JP2017200124A - Package for electronic component accommodation, and electronic device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for electronic component accommodation capable of downsizing an external dimension of a product while improving conductivity when mounting an electronic component within a cavity.SOLUTION: A package 1A for electronic component accommodation comprises: a package body 3 in which a cavity 5 is formed for accommodating an electronic component 15; at least one step 6 protrusively provided in at least a part of an inner side face of the cavity 5; at least one groove 9 formed on a step surface 7 of the step 6; a vertical conductor 10 which is attached into the groove 9 or fills the inside of the groove; and a first conductor pad 11 attached onto a horizontal surface 8 of the step 6 and electrically connected with the vertical conductor 10. An end face shape of the groove 9 on the horizontal surface 8 forms a part of any annular shape and in a case where any annular shape is overlapped with the end face shape of the groove 9, a region where both the shapes are overlapped is less than 50%.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component storage package for storing electronic components such as a piezoelectric element, an IC chip, and a temperature sensor, and an electronic device using the same.

2. Description of the Related Art Conventionally, in order to meet the need for a small and low-profile electronic device, an electronic device incorporated in the electronic device and a package for storing an electronic component used therein are also required to be small and low-profile.
In general, as a method for mounting an electronic component such as a piezoelectric element on an electronic component storage package, for example, a method disclosed in Japanese Unexamined Patent Application Publication No. 2009-141666 (Patent Document 1) is known.
More specifically, as shown in FIG. 2 of Patent Document 1 as a prior art, a stepped step portion is formed on the inner surface of the hollow portion (cavity) of the container body 1 that is an electronic component storage package. Then, the electrode through hole 7 is formed in the horizontal surface of the stepped portion, the inside thereof is filled with a conductive metal, and the crystal holding terminal 5 is formed so as to cover the upper end portion of the electrode through hole 7. The terminal of the crystal piece 3, which is a piezoelectric element, is bonded to the crystal holding terminal 5 via the conductive adhesive 11.
However, when the structure shown in FIG. 2 of Patent Document 1 as described above is adopted, the electrode penetrates without causing a crack or the like in the stepped portion projecting from the inner surface of the cavity (hollow portion) of the container body 1. In order to form the hole 7, it was necessary to ensure a sufficient distance from the inner surface of the cavity (hollow part) to the end face of the stepped part.
In this case, there is a problem that it is difficult to reduce the outer dimensions of the container body 1 of the electronic component storage package.
And some inventions for dealing with such a situation are disclosed.

In Patent Document 1, the name “surface mounted crystal oscillator” is used, and a surface mount crystal oscillator (hereinafter referred to as a surface mount oscillator) is a technical field. An invention relating to an inexpensive surface-mount oscillator is disclosed.
The invention disclosed in Patent Document 1 will be described using the reference numerals in the document as they are, and a container body 1 made of a laminated ceramic having a bottom wall 1a and a frame wall 1b and having an inner wall step portion and a concave shape; An IC chip 2 in which an IC terminal is fixed to a circuit terminal 6 provided on the inner bottom surface of the container main body 1 and a crystal holder provided on the surface of an inner wall step provided on one end side of the container main body 1 The crystal circuit terminal 6a to which the crystal terminal 3 in the IC terminal of the circuit terminal 6 is connected is provided to the terminal 5 and the crystal piece 3 to which both ends of the extension electrode extending from the excitation electrode are fixed to the terminal 5. In the surface-mount crystal oscillator disposed closest to the inner wall, the crystal holding terminal 5 and the conductive path 6x on the inner bottom surface extending from the crystal circuit terminal 6a closest to the inner wall step to the wall surface One end of the crystal piece 3 A conductive adhesive 11 on both sides are fixed is characterized in that the electrically connected.
In other words, the invention disclosed in Patent Document 1 is provided on the inner surface of the cavity (hollow part) instead of forming the electrode through hole 7 in the prior art shown in FIG. By applying the conductive adhesive 11 to the projecting end surface of the stepped portion, the distance from the inner surface of the cavity (hollow portion) to the end surface of the stepped portion is shortened, and the container body which is an electronic component storage package A large IC chip is accommodated while maintaining the external dimensions of 1.
According to the invention disclosed in Patent Document 1 having the above-described configuration, the crystal holding terminal and the crystal circuit terminal are connected by the conductive adhesive 11 that fixes one end of the crystal piece to the inner wall step portion of the container body. No electrode through-hole is required as in the example. Therefore, the protrusion length of the inner wall step portion can be shortened to increase the area of the inner bottom surface of the container body. Further, since no electrode through hole is provided, no crack is generated in the stepped portion in the processing step for forming the through hole.

