JP2013135146A - Integration-type tape for dicing and die bonding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an integration-type tape for dicing and die bonding which is superior in resistance to laser, allows easy pickup of a chip, includes an adhesive layer having a sufficient stickiness, and enables a scribe line to be expanded well.SOLUTION: The integration-type tape for dicing and die bonding comprises: a base-material film layer (A) which includes at least 90 mass% polyethylene, and is arranged so that the ratio of a quantity of permanent deformation in a horizontal direction to a quantity of permanent deformation in a vertical direction with respect to a direction of film formation ((Quantity of horizontal permanent deformation)/(Quantity of vertical permanent deformation)) is between 0.90 and 1.10 inclusive; an adhesive layer (B) including an acrylic resin, and a crosslinking agent; and an adhesive layer (C). The acrylic resin includes an acrylic resin (b1) having a hydroxyl group and no aromatic group in a proportion of 90 mass% or more. The crosslinking agent includes a crosslinking agent (b2) having, in one molecule, two or more functional groups capable of reacting with a hydroxyl group and no aromatic group in a proportion of 80 mass% or more. The content of the crosslinking agent is between 3 and 15 pts.mass inclusive to 100 pts.mass of the acrylic resin.

Description

  The present invention relates to a dicing / die bonding integrated tape.

  A dicing / die bonding integrated tape is a method in which an adhesive for fixing an individual chip (for example, a semiconductor chip) and a substrate, an electrode member, a chip, or the like to be attached to a workpiece (for example, a semiconductor wafer) before dicing. Etc.) and used for dicing the workpiece. In the conventional semiconductor device manufacturing process, when bonding individualized chips to an object to be adhered, the chips are mounted and cured after applying or affixing a die bond paste or die bond tape to a substrate. However, this method requires a step of applying or attaching a die bond paste or a die bond tape to each chip separated at the time of die bonding, and has a disadvantage that productivity is inferior.

  In order to improve the productivity, a technique of laminating a die bond tape and a dicing tape sequentially on a semiconductor wafer before dicing and dicing was proposed, thereby achieving a significant productivity improvement in the die bonding process. However, this method has a problem that the wafer needs two laminating steps, and depending on the combination of the dicing tape and the die bonding tape, a pick-up failure occurs in the die bonding step.

  For the purpose of further improving productivity and yield, a dicing / die bonding integrated tape in which a dicing tape and a die bonding tape are bonded in advance has been devised and used. When this dicing / die bonding integrated tape is used, since the lamination process to the semiconductor wafer is performed only once, it has a feature that the productivity is more excellent than the above-described method.

  In recent years, particularly in the field of semiconductor memory, the thickness of a wafer to be used has been reduced for the purpose of increasing the capacity of a package. As a result, in the conventional blade dicing, damage to the wafer during cutting increases, resulting in a problem that the wafer bending strength decreases. Therefore, laser full cut dicing has been proposed as a new wafer processing method replacing blade dicing. This method is a method of irradiating a wafer with, for example, a UV laser having a wavelength of 355 nm and cutting the wafer and the die bonding tape at a time. However, in the conventional dicing die-bonding integrated tape, the dicing tape is completely cut by the laser beam, or the dicing tape and the die bonding tape are fused by the heat of the laser, resulting in the die bonding process. In other words, there is a problem that it becomes impossible to pick up the chips separated into pieces.

  In order to solve such problems, various improved methods have been proposed. For example, Patent Document 1 proposes to use a thick processing tape having a total thickness of 300 μm or more in order to prevent it from being completely cut by a laser. However, this method has a drawback that when the film is rolled, not only the outer diameter becomes very large but also the weight becomes heavy, so that it is difficult to handle when mounting on a device such as a laminator. Yes.

JP 2006-245487 A

  The present invention provides a dicing and die bonding integrated tape that solves the above-described problems and satisfies the characteristics generally required for dicing tape, that is, has excellent laser resistance and easily picks up a chip. An object of the present invention is to provide a dicing / die-bonding integrated tape that can be used and that the pressure-sensitive adhesive layer has sufficient adhesiveness and that can extend the scribe line well.

As a result of intensive studies, the present inventor has found that the above problem can be solved by reducing the amount of the aromatic group contained in the pressure-sensitive adhesive layer (B).
That is, the embodiment of the present invention is a dicing / die bonding integrated tape having a base film layer (A), an adhesive layer (B), and an adhesive layer (C), and the base film layer (A) Contains 90 mass% or more of polyethylene, and the ratio of the amount of permanent set in the horizontal direction and the amount of permanent set in the vertical direction with respect to the film forming direction of the base film layer (A) ((the amount of permanent set in the horizontal direction) / (Vertical permanent strain amount)) is 0.90 or more and 1.10 or less, and the pressure-sensitive adhesive layer (B) has a hydroxyl group and an acrylic resin (b1) not having an aromatic group. An acrylic resin containing 90% by mass or more, and a crosslinking agent containing 80% by mass or more of a crosslinking agent (b2) having two or more functional groups capable of reacting with a hydroxyl group and having no aromatic group in one molecule. And the content of the crosslinking agent is 3% by mass with respect to 100 parts by mass of the acrylic resin. Above 15 parts by mass or less, about dicing die bonding integrated tape.
Further, as an embodiment of the present invention, the ratio of the light transmittance (T1) at 320 nm and the light transmittance (T2) at 280 nm of the laminate comprising the base film layer (A) and the pressure-sensitive adhesive layer (B) ( The dicing / die bonding integrated tape wherein T2 / T1) is 0.6 or more; the dicing / die bonding integrated tape wherein the crosslinking agent (b2) is an aliphatic polyfunctional isocyanate compound; adhesive layer (C ), An epoxy resin, an epoxy resin curing agent, and the above-mentioned dicing die bonding integrated tape containing an epoxy group-containing acrylic copolymer.

  According to the present invention, when used for laser full-cut dicing, it has excellent laser resistance, can easily pick up a chip, and the pressure-sensitive adhesive layer has sufficient adhesiveness to improve the scribe line. A dicing die bonding integrated tape that can be expanded can be provided.

Hereinafter, the invention will be described in detail.
A dicing / die bonding integrated tape according to an embodiment of the present invention is a dicing / die bonding integrated tape having a base film layer (A), an adhesive layer (B), and an adhesive layer (C). The base film layer (A) contains 90% by mass or more of polyethylene, and the ratio of the amount of permanent set in the horizontal direction to the amount of permanent set in the vertical direction with respect to the film forming direction of the base film layer (A) (( (Horizontal permanent strain) / (vertical permanent strain)) is 0.90 or more and 1.10 or less, and the pressure-sensitive adhesive layer (B) has a hydroxyl group and an aromatic group. 80% by mass of an acrylic resin containing 90% by mass or more of a non-acrylic resin (b1), and 2% of a functional group capable of reacting with a hydroxyl group in one molecule and having no aromatic group % Containing a crosslinking agent, and the content of the crosslinking agent is To acrylic resin 100 parts by weight of a tape is 15 parts by mass or more 3 parts by weight. The base film layer (A) and the pressure-sensitive adhesive layer (B) function as a dicing tape, and the adhesive layer (C) functions as a die bonding tape. By using such a material, the base film layer is not easily cut by laser light in the laser full cut dicing process, the chip can be easily picked up in the die bonding process, and the adhesive layer has sufficient adhesiveness. Thus, a tape capable of satisfactorily expanding the scribe line can be obtained.

