrene by the gel permeation chromatography method (GPC).

  Moreover, you may add hardening accelerators, such as tertiary amine, imidazoles, and quaternary ammonium salts, to the contact bonding layer 30 as needed. Specific examples of such a curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate. Etc., and these may be used alone or in combination of two or more.

  Furthermore, an inorganic filler can be added to the adhesive layer 30 as necessary. Specifically, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, Amorphous silica etc. are mentioned, These can also use 1 type (s) or 2 or more types together.

  The thickness of the adhesive layer 30 is preferably 5 μm to 60 μm. If the thickness is less than 5 μm, the adhesive force between the semiconductor chip and the support substrate 60 tends to be insufficient. On the other hand, if the thickness exceeds 60 μm, it is not economical, and the semiconductor device is insufficiently reduced in size. Cheap.

<Manufacturing method of dicing die bonding integrated tape>
As a method of manufacturing the dicing / die bonding integrated tape 1, a method of manufacturing the base layer 10 by sequentially applying the adhesive layer 20 and the adhesive layer 30 on the polymer tape, or the adhesive layer 20 and the adhesive layer 30. Examples of the method include a method in which each film is laminated and manufactured.

  When the adhesive layer 20 and the adhesive layer 30 are sequentially applied, simultaneous coating (multilayer coating) or sequential coating can be performed. For example, (i) a method of laminating the adhesive layer 20 on the base material layer 10 and subsequently laminating the adhesive layer 30; (ii) laminating the adhesive layer 20 and the adhesive layer 30 simultaneously on the base material layer 10 The method (ii) is preferable from the viewpoint of workability. In addition, the said coating can be performed by well-known methods, such as a roll coater, a comma coater, a gravure coater, an air knife coater, a die coater, a bar coater, for example.

  A method of laminating the adhesive layer 20 and the adhesive layer 30 in a film form is performed by the following procedure. First, the resin composition of the pressure-sensitive adhesive layer 20 and the adhesive layer 30 is dissolved or dispersed in a solvent to form a varnish, which is applied onto another base film, and then the solvent is removed by heating. Next, the base film to which each resin composition is applied is heat-pressed while being stacked in a state where the adhesive layer 20 and the adhesive layer 30 are in contact with each other to form a layered film. Then, the dicing / die bonding integrated tape 1 can be obtained by peeling off the base film on the adhesive layer 30 side of the layered film.

<Method for Manufacturing Semiconductor Device (Semiconductor Package)>
Next, a method for manufacturing a semiconductor device (semiconductor package) using the dicing / die bonding integrated tape 1 will be described.

  2A to 2F and FIG. 3 are cross-sectional views for explaining a preferred embodiment of a method for manufacturing a semiconductor device using the dicing / die bonding integrated tape 1. The manufacturing method of the semiconductor device of the present embodiment includes an attaching step (wafer laminating step) in which the adhesive layer 30 of the above-described dicing die bonding integrated tape 1 is attached to a semiconductor wafer, a semiconductor wafer W and an adhesive layer 20, and adhesion. A dicing step of dicing the layer 30; an ultraviolet irradiation step of irradiating the adhesive layer 20 with ultraviolet rays; a pickup step of picking up the semiconductor element to which the adhesive layer 30 is adhered from the support substrate; and the semiconductor element via the adhesive layer 30 A bonding step of bonding to the support substrate 60 for mounting the semiconductor element. Hereinafter, each process will be described with reference to the drawings.

(Attaching process)
First, the dicing / die bonding integrated tape 1 is placed in a predetermined apparatus. 2A and 2B, the dicing / die bonding integrated tape 1 is attached to the main surface Ws of the semiconductor wafer W with the adhesive layer 30 interposed therebetween. Moreover, it is preferable that the circuit surface of the semiconductor wafer W is a surface opposite to the main surface Ws.

(Dicing process)
Next, as shown in FIG. 2C, the semiconductor wafer W, the adhesive layer 20, and the adhesive layer 30 are diced. At this time, the base material layer 10 may be diced halfway. Thus, the dicing / die bonding integrated tape 1 also functions as a dicing sheet. Here, the adhesive layer 20 in the dicing / die bonding integrated tape 1 has an elongation at break before ultraviolet irradiation of more than 140% and 200% or less. Therefore, the machinability during the dicing process is good. Therefore, even if the semiconductor element Wa obtained by dicing is a small chip having a side of about 1 to 10 mm (more preferably about 1 to 5 mm), chip skipping during dicing can be suppressed.