Patent Document 2 discloses an invention related to a ceramic package for mounting an electronic component such as a semiconductor element and an electronic device using the ceramic package under the name of “ceramic package and electronic device”.
The invention disclosed in Patent Document 2 is a ceramic package including a ceramic substrate having a cavity for mounting an electronic component in a substantially central portion, and the side wall is perpendicular to the side wall of the ceramic substrate that defines the cavity. A conductor pattern having a semi-oval circular cross section that is notched and penetrated is formed, and the conductor pattern connects the wiring patterns provided on the surface and / or inside of the ceramic substrate. It is characterized by being.
According to the invention disclosed in Patent Document 2 having the above configuration, it is a ceramic package capable of lateral conduction, easy to manufacture, the width of the concave groove provided with the conductor pattern is narrow, and high-density wiring is possible. In addition, it is possible to provide a ceramic package having a high dimensional accuracy of the groove and showing no positional deviation. In addition, in the process of forming a through-hole for forming a conductor pattern having a semi-oval shape with a cross section perpendicular to the central axis, the green sheet is cracked because the through-hole is processed with a die punch or the like so as to be applied to the cavity. Less likely to occur.

JP 2009-141666 A JP 2004-55985 A

In the case of the invention disclosed in Patent Document 1, the conductive adhesive 11 is hung on the end surface of the inner wall step portion of the cavity of the container body 1 and the conductive adhesive 11 is applied to the end surface of the step portion.
In this case, although it has the merit that the protrusion length of the inner wall step part (step part) of the cavity of the container main body 1 can be shortened, there is a problem that the yield at the time of product manufacture is reduced.
More specifically, depending on how the conductive adhesive 11 hangs down on the end face of the inner wall step of the cavity of the container body 1, poor conduction occurs because the dropped conductive adhesive 11 does not contact the target electrode. Alternatively, there is a concern that the dripping conductive adhesive 11 may come into contact with an undesired electrode to increase the risk of a short circuit, resulting in a decrease in product yield.

In the case of the invention disclosed in Patent Document 2, the distance from the inner surface of the cavity to the end surface of the step portion is shortened by providing a semi-oval conductive pattern on the end surface of the step portion formed on the inner surface of the cavity. While the effect of being able to be expected can be expected, the following troubles are expected to occur.
This problem will be described in detail with reference to FIG.
FIG. 10 is a diagram visualizing the shape of the surface around the through-hole, although a through-hole is formed in the unfired ceramic sheet and the through-hole is filled with an unfired conductor metal.
Normally, the unfired ceramic sheet in which the through hole is formed and the unfired conductive metal filled in the through hole have a dent in the opening of the through hole after firing, as shown in FIG. There arises a state in which the undulations in the opening become more intense than the periphery of the opening of the hole.
In the case of the invention disclosed in the cited document 2, an electronic component such as a piezoelectric element is formed on a conductor metal having a dent as shown in FIG. Since the electrodes are joined, there is an increased risk of poor conduction. For this reason, it is predicted that the non-defective product rate is reduced during the production of the product, and it is difficult to improve the productivity.
Further, in the invention disclosed in Patent Document 2, when the semi-elliptical through hole is completely filled with a conductive metal, and the end face of the step portion provided with such a semi-elliptical through hole and When the conductor pattern to be printed and applied is close to the plane arranged at the base, it is difficult to specify the position of the semi-oval through hole by image processing in the image taken from above. It is.
In other words, the boundary between the horizontal surface of the stepped portion projecting from the inner surface of the cavity and the plane disposed at the base of the stepped portion is a semi-oval shape when an image obtained by directly imaging these is image-processed It becomes difficult to specify the position of the through hole. In this case, there arises a problem that the connection position of the bonding wire cannot be determined avoiding the upper end surface of the semi-oval through hole.