  A base film layer (A) is a film whose content of polyethylene is 90 mass% or more with respect to the total mass of a base film, More preferably, it is 95 mass%. Since polyethylene has resistance to a third harmonic YAG laser (UV laser) used particularly in laser full cut dicing, the base film layer is hardly cut during laser dicing. On the other hand, polypropylene, polypropylene-polyethylene copolymer, polyethylene-methacrylic acid copolymer, and polyethylene-methacrylic acid copolymer metal ion cross-linked products known as other general-purpose polyolefin materials are easily cut by a laser. Tend. Polyethylene includes low-density polyethylene, linear low-density polyethylene, ultra-low-density polyethylene, medium-density polyethylene, high-density polyethylene, and the like depending on the production method, but is not particularly limited. In addition, the polyethylene film may be stretched polyethylene or non-stretched polyethylene as long as there is no significant difference in characteristics in the horizontal direction and the vertical direction with respect to the film forming direction at the time of film formation. Non-stretched polyethylene is preferred because it is less likely to make a difference. Such a film can be produced by known methods such as T-die extrusion, multilayer T-die extrusion, inflation molding, and calendar molding. Among them, T-die extrusion and multilayer T-die extrusion are preferable because a film with high thickness accuracy can be obtained.

  Although there is no restriction | limiting in particular about the thickness of a base film layer (A) here, The tape excellent in handling property and productivity is obtained, for example by using the thing of about 60-150 micrometers, Preferably about 80-100 micrometers. be able to. As the base film layer (A), a laminated film in which a plurality of films are laminated can also be used. In this case, the thickness of the entire laminated film is preferably within the above range.

  The base film layer (A) has a permanent strain amount after stretching at 100% for 180 seconds, and the ratio of the permanent strain amount in the horizontal direction and the vertical direction ((permanent strain in the horizontal direction) with respect to the film forming direction at the time of film formation. Amount) / (permanent distortion amount in the vertical direction)) is 0.90 or more and 1.10 or less. By using such a base film layer, it is possible not only to expand the scribe line uniformly in the expanding process, but also to eliminate the base film layer deflection by applying heat after expanding, as required. Even in the step of performing, the base film layer can be uniformly shrunk. If the ratio of permanent distortion in the horizontal and vertical directions is less than 0.90 or greater than 1.10, the expansion process changes in the vertical and horizontal directions in the expanding process, and heat is applied. Since the film does not shrink uniformly in the process of eliminating the deflection of the material film layer, a phenomenon called kerf shift occurs in which individual chips are shifted, making it difficult to recognize the chips in the die bonding process. The ratio of the permanent distortion amount is preferably 0.93 or more and 1.07 or less, more preferably 0.95 or more and 1.05 or less. In addition, the amount of permanent distortion after 100% 180 second stretching can be measured according to the method in the examples described later.

  As the base film layer (A), a commercially available polyethylene film can be used. At that time, as a base film layer (A), the ratio of permanent distortion amount ((horizontal permanent distortion amount) / (vertical permanent distortion amount)) was measured for a commercially available polyethylene film, and the value was measured. Can be selected and used in the range of 0.90 to 1.10.

  The pressure-sensitive adhesive layer (B) has a hydroxyl group-containing acrylic resin (b1) having no aromatic group, an acrylic resin containing 90% by mass or more based on the total acrylic resin, and a functional group capable of reacting with the hydroxyl group. It contains a crosslinking agent containing 80% by mass or more of the crosslinking agent (b2) having two or more in one molecule and having no aromatic group with respect to the total crosslinking agent. Here, the acrylic resin (b1) and the crosslinking agent (b2) may partially react in the pressure-sensitive adhesive layer (B), and a chemical bond may be formed by the reaction. The acrylic resin (b1) having a hydroxyl group and having no aromatic group is preferably contained in the acrylic resin in an amount of 95% by mass or more, and more preferably 100% by mass. The crosslinking agent (b2) having two or more functional groups capable of reacting with a hydroxyl group in one molecule and not having an aromatic group is preferably contained in an amount of 90% by mass or more in the crosslinking agent. More preferably, it is contained by mass%.

  By using the acrylic resin (b1) having a hydroxyl group and not having an aromatic group, the pressure-sensitive adhesive layer (B) and the adhesive layer (C) are hardly fused by the heat of the laser. Pickup performance is improved in the process. Without a hydroxyl group, the cohesive force of the pressure-sensitive adhesive layer is reduced, and not only the wafer cannot be sufficiently fixed, but also cannot sufficiently react with the cross-linking agent (b2), so the pressure-sensitive adhesive layer becomes very soft and slightly It becomes easy to fuse with the heat of the laser. Moreover, when it has an aromatic group, it tends to absorb laser light, and the pressure-sensitive adhesive layer (B) and the adhesive layer (C) are easily fused.

  Such an acrylic resin (b1) can be obtained by synthesis by a known method. For example, solution polymerization method, suspension polymerization method, emulsion polymerization method, bulk polymerization method, precipitation polymerization method, gas phase polymerization method Plasma polymerization method, supercritical polymerization method and the like are used. As a kind of polymerization reaction, radical polymerization, cationic polymerization, anionic polymerization, living radical polymerization, living cationic polymerization, living anion polymerization, coordination polymerization, immodal polymerization, and other methods such as ATRP and RAFT can be used. Among these, synthesis by radical polymerization using the solution polymerization method is not only good economic efficiency, high reaction rate, easy polymerization control, etc., but also using the resin solution obtained by polymerization as it is It is preferable because it is easy to blend.

Here, the method for obtaining the acrylic resin by radical polymerization using the solution polymerization method will be described as an example, and the method for synthesizing the acrylic resin (b1) will be described in detail.
Examples of the monomer used when synthesizing the acrylic resin (b1) include those having one (meth) acryl group in one molecule. Acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (Meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradec (Meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate, methoxypolypropylene glycol ( Aliphatic (meth) acrylates such as meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, mono (2- (meth) acryloyloxyethyl) succinate; cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentyl (meth) Acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate And cycloaliphatic (meth) acrylates such as mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate and mono (2- (meth) acryloyloxyethyl) hexahydrophthalate; glycidyl (meth) acrylate, α- Ethyl glycidyl (meth) acrylate, α-propyl glycidyl (meth) acrylate, α-butyl glycidyl (meth) acrylate, 2-methyl glycidyl (meth) acrylate, 2-ethyl glycidyl (meth) acrylate, 2-propyl glycidyl (meth) Acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl-6,7-epoxyheptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate Et Compounds having a lentic unsaturated group and an epoxy group; (2-ethyl-2-oxetanyl) methyl (meth) acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, 2- (2-ethyl-2) -Oxetanyl) ethyl (meth) acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, 3- (2-methyl- Compounds having an ethylenically unsaturated group and an oxetanyl group such as 2-oxetanyl) propyl (meth) acrylate; compounds having an ethylenically unsaturated group and an isocyanate group such as 2- (meth) acryloyloxyethyl isocyanate; 2-hydroxyethyl (Meth) acrylate, 2-hydroxypropyl (meth) acrylate , 4-hydroxybutyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and other compounds having an ethylenically unsaturated group and a hydroxyl group. Accordingly, these can be used in appropriate combination.

  Since the acrylic resin (b1) has a hydroxyl group, when the above-mentioned monomer is polymerized to obtain the acrylic resin (b1), at least a compound having an ethylenically unsaturated group and a hydroxyl group is used. The compound having an ethylenically unsaturated group and a hydroxyl group is preferably 10 to 50 parts by weight, more preferably 20 to 40 parts by weight, and more preferably 20 to 40 parts by weight with respect to 100 parts by weight of the monomer used when synthesizing the acrylic resin (b1). Preferably 30-40 mass parts can be used.