(UV irradiation process)
Next, as shown in FIG. 2D, the pressure-sensitive adhesive layer 20 is cured by irradiating the pressure-sensitive adhesive layer 20 with ultraviolet rays, and the adhesive force between the pressure-sensitive adhesive layer 20 and the adhesive layer 30 is reduced. In the present embodiment, it is preferable to use ultraviolet rays having a wavelength of 200 to 400 nm, and as irradiation conditions, it is preferable to irradiate with an illuminance of 30 to 240 mW / cm ² and an irradiation amount of 200 to 500 mJ / cm ^2. .

(Pickup process)
After irradiating with ultraviolet rays, as shown in FIG. 2 (e), by expanding the base material layer 10, the semiconductor elements obtained by cutting are separated from each other and pushed up by the needle 42 from the adhesive layer 30 side. The obtained semiconductor element 50 with the adhesive layer is sucked and picked up by the suction collet 44. As described above, since the cutting in the dicing process is performed well, the semiconductor element 50 with the adhesive layer can be sufficiently picked up even if the push-up amount is small. The semiconductor element with an adhesive layer 50 includes a semiconductor element Wa and an adhesive layer 30a. The adhesive layer 30a is obtained by dividing the adhesive layer 30. By expanding the base material layer 10 in the pickup process, the pickup property of the semiconductor element 50 with the adhesive layer can be further improved.

  Further, the push-up amount by the needle 42 can be selected as necessary. Furthermore, for example, a two-stage or three-stage pick-up method may be performed from the viewpoint of securing a sufficient pick-up property even for an extremely thin wafer. In the present embodiment, the semiconductor element 50 with the adhesive layer can be picked up by a method other than the suction collet 44.

(Adhesion process)
After picking up the semiconductor element 50 with the adhesive layer, as shown in FIG. 2F, the semiconductor element 50 with the adhesive layer is bonded to the support substrate 60 for mounting the semiconductor element via the adhesive layer 30a by thermocompression bonding. To do.

  Even after the semiconductor element 50 with the adhesive layer is mounted on the support substrate 60 via the adhesive layer 30a, the semiconductor element 50 with the adhesive layer is again bonded to the semiconductor element Wa via the adhesive layer 30a by thermocompression bonding. Good. Thereby, a plurality of semiconductor elements Wa can be mounted on the support substrate 60. In this case, although the heat history of the adhesive layer 30a is increased, the adhesive property between the semiconductor element Wa and the support substrate 60 can be sufficiently maintained according to the adhesive layer 30a according to the present embodiment. The adhesive layer 30a can be sufficiently satisfactorily filled into the concave and convex portions formed on the surface 60a.

  Subsequently, as shown in FIG. 3, it is preferable to electrically connect the semiconductor element Wa and the support substrate 60 by wire bonds 70 as necessary. At this time, the semiconductor element Wa, the adhesive layer 30a, and the support substrate 60 are heated at 170 ° C. for about 15 to 60 minutes, for example. Furthermore, after connecting by wire bonding, the semiconductor element Wa may be resin-sealed as necessary. The resin sealing material 80 is formed on the surface 60a of the support substrate 60, and the solder balls 90 are formed on the surface opposite to the surface 60a of the support substrate 60 for electrical connection with an external substrate (motherboard). May be.

  Note that the adhesive layer 30a is preferably in a semi-cured state when the resin is sealed. Thereby, the adhesive layer 30a can be more satisfactorily filled in the concave and convex portions formed on the surface 60a of the support substrate 60 when the resin is sealed. The semi-cured state means a state where the adhesive layer 30a is not completely cured. The semi-cured adhesive layer 30a may be finally heat-cured using one or more heat treatments in the manufacturing process of the semiconductor device.

  Through the above steps, the semiconductor device 100 can be manufactured using the dicing / die bonding integrated tape 1.

  Examples of the present invention will be described more specifically below, but the present invention is not limited to these examples. Unless otherwise stated, all chemicals used reagents.