The present invention has been made in response to such a conventional situation, and an electronic device capable of reducing the outer dimensions of an electronic component storage package while reducing the risk of poor conduction when mounting electronic components in a cavity. It is an object to provide a component storage package and an electronic device using the same.
Furthermore, when the electronic component storage package is imaged from directly above, the position of the semicircular through hole formed in the stepped portion formed in the cavity can be easily identified by performing image processing on this image. An object of the present invention is to provide an electronic component storage package and an electronic device using the same.

In order to solve the above problems, the electronic component storage package according to the first aspect of the present invention is an electronic component storage package comprising a ceramic sintered body that is an insulator and a conductive metal, and a cavity for storing the electronic component is formed. Packaged body, at least one stepped portion projecting from at least a part of the inner side surface of the cavity, at least one groove portion formed by notching the stepped surface of the stepped portion in the vertical vertical direction, and the inside of the groove portion A vertical conductor portion made of conductive metal and deposited on or filled with a first conductive pad portion deposited on a horizontal surface of the stepped portion and made of conductive metal and electrically connected to the vertical conductor portion. The end face shape of the groove portion on the horizontal plane is a part of an arbitrary annular shape, and when the annular shape and the end face shape are overlapped, the overlapping area is less than 50%, and the vertical conductor The inside of the package body, and is characterized in that the external and is electrically connectable via a conductive metal which is arranged outside surface or the lower surface, the.
In the first invention having the above-described configuration, the package body has an effect of storing a desired electronic component in the cavity while maintaining a conductive state. Further, the stepped portion protruding from at least a part of the inner side surface of the cavity has an effect of forming a vertical conduction structure in the cavity.
Specifically, the groove part formed in the level | step difference surface of a level | step-difference part has the effect | action of accommodating and holding a conductor metal. In the first invention, the “step surface” is a vertical surface formed between a horizontal plane arranged on the vertical upper side of the step portion and a horizontal plane formed on the vertical lower side. The vertical conductor portion has an effect of conducting the conductor metal disposed on the horizontal plane side of the stepped portion and the conductor metal disposed on the base side of the stepped portion. In addition, the first conductor pad portion has an effect of electrically connecting an electronic component mounted on the horizontal surface of the stepped portion or a bonding wire connected on the horizontal surface of the stepped portion.
Moreover, when the end face shape of the groove part on the horizontal surface of the step part forms a part of an arbitrary annular shape, and the annular shape and the end face shape are overlapped, the overlapping area of both is set to be less than 50%. As a result, the projecting length of the stepped portion is shortened, and the upper end surface region of the vertical conductor portion that is not suitable as a mounting region for electronic components or a bonding wire connection region is narrowed.

An electronic device according to a second aspect of the present invention includes the electronic component storage package according to the first aspect of the present invention and a piezoelectric element stored in the cavity, and an electrode of the piezoelectric element is provided at least on the first conductor pad portion. Are bonded via a conductive resin.
In the second invention having the above-described configuration, in addition to the same action as the first invention, the conductive resin has an action of electrically connecting the first conductor pad portion and the electrode of the piezoelectric element.
Further, the surface of the first conductor pad portion is extremely flat compared to the surface state of the upper end surface of the vertical conductor portion extending on the horizontal surface of the stepped portion. When a conductive resin is interposed between the conductive pad portion and the conductive pad portion, there is an effect of greatly reducing the risk of a conduction failure.

The electronic device according to the third aspect of the invention is the electronic device according to the second aspect of the invention, the second conductor pad portion deposited on the bottom surface of the cavity, and the IC chip or temperature mounted on the second conductor pad portion. And a sensor.
In the third invention having the above-described configuration, in addition to the same action as the second invention, the second conductor pad portion has an action of electrically connecting the package body and the IC chip or the temperature sensor.
Further, when an IC chip is accommodated in the cavity, this IC chip has the effect of controlling the operation of the piezoelectric element also accommodated in the cavity.
On the other hand, when a temperature sensor is accommodated in the cavity, this temperature sensor has an effect of providing temperature data necessary for controlling the operation of the piezoelectric element also accommodated in the cavity.