  As a polymerization initiator used in order to obtain an acrylic resin (b1), the compound which generate | occur | produces a radical by heating at 30 degreeC or more is mentioned, for example. Specifically, ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-butylperoxy)- 2-methylcyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis (t-hexyl) Peroxy) -3,3,5-trimethylcyclohexane and the like; hydroperoxides such as p-menthane hydroperoxide; α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide , T-butyl cumyl peroxide, di-t-butyl Dialkyl peroxides such as peroxides; Diacyl peroxides such as octanoyl peroxide, lauroyl peroxide, stearyl peroxide, benzoyl peroxide; bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxyethyl peroxide Peroxycarbonates such as oxydicarbonate, di-2-ethylhexylperoxydicarbonate, di-3-methoxybutylperoxycarbonate; t-butylperoxypivalate, t-hexylperoxypivalate, 1,1,3 , 3-Tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis (2-ethylhexanoylperoxy) hexane, t-hexylperoxy-2-ethylhexanoate , T-bu Luperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylauric Rate, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-butylperoxybenzoate, t-hexylperoxybenzoate, 2,5-dimethyl-2,5-bis (benzoyl) Peroxy) hexane, peroxyesters such as t-butylperoxyacetate; 2,2′-azobisisobutyronitrile, 2,2′-azobis (2,4-dimethylvaleronitrile), 2,2′- Azobis (4-methoxy-2′-dimethylvale Nitrile), and the like. These can be used alone or in combination of two or more. Moreover, the usage-amount of a polymerization initiator can be 0.01-2.0 mass parts with respect to 100 mass parts of monomers used when synthesize | combining an acrylic resin (b1), for example.

  Moreover, as a reaction solvent used in the solution polymerization, a solvent capable of dissolving an acrylic resin is preferably used. For example, aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; alcohols such as methanol, ethanol, isopropanol, butanol, ethylene glycol and propylene glycol; acetone , Methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, etc .; ketones such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone; ethylene carbonate, propylene Carbonates such as carbonate; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol Multivalents such as dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether Alcohol alkyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl Polyhydric alcohol alkyl ether acetates such as ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate; amides such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, etc. These organic solvents can be used alone or in combination of two or more. Furthermore, it can also superpose | polymerize using a supercritical carbon dioxide etc. as a solvent.

  Furthermore, photosensitivity can be imparted to the obtained acrylic resin (b1) by chemically bonding a functional group capable of reacting by irradiation with ultraviolet rays, electron beams, or visible rays by a reaction such as an addition reaction. it can. The functional group capable of reacting by irradiation with ultraviolet rays, electron beams, or visible rays as referred to herein includes ethylenically unsaturated bonds such as (meth) acryloyl group, vinyl group, allyl group, and the like. Group (hereinafter also referred to as an ethylenically unsaturated group), glycidyl group, epoxy group, oxetanyl group and the like.

  There is no particular limitation on the monomer composition and synthesis method used to obtain such an acrylic resin (b1). For example, when synthesizing the above acrylic resin, first, a functional group capable of reacting in advance, such as a hydroxyl group, A functional group capable of reacting with an acrylic resin is introduced by copolymerizing a monomer having a carboxyl group, a maleic anhydride group, a glycidyl group, an amino group, or the like. Next, the acrylic resin into which the reactive functional group is introduced has at least one ethylenically unsaturated group and at least one functional group selected from an epoxy group, an oxetanyl group, an isocyanate group, a hydroxyl group, a carboxyl group, and the like. Photosensitivity can be imparted to the acrylic resin by reacting a compound having a hydrogen atom and introducing an ethylenically unsaturated group into the side chain.

  The compound having at least one ethylenically unsaturated group and at least one functional group selected from an epoxy group, oxetanyl group, isocyanate group, hydroxyl group, carboxyl group and the like is not particularly limited, and glycidyl (meth) acrylate. , Α-ethylglycidyl (meth) acrylate, α-propylglycidyl (meth) acrylate, α-butylglycidyl (meth) acrylate, 2-methylglycidyl (meth) acrylate, 2-ethylglycidyl (meth) acrylate, 2-propylglycidyl (Meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl-6,7-epoxyheptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl ( A) Compounds having an ethylenically unsaturated group and an epoxy group, such as acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether; (2-ethyl-2-oxetanyl) methyl (meth) acrylate, (2-methyl 2-Oxetanyl) methyl (meth) acrylate, 2- (2-ethyl-2-oxetanyl) ethyl (meth) acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2- Compounds having an ethylenically unsaturated group and an oxetanyl group such as ethyl-2-oxetanyl) propyl (meth) acrylate and 3- (2-methyl-2-oxetanyl) propyl (meth) acrylate; methacryloyl isocyanate, 2-methacryloyloxyethyl Isocyanate, 2-acrylo Compounds having an ethylenically unsaturated group and an isocyanate group such as yloxyethyl isocyanate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2 -Compounds having an ethylenically unsaturated group and a hydroxyl group such as hydroxybutyl (meth) acrylate; (meth) acrylic acid, crotonic acid, cinnamic acid, succinic acid (2- (meth) acryloyloxyethyl), 2- Ethylenically unsaturated groups such as phthaloylethyl (meth) acrylate, 2-tetrahydrophthaloylethyl (meth) acrylate, 2-hexahydrophthaloylethyl (meth) acrylate, and ω-carboxy-polycaprolactone mono (meth) acrylate; Carboxyl group Such compounds may be mentioned.

  Among these, from the viewpoint of cost and reactivity, 2- (meth) acryloyloxyethyl isocyanate, glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, ethyl isocyanate (meth) acrylate, 2-hydroxy Ethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, (meth) acrylic acid, crotonic acid, 2-hexahydrophthaloylethyl (meth) acrylate, etc. It is preferable to react with a resin to impart photosensitivity.

  These compounds can be used alone or in combination of two or more. If necessary, a catalyst for promoting the reaction may be added, or a polymerization inhibitor may be added for the purpose of avoiding the cleavage of the double bond during the reaction. The compound having at least one ethylenically unsaturated group and at least one functional group selected from an epoxy group, an oxetanyl group, an isocyanate group, a hydroxyl group, a carboxyl group and the like is preferably 0.1% with respect to the acrylic resin. It can be made to react so that it may become a ratio of -2.0 mmol / g, More preferably, it is 0.3-1.5 mmol / g, More preferably, it is 0.5-1.0 mmol / g. The acrylic resin (b1) is particularly preferably a reaction product of an acrylic resin containing a hydroxyl group and at least one selected from 2-methacryloyloxyethyl isocyanate and 2-acryloyloxyethyl isocyanate.

  The hydroxyl value of the acrylic resin (b1) is preferably 20 to 200 mgKOH / g, more preferably 30 to 150 mgKOH / g, and still more preferably 60 to 150 mgKOH / g. When it is 20 mgKOH / g or more, it is preferable from the point that the reaction with the crosslinking agent (b2) is likely to proceed thereafter, and when it is 200 mgKOH / g or less, it is easy to control the polymerization heat generated during the synthesis of the acrylic resin, from the viewpoint of mass productivity. preferable. The hydroxyl value is a value measured according to JIS K0070.