<Example 1>
(Production of dicing and die bonding integrated tape)
[Synthesis of acrylic resin for adhesive layer]
To an autoclave with a capacity of 4000 ml equipped with a three-one motor, a stirring blade and a nitrogen introduction tube, 1000 g of ethyl acetate, 650 g of 2-ethylhexyl acrylate, 350 g of 2-hydroxyethyl acrylate, and 3.0 g of azobisisobutyronitrile were blended uniformly. Stir until. Thereafter, bubbling was performed at a flow rate of 100 ml / min for 60 minutes to degas dissolved oxygen in the system. The temperature was raised to 60 ° C. over 1 hour, and the temperature was raised and polymerized for 4 hours. Thereafter, the temperature was raised to 90 ° C. over 1 hour, further maintained at 90 ° C. for 1 hour, and then cooled to room temperature.

  Next, 1000 g of ethyl acetate was added to the autoclave and stirred for dilution. After adding 0.1 g of methoquinone as a polymerization inhibitor and 0.05 g of dioctyltin dilaurate as a urethanization catalyst, 100 g of 2-methacryloxyethyl isocyanate (Karenz MOI: product name, Showa Denko KK) was added. The mixture was reacted at 70 ° C. for 6 hours and then cooled to room temperature. Thereafter, ethyl acetate was added to adjust the non-volatile content in the acrylic resin solution to 35% by mass to obtain an acrylic resin solution having a functional group capable of chain polymerization.

  When the acid value and hydroxyl value of this resin were measured according to JIS K0070, no acid value was detected. When the hydroxyl value was determined, it was 121 mgKOH / g. The obtained acrylic resin was vacuum-dried overnight at 60 ° C., and the obtained solid content was subjected to elemental analysis with a fully automatic elemental analyzer varioEL manufactured by Elemental Co., and 2-methacryloxyethyl introduced from the nitrogen content. It was 0.59 mmol / g when content of the isocyanate was computed. Also, SD-8022 / DP-8020 / RI-8020 manufactured by Tosoh Corporation is used, Gelpack GL-A150-S / GL-A160-S manufactured by Hitachi Chemical Co., Ltd. is used for the column, and tetrahydrofuran is used for the eluent. As a result of GPC measurement, the weight average molecular weight in terms of polystyrene was 420,000.

[Production of dicing tape]
100 g of an acrylic resin solution having a chain-polymerizable double bond obtained by the above-described method as a solid content and a polyfunctional isocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate L, 75% solid content) as a crosslinking agent. 7.0 g of solid content, 1.0 g of 1-hydroxycyclohexyl phenyl ketone (manufactured by Ciba Specialty Chemicals Co., Ltd., Irgacure 184) as photoinitiator, and ethyl acetate so that the total solid content is 27% by mass Was added and stirred uniformly for 10 minutes to obtain an adhesive layer varnish.

  Adjust the gap so that the adhesive layer has a thickness of 10 μm using an applicator on a polyethylene terephthalate tape with a width of 350 mm, a length of 400 mm, and a thickness of 38 μm. The coating was performed while drying at 80 ° C. for 5 minutes.

  Separately, a polyolefin tape with a 300 mm square and a thickness of 100 μm is used as the base material layer. The polyolefin tape and the adhesive layer surface of the above-mentioned polyethylene terephthalate tape with an adhesive layer are bonded together at room temperature, and the adhesive layer is bonded to the polyolefin tape by pressing with a rubber roll. Transcribed to. Then, the dicing tape with a cover tape was obtained by leaving it to stand at room temperature for 3 days.