The electronic device according to a fourth aspect of the present invention is the second electronic device according to the second aspect of the present invention, which is formed on the surface of the package body where the first cavity is not formed when the cavity is the first cavity. , A second conductor pad portion deposited on the bottom surface of the second cavity, and an IC chip or a temperature sensor mounted on the second conductor pad portion. .
In the third invention described above, the piezoelectric element and the IC chip or temperature sensor are accommodated in the same cavity (first cavity), whereas in the fourth invention, the piezoelectric element is the main surface of the package body. The IC chip or the temperature sensor is accommodated in a second cavity formed on the back surface side of the package body. Therefore, the action by the individual constituent elements in the fourth invention is the same as the action by the corresponding individual constituent elements in the third invention.
In the fourth invention, a cavity (first cavity) for accommodating a piezoelectric element and a cavity (second cavity) for accommodating an IC chip or a temperature sensor are separately formed in one package body. The step of housing the piezoelectric element and the step of housing the IC chip or the temperature sensor can be provided separately.

An electronic device according to a fifth aspect of the present invention is an electronic component storage package according to the first aspect of the present invention, comprising at least a first step portion disposed on the upper stage side and a second step portion disposed on the lower stage side. A third conductor pad portion deposited on the bottom surface of the cavity, a piezoelectric element housed in the cavity, and an IC chip mounted on the third conductor pad portion, The electrode of the piezoelectric element is joined to the first conductor pad part via a conductive resin, and the first conductor pad part of the second step part and the IC chip are electrically connected by a bonding wire. It is characterized by.
According to a fifth aspect of the present invention, an electronic component other than the piezoelectric element housed in the cavity in the third aspect is specified as an IC chip, and the connection structure between the IC chip and the package body is a bonding wire. Is specified. Therefore, the operation of each component of the fifth invention except for the bonding wire is the same as that of the above-described third invention. The bonding wire has an effect of electrically connecting the package body and the IC chip. Further, the third conductor pad portion functions as a base for joining the IC chip in the cavity.
In the fifth aspect of the invention, in particular, the bonding wire is connected to the first conductor pad portion disposed on the horizontal surface of the second step portion, so that the surface of the first conductor pad portion is flat as described above. Since the property is extremely high, it has the effect of greatly reducing the risk of connection failure occurring at the contact portion between the bonding wire and the first conductor pad portion.

An electronic device according to a sixth aspect of the present invention includes the electronic component storage package according to the first aspect of the present invention and an IC chip stored in the cavity, and at least the first conductor pad portion and the IC chip are And electrically connected by a bonding wire.
6th invention of the said structure has the same effect | action as the effect | action by each component of the electronic component storage package which is 1st invention.
In the sixth aspect of the invention, in particular, the bonding wire is connected to the first conductor pad portion disposed on the horizontal plane of the step portion, so that the flatness of the surface of the first conductor pad portion is as described above. Since it is extremely high, it has the effect of greatly reducing the risk of connection failure occurring at the contact portion between the bonding wire and the first conductor pad portion.

According to the first invention as described above, a conductive path that transmits an electric signal to the electronic component housed in the cavity is relatively formed in the cavity and the inside of the package body (in the thick portion). Can be increased. This means that it is possible to relatively reduce the number of conductive paths that transmit an electrical signal to the electronic component and are arranged on the outer peripheral portion of the package body. In this case, in the manufacturing process of the electronic component storage package according to the first invention, a dividing groove forming step for dividing the multi-cavity ceramic package, which is the assembly of the first invention, into pieces, In the singulation process for breaking the individual ceramic package, it is possible to greatly reduce the risk that the conductive path disposed on the outer periphery of the package body is damaged and the final product becomes defective. Therefore, according to the first invention, the non-defective product rate of the electronic component storage package according to the first invention can be increased, and the productivity thereof can be improved.
In addition, according to the first invention, the projecting length of the stepped portion can be shortened while securing a conduction path in the cavity, so that the external dimensions (mainly planar shape) of the electronic component storage package can be reduced. . Even when the outer dimensions of the electronic component storage package are reduced, the risk of conduction failure occurring when the electronic component is mounted in the cavity can be greatly reduced. From this point as well, the electronic component storage device according to the first invention The yield rate of packages can be increased and the productivity can be improved.
Furthermore, according to 1st invention, the depth of the groove part formed on the horizontal surface of a level | step-difference part can be reliably made smaller than the diameter (diameter, a major axis, or a minor axis) of arbitrary cyclic | annular shapes. .