  The weight average molecular weight of the acrylic resin (b1) is preferably 220,000 to 1,200,000, more preferably 300,000 to 1,000,000, still more preferably 400,000 to 1,000,000. When it is 220,000 or more, the intermolecular force is sufficiently high and preferable from the viewpoint of showing excellent adhesive properties, and when it is 1.2 million or less, it is preferable because it can be easily synthesized by a generally known synthesis method. In addition, a weight average molecular weight is a polystyrene conversion value using the calibration curve by a standard polystyrene by the gel permeation chromatography method (GPC).

  The acrylic resin may contain an acrylic resin other than the acrylic resin (b1) in a range of less than 10% by mass. Such acrylic resins include the above-described monomers, known aromatic (meth) acrylates, and at least one ethylenically unsaturated group, epoxy group, oxetanyl group, isocyanate group, hydroxyl group, and carboxyl group. Using a compound having at least one functional group selected from the above, it can be obtained by the same method as for the acrylic resin (b1). From the viewpoint of preventing fusion with the adhesive layer (C), it is preferable not to use an acrylic resin having an aromatic group for the pressure-sensitive adhesive layer (B).

  The crosslinking agent (b2) is a compound having two or more functional groups capable of reacting with a hydroxyl group in one molecule and having no aromatic group. Use of such a compound makes it difficult for the pressure-sensitive adhesive layer (B) and the adhesive layer (C) to be fused by the heat of the laser, and as a result, pick-up properties are improved in the die bonding step. If the number of functional groups capable of reacting with a hydroxyl group is less than 2 in one molecule, it cannot sufficiently react with the acrylic resin (b1), the pressure-sensitive adhesive layer becomes very soft, and is fused with a slight laser heat. It becomes easy. Moreover, when it has an aromatic group, it tends to absorb laser light, and it becomes easy to fuse with the adhesive layer (C).

  The functional group capable of reacting with the hydroxyl group of the crosslinking agent (b2) reacts with the hydroxyl group introduced into the acrylic resin (b1) to form a bond. Examples of the bond formed include an ester bond, an ether bond, and a urethane bond.

  The functional group capable of reacting with a hydroxyl group is preferably an isocyanate group. The use of a compound having an isocyanate group as the crosslinking agent (b2) is preferable because it easily reacts with the hydroxyl group of the acrylic resin (b1) to form a strong crosslinked structure.

  Specific examples of the compound having two or more isocyanate groups in one molecule and not having an aromatic group include dimethylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, and pentamethylene diisocyanate. And isocyanate compounds such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, and lysine diisocyanate. That is, as the crosslinking agent (b2), a compound generally known as an aliphatic polyfunctional isocyanate compound such as an aliphatic diisocyanate compound or an alicyclic diisocyanate compound can be used. These can be used alone or in combination of two or more.

  Furthermore, an isocyanate group-containing oligomer obtained by reacting the above-described isocyanate compound with a polyhydric alcohol having two or more hydroxyl groups in one molecule can also be used as the crosslinking agent (b2). In the case of obtaining such an oligomer, examples of polyhydric alcohols having two or more hydroxyl groups in one molecule include ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, glycerin, pentaerythritol, dipentaerythritol, 1,4-cyclohexanediol, 1,3-cyclohexanediol And diols and triols. These can be used alone or in combination of two or more.

  Among these, the crosslinking agent (b2) is a polyfunctional isocyanate having two or more isocyanate groups in one molecule and having no aromatic group, and a polyvalent isocyanate having three or more hydroxyl groups in one molecule. More desirably, it is an alcohol reactant. By using such an isocyanate group-containing oligomer, the pressure-sensitive adhesive layer forms a dense cross-linked structure, and the pressure-sensitive adhesive layer and the adhesive layer are hardly fused by the heat of the laser. This is preferable.

  The crosslinking agent may contain a crosslinking agent other than the crosslinking agent (b2) in a range of less than 20% by mass. Examples of such a crosslinking agent include aromatic polyfunctional isocyanate compounds such as aromatic diisocyanate compounds and isocyanate group-containing oligomers using aromatic polyfunctional isocyanate compounds. From the viewpoint of preventing fusion with the adhesive layer (C), it is preferable not to use a crosslinking agent having an aromatic group in the pressure-sensitive adhesive layer (B).

  Content of the crosslinking agent contained in an adhesive layer (B) is 3 to 15 mass parts with respect to 100 mass parts of acrylic resins. If the amount is less than 3 parts by mass, the cohesive force of the pressure-sensitive adhesive layer is reduced, and not only the wafer cannot be sufficiently fixed, but also cannot sufficiently react with the acrylic resin. It becomes easy to fuse. If it is larger than 15 parts by mass, the pressure-sensitive adhesive layer becomes too hard. As a result, for example, in the cleaning step after the laser full cut dicing step, the separated chips may be peeled off. For the above reasons, the amount is more preferably 6 parts by mass or more and 15 parts by mass or less.

  A photoinitiator that generates free radicals upon irradiation with active light may be added to the pressure-sensitive adhesive layer (B). Examples of such photoinitiators include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4-methoxy. -4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy Aromatic ketones such as -cyclohexyl-phenyl-ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1,2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, Benzoin methyl ether, benzoin ethyl ether, benzoin pheny Benzoin ethers such as ether, benzoins such as methylbenzoin and ethylbenzoin, benzyl derivatives such as benzyldimethyl ketal, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4 , 5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer 2-mer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxy) 2,4,5-triarylimidazole dimer such as phenyl) -4,5-diphenylimidazole dimer, - phenyl acridine, 1,7-bis (9,9'-acridinyl) including acridine derivatives heptane, and the like. These may be used alone or in combinations of two or more. As content of the said photoinitiator, it is preferable that it is 0.01-5.0 mass parts with respect to 100 mass parts of acrylic resins, and it is more preferable that it is 0.1-2.0 mass parts, 0 More preferably, it is 5-1.0 mass part. When it is 0.01 parts by mass or more, the curing reaction of the pressure-sensitive adhesive layer can be rapidly advanced by irradiation with ultraviolet rays, and when it is 5.0 parts by mass or less, a bad odor derived from a photoinitiator decomposition product generated by ultraviolet irradiation. Can be suppressed.

  Further, the ratio of the light transmittance (T1) at 320 nm and the transmittance (T2) at 280 nm of the laminate (dicing tape) comprising the base film layer (A) and the pressure-sensitive adhesive layer (B), T2 / T1, It is preferable that it is 0.6 or more. When the base film layer (A) and the pressure-sensitive adhesive layer (B) having such transmittance are used, the amount of heat generated due to the absorption of the laser light is small, so that the adhesive layer (B) is bonded to the pressure-sensitive adhesive layer (B). It becomes difficult to fuse with the agent layer (C) and can be easily picked up in the die bonding step. If it is less than 0.6, the pressure-sensitive adhesive layer (B) and the adhesive layer (C) may be easily fused by heat even with a slight laser output.

  The above range of T2 / T1 is achieved by selecting a material having no aromatic group as much as possible for the raw materials used for the base film layer (A) and the pressure-sensitive adhesive layer (B).

  Next, the adhesive layer (C) is preferably a layer containing, for example, an epoxy resin, an epoxy resin curing agent, and an epoxy group-containing acrylic copolymer. The adhesive layer (C) having such a composition is excellent in adhesion between chips / substrates and between chips / chips, and can provide electrode embedding properties and wire embedding properties. It is preferable in terms of having excellent curability in a short time, having excellent reliability after molding with a sealant, and the like.