[Production of die bonding tape (adhesive layer)]
YDCN-703 (trade name, manufactured by Toto Kasei Co., Ltd., cresol novolac type epoxy resin, epoxy equivalent 210, molecular weight 1200, softening point 80 ° C.) 55 parts by mass as an epoxy resin, and Mirex XLC-LL (Mitsui Chemicals, Inc.) as a phenol resin ) Product Name, Phenol Resin, Hydroxyl Equivalent 175, Water Absorption Rate 1.8%, Heat Weight Reduction Rate at 350 ° C. 4%) 45 parts by mass, NUC A-189 (manufactured by Nippon Unicar Co., Ltd.) as silane coupling agent Name, 1.7 parts by mass of γ-mercaptopropyltrimethoxysilane) and 3.2 parts by mass of NUCA-1160 (trade name, γ-ureidopropyltriethoxysilane) manufactured by Nippon Unicar Co., Ltd., and Aerosil R972 (silica surface) as a filler Was coated with dimethyldichlorosilane and hydrolyzed in a reactor at 400 ° C. Add a cyclohexanone to a composition consisting of 32 parts by mass of a filler having an organic group such as a methyl group on its surface, a product name manufactured by Nippon Aerosil Co., Ltd., silica, and an average particle size of 0.016 μm, and stir and mix. And kneaded for 90 minutes. 280 parts by mass of acrylic rubber HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corp., weight average molecular weight 800,000) containing 3% by mass of glycidyl acrylate or glycidyl methacrylate, and Curazole 2PZ-CN as a curing accelerator (Shikoku Kasei Co., Ltd. product name, 1-cyanoethyl-2-phenylimidazole) 0.5 parts by mass was added, stirred and mixed, vacuum degassed to obtain a varnish.

  Die bonding with varnish applied to a 38 μm thick polyethylene terephthalate tape that has been subjected to release treatment, heat-dried at 140 ° C. for 5 minutes to form a B-stage coating film with a thickness of 20 μm, and a carrier tape A tape (adhesive layer) was prepared.

[Production of dicing and die bonding integrated tape]
The die bonding tape (adhesive layer) provided with the carrier tape obtained as described above was cut into a circle having a diameter of 220 mm together with the carrier tape. The die bonding tape was affixed to the adhesive layer surface of the dicing tape from which the cover tape was peeled off at room temperature, and then left at room temperature for 1 day. Thereafter, the dicing tape was cut into a circle having a diameter of 290 mm to obtain a dicing / die bonding integrated tape.

[Measurement of elongation at break of adhesive layer]
For the measurement of elongation at break, an autograph “AGS-1000” manufactured by Shimadzu Corporation was used. An adhesive layer before ultraviolet irradiation was prepared, and a sample was cut out with a size of 1 cm width and 8 cm length. Using this sample, measurement was performed at a distance between chucks of 50 mm and a pulling speed of 300 mm / min, and the elongation at break of the adhesive layer before ultraviolet irradiation was measured.

[Measurement of peel strength of dicing tape against SUS substrate]
Shimadzu Autograph “AGS-1000” was used to measure the peel strength of the dicing tape against the SUS substrate. A dicing tape having an adhesive layer was cut out to have a width of 25 mm and a length of 100 mm, and affixed to a SUS plate (SUS430BA) was used as a sample before ultraviolet irradiation. This sample, air-cooled high-pressure mercury lamp ultraviolet from the dicing tape side (80W / cm, irradiation distance 10 cm) and those 500 mJ / cm ² irradiation by, and the samples after UV irradiation. These samples were peeled at a peeling angle of 90 degrees and a peeling speed of 200 mm / min, and the peel strength of the dicing tape with respect to the SUS substrate was measured before and after ultraviolet irradiation.

[Presence of peeling of adhesive layer and chip jump during dicing]
The presence or absence of peeling of the adhesive layer (die bonding tape) and chip jumping from the dicing tape during dicing (DC) was evaluated. When one wafer was diced, the case where peeling of the adhesive layer and chip jump did not occur even once was evaluated as “◯”, and the case where it occurred even once was evaluated as “X”.

[Evaluation of pickup success rate]
The dicing die bonding integrated tape produced as described above was laminated on a mirror wafer (size 8 inches, thickness 50 μm) at 70 ° C. Then, dicing was performed using a full auto dicer DF6361 manufactured by DISCO Corporation with a chip size of 5 mm square. At that time, the cutting method was a single cut, NBC-ZH-127F-SE-27HCBB was used as the blade, the blade rotation speed was 40000 rpm, the cutting speed was 50 mm / sec, and the blade height was 30 μm cut into the mirror wafer.

After dicing, the dicing die bonding integrated tape air-cooled high-pressure mercury lamp ultraviolet light from the substrate layer side adhesive layer (80W / cm, irradiation distance 10cm) 500mJ / cm ² using, or was irradiated 1000 mJ / cm ² . Thereafter, a pickup test using a die bonder device (manufactured by NEC Machinery, trade name CPS-100FM) was performed, and a pickup success rate with 20 pickup chips was obtained. At this time, with a push-up amount of 300 μm or less, a case where the pickup success rate was 100% was evaluated as “◯”, and a case where the pickup success rate was not 100% was evaluated as “x”.