Since the second invention includes the first invention, it has the same effect as the first invention.
Furthermore, as described above with reference to FIG. 10, the upper end surface of the vertical conductor portion arranged on the horizontal surface of the step portion is recessed, or the flatness is extremely poor due to extremely undulations. The flatness of the first conductor pad portion formed on the horizontal surface of the step portion is extremely high. Therefore, in the second invention, by reducing the area of the upper end surface of the vertical conductor portion, it is possible to greatly reduce the risk of poor conduction between the electronic component storage package and the piezoelectric element.
Therefore, according to the second invention, the yield rate of the electronic device can be increased in the manufacturing process, and the productivity can be improved.

In the third invention, in addition to the same effect as the above-mentioned second invention, in particular, when an IC chip is provided in the cavity in addition to the piezoelectric element, the operation of the piezoelectric element can be controlled by the IC chip. it can.
In particular, when a temperature sensor is provided in the cavity in addition to the piezoelectric element, temperature data necessary for controlling the operation of the piezoelectric element can be acquired from the temperature sensor.
Therefore, according to the invention of the third invention, a higher-performance electronic device can be provided.

  In the fourth invention, in addition to the same effect as the above-mentioned third invention, an electronic device housing a piezoelectric element and a process of housing an IC chip or a temperature sensor can be performed separately, resulting in defective products. Even in this case, both the piezoelectric element and the IC chip (or temperature sensor) are not wasted simultaneously.

According to a fifth invention, in the third invention described above, the electronic component housed in the cavity is specified as a piezoelectric element and an IC chip, and the electrode of the piezoelectric element is arranged on the upper stage side in the cavity. In the third invention, the IC chip and the package body are electrically connected to each other by a bonding wire at the second step portion disposed on the lower side of the first step portion. This has the same effect as the case where a piezoelectric element and an IC chip are provided in the cavity.
In addition, as described above, the first conductor pad portion formed on the horizontal surface of the stepped portions (the first stepped portion and the second stepped portion) has extremely high surface flatness. In addition, in the fifth invention, since the area of the end surface of the vertical conductor portion is narrow in the horizontal plane of the stepped portion, it is easy to connect the bonding wire to the first conductor pad portion avoiding this end surface. Therefore, the risk of connection failure can be greatly reduced by connecting the bonding wire to the first conductor pad portion.
Therefore, it is possible to increase the yield rate of electronic devices in the manufacturing process and improve the productivity.

In the seventh invention, in addition to the same effect as that of the fifth or sixth invention described above, the connection position is specified when the bonding wire is connected to the first conductor pad portion in the manufacturing process. It becomes easy to specify the position of the groove portion of the second stepped portion in the fifth invention or the stepped portion in the sixth invention, which is a reference for the image processing.
As a result, according to the seventh invention, since the bonding wire can be reliably connected to the first conductor pad portion while avoiding the groove portion at the time of manufacture, the yield rate of the electronic device is increased and the productivity is increased. Can be improved.

(A) It is a top view of the electronic component storage package which concerns on Example 1 of this invention, and an electronic apparatus using the same, (b) The electronic component storage package which concerns on Example 1 of this invention, and it were used It is sectional drawing of an electronic device. It is the elements on larger scale of the level | step-difference part in which the groove part was formed in the electronic component storage package which concerns on Example 1 of this invention. It is the elements on larger scale of the level | step-difference part in which the groove part was formed in the electronic component storage package which concerns on the modification of Example 1 of this invention. It is a flowchart which shows the manufacturing process of the electronic component storage package which concerns on Example 1 of this invention. (A) It is a top view which shows the cavity hole formation position in the cavity hole formation process at the time of depositing an unsintered conductor metal in a through-hole, (b) When the unsintered conductor metal is filled in a through-hole It is a top view which shows the hole formation position of the cavity in the hole formation process of this. It is sectional drawing of the electronic device which concerns on Example 2 of this invention. It is sectional drawing of the electronic device which concerns on Example 3 of this invention. It is sectional drawing of the electronic device which concerns on Example 4 of this invention. It is sectional drawing of the electronic device which concerns on Example 5 of this invention. It is the figure which visualized the shape of the surface of a through-hole periphery, although a through-hole is formed in a non-fired ceramic sheet | seat and it fills this through-hole with a non-fired conductor metal.