  Here, the epoxy resin is, for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, an alicyclic epoxy resin, an aliphatic chain epoxy resin, a phenol novolac type epoxy resin, or a cresol novolac type epoxy. Resin, bisphenol A novolak type epoxy resin, diglycidyl etherified product of biphenol, diglycidyl etherified product of naphthalenediol, diglycidyl etherified product of phenol, diglycidyl etherified product of alcohol, and alkyl substitution products thereof, Bifunctional epoxy resins such as halides and hydrogenated products, and novolac type epoxy resins can be mentioned. Moreover, what is generally known, such as a polyfunctional epoxy resin and a heterocyclic ring-containing epoxy resin, can also be applied. These can be used alone or in combination of two or more. Furthermore, components other than the epoxy resin may be included as impurities within a range that does not impair the characteristics.

  The content of the epoxy resin is preferably 5 to 40 parts by mass and more preferably 10 to 35 parts by mass in 100 parts by mass of the total amount of the adhesive layer (C). The adhesive layer which has the outstanding adhesive force as it is 5 mass parts or more can be obtained, and the debris at the time of laser irradiation can be suppressed as it is 40 mass parts or less.

  Moreover, as an epoxy resin hardening | curing agent, the phenol resin which can be obtained by making a phenol compound and the xylylene compound which is a bivalent coupling group react in the presence of a catalyst or an acid catalyst is mentioned, for example.

  Examples of the phenol compound used for the production of the phenol resin include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, on-propylphenol, mn-propylphenol, p-n-propylphenol, o-isopropylphenol, m-isopropylphenol, p-isopropylphenol, on-butylphenol, mn-butylphenol, pn-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol, 2,4-xylenol, 2,6-xylenol, 3,5-xylenol, 2,4,6-trimethylphenol, resorcin, catechol, hydroquinone, 4 Methoxyphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, p-cyclohexylphenol, o-allylphenol, p-allylphenol, o-benzylphenol, p-benzylphenol, o-chlorophenol, p- Examples include chlorophenol, o-bromophenol, p-bromophenol, o-iodophenol, p-iodophenol, o-fluorophenol, m-fluorophenol, p-fluorophenol and the like. These phenol compounds may be used alone or in combination of two or more.

  The following xylylene dihalide, xylylene diglycol, and derivatives thereof can be used as the xylylene compound that is a divalent linking group used in the production of the phenol resin. That is, α, α′-dichloro-p-xylene, α, α′-dichloro-m-xylene, α, α′-dichloro-o-xylene, α, α′-dibromo-p-xylene, α, α ′ -Dibromo-m-xylene, α, α'-dibromo-o-xylene, α, α'-diiodo-p-xylene, α, α'-diiodo-m-xylene, α, α'-diiodo-o-xylene , Α, α′-dihydroxy-p-xylene, α, α′-dihydroxy-m-xylene, α, α′-dihydroxy-o-xylene, α, α′-dimethoxy-p-xylene, α, α′- Dimethoxy-m-xylene, α, α′-dimethoxy-o-xylene, α, α′-diethoxy-p-xylene, α, α′-diethoxy-m-xylene, α, α′-diethoxy-o-xylene, α, α′-di-n-propoxy-p-xylene, α α'-di-n-propoxy-m-xylene, α, α'-di-n-propoxy-o-xylene, α, α'-di-isopropoxy-p-xylene, α, α'-diisopropoxy -M-xylene, α, α'-diisopropoxy-o-xylene, α, α'-di-n-butoxy-p-xylene, α, α'-di-n-butoxy-m-xylene, α, α'-di-n-butoxy-o-xylene, α, α'-diisobutoxy-p-xylene, α, α'-diisobutoxy-m-xylene, α, α'-diisobutoxy-o-xylene, α, α ' -Di-tert-butoxy-p-xylene, α, α'-di-tert-butoxy-m-xylene, and α, α'-di-tert-butoxy-o-xylene. These can be used alone or in combination of two or more.

  When the above phenol compound and xylylene compound are reacted, mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid and polyphosphoric acid; organic compounds such as dimethyl sulfuric acid, diethyl sulfuric acid, p-toluenesulfonic acid, methanesulfonic acid and ethanesulfonic acid Carboxylic acids; Super strong acids such as trifluoromethane sulfonic acid; Strong acidic ion exchange resins such as alkane sulfonic acid type ion exchange resins; Super strong acidic ion exchange resins such as perfluoroalkane sulfonic acid type ion exchange resins Name: Nafion, Nafion, manufactured by Du Pont); natural and synthetic zeolites; using an acidic catalyst such as activated clay (acid clay), the xylylene compound which is substantially a raw material disappears at 50 to 250 ° C., and It is obtained by reacting until the reaction composition becomes constant. Although the reaction time depends on the raw materials and the reaction temperature, it is generally about 1 to 15 hours. In practice, it may be determined while tracking the reaction composition by GPC (gel permeation chromatography) or the like.

  The content of the epoxy resin curing agent is preferably 5 to 40 parts by mass, and more preferably 5 to 30 parts by mass in 100 parts by mass of the total amount of the adhesive layer (C). The adhesive layer which has the outstanding adhesive force as it is 5 mass parts or more can be obtained, and the debris at the time of laser irradiation can be suppressed as it is 40 mass parts or less.

  The epoxy group-containing acrylic copolymer is an acrylic copolymer having an epoxy group in the molecule, and preferably contains 0.5 to 6% by mass of glycidyl acrylate or glycidyl methacrylate having an epoxy group. In order to obtain a high adhesive force, 0.5% by mass or more is preferable, and if it is 6% by mass or less, gelation can be suppressed. The glass transition point (Tg) of the epoxy group-containing acrylic copolymer is preferably −50 ° C. or higher and 30 ° C. or lower, more preferably −10 ° C. or higher and 30 ° C. or lower.

  The amount of glycidyl acrylate or glycidyl methacrylate used as the functional group monomer is a copolymer ratio. That is, it refers to a copolymer obtained by using glycidyl acrylate or glycidyl methacrylate as a raw material in an amount of preferably 0.5 to 6% by mass with respect to the obtained copolymer. The remainder may be alkyl acrylate having 1 to 8 carbon atoms such as methyl acrylate or methyl methacrylate, alkyl methacrylate, styrene, acrylonitrile, or a mixture thereof. Among these, ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferable. The mixing ratio is preferably adjusted in consideration of the Tg of the copolymer. When Tg is less than −50 ° C., the tackiness of the adhesive layer (C) or the dicing / die-bonding integrated tape in the B-stage state tends to increase, and the handleability may deteriorate. There is no restriction | limiting in particular in a polymerization method, For example, pearl polymerization, solution polymerization, etc. are mentioned, A copolymer is obtained by these methods. Examples of such an epoxy group-containing acrylic copolymer include HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corporation).

  The weight average molecular weight of the epoxy group-containing acrylic copolymer is preferably 100,000 or more, and in this range, the adhesiveness and heat resistance are high, preferably 300,000 to 3,000,000, and 500,000 to 2,000,000. More preferably. If it is 3 million or less, the flowability is lowered, and thus the possibility that the filling property to the wiring circuit formed on the support member to which the semiconductor element is attached is lowered as required can be reduced. In addition, a weight average molecular weight is a polystyrene conversion value using the calibration curve by a standard polystyrene by the gel permeation chromatography method (GPC).

  The content of the epoxy group-containing acrylic copolymer is preferably 5 parts by mass to 90 parts by mass and more preferably 10 parts by mass to 80 parts by mass in 100 parts by mass of the total amount of the adhesive layer (C). preferable. When the amount is 5 parts by mass or more, the adhesive layer exhibits sufficient stress relaxation properties. As a result, it is possible to obtain excellent adhesion reliability. When the amount is 90 parts by mass or less, the adhesive has excellent cutting properties in blade dicing applications. A layer can be obtained.