<Examples 2 to 6 and Comparative Examples 1 and 2>
Under the same conditions, only the contents of the crosslinking agent and the photoinitiator were changed, and Examples 2 to 6 and Comparative Examples 1 and 2 were carried out.

  As shown in Table 1, the dicing die bonding integrated tapes obtained in Examples 1 to 6 have good cutting performance even for small chip sizes, no chip skipping, and the pickup push-up amount is 300 μm or less. But I was able to pick it up.

However, in Example 6 in which the amount of the photoinitiator amount relative to 100 parts by mass of the acrylic resin in the adhesive layer was 2.0 parts by mass, there was no problem with the pick-up property when the ultraviolet irradiation amount was 500 mJ / cm ² . When the UV irradiation amount was 1000 mJ / cm ² , a problem occurred during pick-up in the die bonding process. This is presumed to be due to the fact that the adhesive layer was decomposed by the irradiation of ultraviolet rays of 1000 mJ / cm ² and the peeling force with the adhesive layer was increased.

  On the other hand, in Comparative Example 1 in which the amount of the crosslinking agent relative to 100 parts by mass of the acrylic resin in the adhesive layer was 3 parts by mass, the elongation at break of the adhesive layer before ultraviolet irradiation was high, and the machinability deteriorated during the dicing process. Further, during the die bonding process, the peeling force from the adhesive layer was not sufficiently reduced after the ultraviolet irradiation, and a problem occurred during pick-up.

  Further, in Comparative Example 2 in which the amount of the crosslinking agent was 11 parts by mass with respect to 100 parts by mass of the acrylic resin in the adhesive layer, there was no problem with the pick-up property, but the adhesive layer was partially peeled from the adhesive layer in the dicing process. Chip jump occurred. This is presumably because the amount of the crosslinking agent is excessive, so that the elongation at break of the pressure-sensitive adhesive layer before ultraviolet irradiation is low, and the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer before ultraviolet irradiation is insufficient.

  According to the present invention, a dicing tape for dicing and die bonding integrated tape, which can sufficiently suppress chip jumping when a semiconductor wafer is diced into small-sized chips and can be used even in a small pick-up amount in a subsequent pick-up process. A dicing tape that can sufficiently pick up a chip is provided.

  DESCRIPTION OF SYMBOLS 1 ... Dicing die-bonding integrated tape, 10 ... Base material layer, 20 ... Adhesive layer, 30 ... Adhesive layer, 50 ... Semiconductor element with an adhesive layer.

The present invention dialog single tape, dicing die bonding integrated tape, and a method of manufacturing a semiconductor device using a dicing die bonding integrated tape.

Claims (5)

In the dicing tape used as the base layer and the adhesive layer in the dicing die bonding integrated tape in which the base layer, the adhesive layer and the adhesive layer are laminated in this order,
The dicing tape whose breaking elongation before light irradiation of the said adhesion layer is more than 140% and 200% or less.   The dicing tape according to claim 1, wherein a peel strength with respect to the SUS substrate is 0.8 N / 25 mm to 1.3 N / 25 mm before light irradiation. An acrylic copolymer having a radiation-curable carbon-carbon double bond-containing group and a hydroxyl group with respect to the main chain and forming the main component of the adhesive layer;
A crosslinking agent having two or more functional groups capable of reacting with the hydroxyl group in one molecule;
A photoinitiator that generates active species capable of causing chain polymerization of the acrylic copolymer by irradiation with one or more kinds of light selected from the group consisting of ultraviolet rays, electron beams, and visible rays;
Including
The dicing tape according to claim 1 or 2, wherein a content of the crosslinking agent is 5 to 9 parts by mass with respect to 100 parts by mass of the acrylic copolymer.   The dicing tape according to claim 3, wherein the crosslinking agent comprises an aromatic isocyanate.   The dicing tape according to claim 3 or 4, wherein the content of the photoinitiator is 0.5 to 1.5 parts by mass with respect to 100 parts by mass of the acrylic copolymer.

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