  Moreover, you may add hardening accelerators, such as tertiary amine, imidazole, and quaternary ammonium salt, to the component of an adhesive bond layer (C) further as needed. Specific examples of such a curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, and the like. These may be used alone or in combination of two or more.

  When using a hardening accelerator, it is preferable that the content is 0.01 mass part-1 mass part in the total amount of 100 mass parts of an adhesive bond layer (C), and 0.05 mass part-0.5 mass part. More preferably, it is a part. When it is 0.01 part by mass or more, the thermosetting reaction of the adhesive layer can be rapidly advanced in the molding process, and when it is 1 part by mass or less, the thermosetting reaction of the adhesive layer in the wire bonding process can be suppressed. An adhesive layer applicable to a multi-stage stack structure can be obtained.

  Furthermore, an inorganic filler can be added to the component of the adhesive layer (C) as necessary. Specifically, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, An amorphous silica etc. are mentioned, These can be used by 1 type or can also use 2 or more types together.

  As the inorganic filler, it is also possible to use an inorganic filler whose surface is modified with an organic group. Such an inorganic filler is excellent in dispersibility with respect to the varnish when forming the adhesive layer, and is preferable from the viewpoint of preventing clogging of the filter and reducing defects such as blisters during film formation. As an organic group, alkyl groups, such as a methyl group and an ethyl group, are mentioned, for example.

  When using an inorganic filler, the content thereof is preferably 5 to 50 parts by mass, and preferably 5 to 40 parts by mass, in a total amount of 100 parts by mass of the adhesive layer (C). As a result of increasing the cohesive force of the adhesive layer when it is 5 parts by mass or more, an adhesive layer having an excellent adhesive force can be obtained, and when it is 50 parts by mass or less, there are few irregularities and the coating property is good. An adhesive layer varnish can be obtained.

  Furthermore, a coupling agent can be appropriately added to the adhesive layer component as necessary for the purpose of increasing the adhesive strength. Examples of the coupling agent include a silane coupling agent and a titanium coupling agent, and among them, a silane coupling agent is preferable.

  The dicing / die bonding integrated tape usually has a base film layer (A), an adhesive layer (B), and an adhesive layer (C) in this order. Furthermore, even if it has arbitrary layers, each layer may be formed from two or more layers.

  The manufacturing method of the dicing die bonding integrated tape is not particularly limited. For example, the composition for forming the pressure-sensitive adhesive layer (B) and the adhesive layer (C) is dissolved or dispersed in a solvent to form a varnish. Each varnish is coated on a release film, heated, the solvent is removed, the base film layer (A) is applied to the adhesive layer (B), and the adhesive layer (C) is applied. Laminate a cover film to produce a dicing tape and a die bonding tape. Thereafter, the release film on the dicing tape side and the cover film on the die bonding tape side are each peeled off and bonded together so that the adhesive layer (C) is in contact with the adhesive layer (B) of the dicing tape. it can.

  The thickness of an adhesive layer (B) can be 5-40 micrometers, for example, Preferably it is 10-30 micrometers. When it is 5 μm or more, sufficient adhesion to the adhesive layer is easily obtained, and when it is 40 μm or less, a dicing tape having good productivity can be obtained. Moreover, the thickness of an adhesive bond layer (C) can be 3-100 micrometers, for example. When it is 3 μm or more, it has a sufficient adhesive force, and when it is 100 μm or less, an adhesive layer excellent in productivity can be obtained.

  The solvent that can be used for the varnishing is not particularly limited. However, in consideration of volatility when forming each layer, for example, methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxy It is preferable to use a solvent having a relatively low boiling point such as ethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, ethyl acetate, isobutyl acetate, toluene and xylene. In addition, for the purpose of improving the coating properties, for example, a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, cyclohexanone can be used. These solvents can be used alone or in combination of two or more.

  Further, when the composition of the adhesive layer (C) to which the inorganic filler is added is varnished, it is preferable to use a raking machine, a three roll, a ball mill, a bead mill, etc. in consideration of the dispersibility of the inorganic filler. These can also be used in combination. Moreover, after mixing an inorganic filler and a low molecular weight raw material beforehand, the mixing time can also be shortened by mix | blending a high molecular weight raw material. Further, after the varnish is formed, bubbles in the varnish can be removed by vacuum degassing or the like.

  As a coating method of the varnish on the film base layer (A), a known method can be used, for example, knife coating method, roll coating method, spray coating method, gravure coating method, bar coating method, curtain coating. Law.

  When the pressure-sensitive adhesive layer (B) of the dicing die-bonding integrated tape obtained as described above is irradiated with radiation, the pressure-sensitive adhesive layer (B) is cured after irradiation, and the adhesive layer (C) and the pressure-sensitive adhesive layer ( B) Since the adhesive strength at the interface is greatly reduced, the semiconductor chip can be easily picked up from the pressure-sensitive adhesive layer (B) while the adhesive layer (C) is held on the semiconductor chip.

  In addition to the method of reducing the adhesive strength of the pressure-sensitive adhesive layer (B) only by irradiation, heating may be used in combination for the purpose of accelerating the curing reaction simultaneously with irradiation or after irradiation. By using radiation irradiation and heating together, it is possible to reduce the adhesive strength at the interface between the pressure-sensitive adhesive layer (B) and the adhesive layer (C) at a lower temperature in a shorter time. Although heating temperature will not be restrict | limited especially if it is below the decomposition point of an adhesive layer (B) and an adhesive bond layer (C), The temperature of 50-170 degreeC is preferable.

  Examples of the present invention will be described more specifically below, but the present invention is not limited to these examples. Unless otherwise stated, all chemicals used reagents.

[Create die bonding tape]
YDCN-703 (trade name, manufactured by Toto Kasei Co., Ltd., cresol novolac type epoxy resin, epoxy equivalent 210, molecular weight 1200, softening point 80 ° C.) 55 parts by mass as an epoxy resin, and Mirex XLC-LL (Mitsui Chemicals, Inc.) as a phenol resin ) Product name, phenol resin (phenol aralkyl resin), hydroxyl group equivalent 175, water absorption 1.8%, heating weight reduction rate at 350 ° C. 4%) 45 parts by mass, NUC A-189 (Nihon Unicar) as silane coupling agent Product name, γ-mercaptopropyltrimethoxysilane) 1.7 parts by mass and NUC A-1160 (Nihon Unicar Co., Ltd. product name, γ-ureidopropyltriethoxysilane) 3.2 parts by mass, filler Aerosil R972 (silica surface coated with dimethyldichlorosilane, 400 A cyclohexanone composition comprising 32 parts by mass of a filler having an organic group such as a methyl group on its surface hydrolyzed in a reactor of No. 2, a product name of Nippon Aerosil Co., Ltd., silica, average particle size 0.016 μm). The mixture was stirred and mixed, and further kneaded for 90 minutes using a bead mill.

  280 parts by mass of acrylic rubber HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corp., weight average molecular weight 800,000, Tg-7 ° C) containing 3% by mass of glycidyl acrylate or glycidyl methacrylate, and a curing accelerator As a cure sol 2PZ-CN (trade name, 1-cyanoethyl-2-phenylimidazole, manufactured by Shikoku Kasei Co., Ltd.) 0.5 parts by mass, stirred and mixed, vacuum degassed to obtain a varnish.

  The varnish is coated on a polyethylene terephthalate tape having a release treatment of 35 μm thick, and dried by heating at 140 ° C. for 5 minutes to form a B-stage coating film (adhesive layer) with a film thickness of 20 μm. The die bonding tape provided with was produced.

Example 1
[Synthesis of acrylic resin]
1000g of ethyl acetate, 650g of 2-ethylhexyl acrylate, 350g of 2-hydroxyethyl acrylate, and 3.0g of azobisisobutyronitrile were blended in a 4000ml autoclave equipped with a three-one motor, stirring blade and nitrogen inlet tube. After stirring until uniform, bubbling was performed at a flow rate of 100 ml / min for 60 minutes to degas dissolved oxygen in the system. The temperature was raised to 60 ° C. over 1 hour, and the temperature was raised and polymerized for 4 hours. Thereafter, the temperature was raised to 90 ° C. over 1 hour, further maintained at 90 ° C. for 1 hour, and then cooled to room temperature.

  Next, 1000 g of ethyl acetate was added and stirred for dilution. After adding 0.1 g of methoquinone as a polymerization inhibitor and 0.05 g of dioctyltin dilaurate as a urethanization catalyst, 100 g of 2-methacryloyloxyethyl isocyanate (Karenz MOI manufactured by Showa Denko KK) was added at 70 ° C. For 6 hours and then cooled to room temperature. Thereafter, ethyl acetate was added to adjust the non-volatile content in the acrylic resin solution to 35% by mass to obtain an acrylic resin solution having a functional group capable of chain polymerization.

  When the acid value and the hydroxyl value were measured according to JIS K0070, the acid value was not detected. When the hydroxyl value was determined, it was 121 mgKOH / g. Moreover, the obtained acrylic resin was vacuum-dried overnight at 60 ° C., and the obtained solid content was subjected to elemental analysis with a fully automatic elemental analysis device varioEL manufactured by Elemental Co., and 2-methacryloyloxyethyl introduced from the nitrogen content. It was 0.59 mmol / g when content of the isocyanate was computed. Also, SD-8022 / DP-8020 / RI-8020 manufactured by Tosoh Corporation was used, Gelpack GL-A150-S / GL-A160-S manufactured by Hitachi Chemical Co., Ltd. was used as the column, and tetrahydrofuran was used as the eluent. As a result of GPC measurement, the weight average molecular weight in terms of polystyrene was 420,000.

[Create dicing tape]
100 g of the acrylic resin solution obtained by the method described above as a solid content, and aliphatic polyfunctional isocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate HL, hexane diisocyanate adduct of polyfunctional alcohol) as a solid content as a solid content. 3.0 g, 1.0 g of 1-hydroxycyclohexyl phenyl ketone (manufactured by Ciba Specialty Chemicals Co., Ltd., Irgacure 184) as a photoinitiator, and ethyl acetate so that the total solid content is 27% by mass, It stirred uniformly for 10 minutes and the varnish for adhesive layers for dicing tapes was obtained.

  Adjust the gap so that the thickness of the pressure-sensitive adhesive layer is 10 μm using an applicator on a polyethylene terephthalate tape with a width of 350 mm, a length of 400 mm, and a thickness of 38 μm. The coating was performed while drying at 80 ° C. for 5 minutes.

  Separately, using a 400 mm square, 100 μm thick base film (unstretched low-density polyethylene film) with corona treatment on one side and matte treatment on one side, the polyethylene terephthalate tape with the above-mentioned pressure-sensitive adhesive layer and the corona-treated surface of the base film The pressure-sensitive adhesive layer surface was bonded at room temperature and adhered with a rubber roll to transfer the pressure-sensitive adhesive layer to the substrate film. Then, the dicing tape with a cover tape was obtained by leaving at 40 degreeC for 3 days.

[Production of dicing and die bonding integrated tape]
The die bonding tape obtained by the method described above was cut into a circle having a diameter of 320 mm together with the carrier tape. A dicing tape with the cover tape peeled off was affixed thereto at room temperature, and then allowed to stand at room temperature for 1 day. Thereafter, the dicing tape was cut into a circle having a diameter of 390 mm to obtain a dicing / die bonding integrated tape.

(Example 2)
A dicing die-bonding integrated tape was obtained using the same method except that the amount of the crosslinking agent in Example 1 was 6.0 g as a solid content.

(Example 3)
A dicing / die bonding integrated tape was obtained in the same manner except that the amount of the crosslinking agent in Example 1 was changed to 13.0 g as a solid content.

Example 4
A dicing / die bonding integrated tape was obtained by using the same method except that the amount of the crosslinking agent in Example 1 was changed to 15.0 g as a solid content.

(Example 5)
A base film of 400 mm square with a thickness of 100 μm (unstretched low density polyethylene / ultra low density polyethylene / low density polyethylene multilayer film) having a corona treatment on one side and a mat treatment on the other side is applied to the base film of Example 3. A dicing / die bonding integrated tape was obtained using the same method except that it was used.

(Comparative Example 1)
[Create dicing tape]
100 g of the acrylic resin solution obtained by the above-described method as a solid content, 1.0 g of an aliphatic polyfunctional isocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate HL) as a cross-linking agent, and 1 as a photoinitiator -1.0 g of hydroxycyclohexyl phenyl ketone (manufactured by Ciba Specialty Chemicals Co., Ltd., Irgacure 184), ethyl acetate was added so that the total solid content was 27% by mass, and the mixture was stirred uniformly for 10 minutes before dicing tape A varnish for the pressure-sensitive adhesive layer was obtained.

  Adjust the gap so that the thickness of the pressure-sensitive adhesive layer is 10 μm using an applicator on a polyethylene terephthalate tape with a width of 350 mm, a length of 400 mm, and a thickness of 38 μm. The coating was performed while drying at 80 ° C. for 5 minutes.

  Separately, using a 400 mm square, 100 μm thick base film (unstretched low-density polyethylene film) with corona treatment on one side and matte treatment on one side, the polyethylene terephthalate tape with the above-mentioned pressure-sensitive adhesive layer and the corona-treated surface of the base film The pressure-sensitive adhesive layer surface was bonded at room temperature and adhered with a rubber roll to transfer the pressure-sensitive adhesive layer to the substrate film. Then, the dicing tape with a cover tape was obtained by leaving at 40 degreeC for 3 days.

[Production of dicing and die bonding integrated tape]
The die bonding tape obtained by the method described above was cut into a circle having a diameter of 320 mm together with the carrier tape. A dicing tape with the cover tape peeled off was affixed thereto at room temperature, and then allowed to stand at room temperature for 1 day. Thereafter, the dicing tape was cut into a circle having a diameter of 390 mm to obtain a dicing / die bonding integrated tape.

(Comparative Example 2)
A dicing / die bonding integrated tape was obtained using the same method except that the amount of the crosslinking agent in Comparative Example 1 was changed to 18.0 g as a solid content.

(Comparative Example 3)
As a crosslinking agent of Comparative Example 1, 6.5 g of aliphatic polyfunctional isocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate HL) and solid polyfunctional isocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate L) A dicing / die bonding integrated tape was obtained using the same method except that 6.5 g of a polyfunctional alcohol tolylene diisocyanate adduct) was used as a solid content.

(Comparative Example 4)
As the base film of Example 3, a 400 mm square base film (non-stretched polypropylene / ethylene-vinyl acetate copolymer / polypropylene film multilayer film) having a corona treatment on one side and a mat treatment on one side and having a thickness of 100 μm is used. All used the same method to obtain a dicing and die bonding integrated tape.

(Comparative Example 5)
The same method was used as the base film of Example 3 except that a 400 mm square and 100 μm thick base film (unstretched soft polypropylene film) with one side corona-treated and one side matted was used. An integrated tape was obtained.

[Measurement method of permanent strain ratio]
A strip-shaped test piece having a width of 10 mm and a length of 80 mm was cut out from the base film so that the long sides thereof were respectively along the horizontal direction and the vertical direction with respect to the film forming direction. Next, using an autograph AGS-1000G manufactured by Shimadzu Corporation, the distance between chucks was set to 50 mm, and the test piece was extended by 50 mm (a distance of 100% with respect to the distance between chucks) at a speed of 50 mm / min. It was held for 3 minutes from the time of 100% elongation, and then the elongation was released at a speed of 50 mm / min until the stress detected by the load cell became zero. From the test piece length when the stress became zero, the amount of permanent strain was measured according to the following formula.
[Formula 1]
(Permanent distortion amount) = {(Sample length after measurement) − (50)} / 50 × 100%

The amount of permanent strain in the horizontal direction and the vertical direction of the base film was measured in the same manner, and the permanent strain amount ratio was calculated according to the following formula.
[Formula 2]
(Permanent strain ratio) = (Horizontal permanent strain) / (Vertical permanent strain)

[Measurement method of light transmittance ratio]
A UV / VIS / NIR spectrophotometer V-570 manufactured by JASCO Corporation was used. Using a dicing tape (a laminate of a base film layer and an adhesive layer) cut into 4 cm pieces, linear light is emitted from the base film layer side at a scanning range of 200 to 800 nm, a scanning step of 1 nm, and an operation speed of 600 nm / min. Incidence was measured for transmittance. A linear light transmittance (T1) at 320 nm and a linear light transmittance (T2) at 280 nm were obtained. The light transmittance ratio was calculated according to the following formula.
[Formula 3]
(Light transmittance ratio) = (Linear light transmittance at 280 nm (T2)) / (Linear light transmittance at 320 nm (T1))

[Evaluation of laser resistance]
A dicing die bonding integrated tape was cut into 5 cm pieces. This was irradiated with a third harmonic YAG laser (laser output 5 W, frequency 100 kHz) at a defocus of 30 μm and a speed of 100 mm / sec. After the irradiation, the substrate surface of the dicing tape was observed to check whether the substrate film layer was completely broken, and judged according to the following criteria.
○: The base film layer does not break. Δ: The base film layer is completely cut by a part of the irradiation. X: The base film layer is all cut in all the irradiation.

[Processability evaluation]
The dicing die bonding integrated tape was laminated at 70 ° C. on a mirror wafer (size 12 inches, thickness 30 μm) together with the wafer ring. Thereafter, full cutting was performed with a laser together with the die bonding tape at a chip size of 10 mm square using a full automatic laser saw DFL7160 manufactured by DISCO Corporation. Thereafter, the expansion was performed using a full automatic die separator DDS-2300 manufactured by DISCO Corporation, and then the deflection of the film was eliminated by heat shrinkage. Thereafter, the wafer surface was washed with a water flow, and it was confirmed whether or not the separated chips were not peeled off. Thereafter, the scribe line was observed with an optical microscope and judged according to the following criteria.
◎: The scribe line is uniform in the vertical and horizontal directions and is sufficiently expanded. ○: The scribe line is expanded but is not uniform in the vertical and horizontal directions. ×: The scribe line is only in one direction. However, it is not expanded and is non-uniform. For practical use, there is no problem and ◎ is more preferable.

[Pickup evaluation]
The sample used for the above-mentioned workability evaluation was used. First, UV irradiation was performed at an illuminance of 70 mW / cm ² and an irradiation amount of 100 mJ / cm ² using a UV irradiation apparatus manufactured by Oak Seisakusho. Thereafter, a pick-up of 50 chips was carried out using a die bonder BEST-02 from Canon Machinery at a collet size of 9 mm, a pin number of 13 pins, and a push-up speed of 20 mm / sec. Based on the success rate of pickup at this time, the following criteria were used.
◎: 100% pick-up success rate at pin height 300nm
○: Pickup success rate of 98% or more at a pin height of 300 nm. Δ: Pickup success rate of 90% or more at a pin height of 300 nm. X: Pickup success rate of less than 90% at a pin height of 300 nm. More preferred.

  The dicing die bonding integrated tapes of Examples 1 to 5 have excellent laser resistance in the laser full cut dicing process, the scribe line is uniformly expanded after the expanding process, and no kerf shift occurs during heat shrinkage. The pick-up property was good. Further, the chip was not peeled off during the wafer cleaning. However, in Comparative Example 1 in which the amount of the crosslinking agent was too small, the pick-up property was lowered, and in Comparative Example 2 in which the amount of the crosslinking agent was too large, chip peeling was observed during cleaning. Further, pickup could not be performed in Comparative Example 3 using a crosslinking agent having an aromatic group. In Comparative Example 4 having a high permanent strain ratio, a kerf shift was observed, and in Comparative Example 5 in which a soft polypropylene resin was used for the base film layer, the base material was completely cut by the laser, and the pickup property was high. Evaluation was not possible.

  As described above, according to the present invention, it is possible to provide a dicing / die bonding integrated tape having good characteristics in a laser full cut dicing process.

  The dicing die bonding tape of the present invention has excellent laser resistance in the laser full-cut dicing process, the scribe line is uniformly expanded after the expanding process, and kerf shift does not occur at the time of heat shrinking, and the pickup property is good. . Furthermore, since the chips are not peeled off during the wafer cleaning, it is possible to obtain higher productivity than before when processing a particularly thin wafer by using it in the semiconductor manufacturing process. The dicing die bonding tape of the present invention can be used for both the laser full cut dicing process and the blade dicing process.

Claims (4)

A dicing / die bonding integrated tape having a base film layer (A), an adhesive layer (B), and an adhesive layer (C),
The base film layer (A) contains 90% by mass or more of polyethylene,
A ratio of (permanent strain in the horizontal direction) / (permanent strain in the vertical direction) between the amount of permanent set in the horizontal direction and the amount of permanent set in the vertical direction with respect to the film forming direction of the base film layer (A). 0.90 or more and 1.10 or less,
The pressure-sensitive adhesive layer (B) has an acrylic resin containing 90% by mass or more of an acrylic resin (b1) having a hydroxyl group and no aromatic group, and two functional groups capable of reacting with a hydroxyl group in one molecule. A cross-linking agent containing at least 80% by mass of the cross-linking agent (b2) having no aromatic group.
The content of the crosslinking agent is 3 parts by mass or more and 15 parts by mass or less with respect to 100 parts by mass of the acrylic resin.
Dicing and die bonding integrated tape.   The ratio (T2 / T1) between the light transmittance (T1) at 320 nm and the light transmittance (T2) at 280 nm of the laminate comprising the base film layer (A) and the pressure-sensitive adhesive layer (B) is 0.6. The dicing / die bonding integrated tape according to claim 1, which is as described above.   The dicing / die bonding integrated tape according to claim 1 or 2, wherein the crosslinking agent (b2) is an aliphatic polyfunctional isocyanate compound.   The dicing die bonding integrated tape according to any one of claims 1 to 3, wherein the adhesive layer (C) contains an epoxy resin, an epoxy resin curing agent, and an epoxy group-containing acrylic copolymer.