  An electronic component storage package according to an embodiment of the present invention and an electronic apparatus using the same will be described in detail with reference to FIGS.

First, an electronic component storage package and an electronic apparatus using the same according to Embodiment 1 of the present invention will be described with reference to FIGS.
1A is a plan view of an electronic component storage package and an electronic device using the same according to Embodiment 1 of the present invention, and FIG. 1B is an electronic component storage package according to Embodiment 1 of the present invention. It is sectional drawing of the electronic device using it. FIG. 1B is a cross-sectional view taken along line AA in FIG. FIG. 2 is a partially enlarged view of the step portion in which the groove portion is formed in the electronic component storage package according to the first embodiment of the present invention.
As shown in FIGS. 1A and 1B, an electronic component storage package 1A according to the first embodiment includes an insulating ceramic sintered body 13 and a conductor metal (vertical conductor portion 10, first conductor). An electronic component storage package comprising a pad portion 11 and a conductor metal 12), wherein the package body 3 is formed with a cavity 5 for storing, for example, a piezoelectric element 15 as an electronic component, and the inner surface of the cavity 5 At least one stepped portion 6 projecting at least in part, at least one groove portion 9 formed by notching the stepped surface 7 of the stepped portion 6 in the vertical vertical direction, and depositing or filling the groove portion 9 And a first conductor pad portion 11 which is attached to the horizontal surface 8 of the step portion 6 and electrically connected to the vertical conductor portion 10 which is also made of the conductor metal 12. The vertical conductor portion 10 is configured to be electrically connectable to the outside through a conductor metal 12 disposed on the inside (thick portion) of the package body 3 and on the outer surface or the lower surface. Yes.
Further, in the electronic component storage package 1A according to the first embodiment as described above, as shown in FIG. 2, the groove portion 9 on the horizontal plane 8 of the step portion 6 protruding from at least a part of the inner surface of the cavity 5. The end face shape 28 (short broken line portion) is a part of an arbitrary annular shape 27 (long broken line portion), and when this optional annular shape 27 and the end face shape 28 of the groove 9 are overlapped, The overlapping region is set to be less than 50% of the entire circumference of the arbitrary annular shape 27.
FIG. 1A shows an example in which the step portion 6 is formed over the entire circumference of the inner surface of the cavity 5. This step portion 6 is a part of the inner surface of the cavity 5. It may be formed only on the part.

According to the electronic component storage package 1A according to the first embodiment having the above-described configuration, the groove portion 9 is provided on the step surface 7 of the step portion 6 projecting from the inner surface of the cavity 5, and the conductor metal 12 is provided in the groove portion 9. A vertical conductor portion 10 formed by deposition or filling is provided, and the first conductor pad portion 11 deposited on the horizontal surface 8 of the step portion 6 is electrically connected to the vertical conductor portion 10. In this way, most of the conduction paths of the electronic components (for example, the piezoelectric element 15 and the like) housed in the cavity 5 can be arranged in the cavity 5 and in the package body 3 (thick part). it can.
This is because there are relatively few conduction paths for electronic components (for example, the piezoelectric element 15 etc.) accommodated in the cavity 5 formed on the outer surface of the package body 3 such as castellation. It means you can do it.

In general, in the technical field related to an electronic component storage package, a castellation in which a through hole is formed in the periphery of a package body and a conductive metal is attached to the inner surface thereof is used as a conduction path. In this case, when firing shrinkage occurs in the ceramic sintered body, a crack is generated in the through hole, and the conductive metal deposited in the through hole may be divided by the crack, resulting in poor conduction.
In addition, the electronic component storage package includes a multi-cavity package in which a plurality of electronic component storage packages are arranged in a grid pattern along a dividing groove formed on the boundary line of each electronic component storage package. It is manufactured by dividing into pieces. And the said division groove forms the division groove of a cross-sectional substantially V shape by pressing the braid | blade which is a cutting blade against what is formed by laminating | stacking a non-fired ceramic sheet. At this time, since the unfired ceramic sheet is a molded body made of, for example, a powder material such as alumina and an organic solvent, the physical properties thereof are close to an elastic body. In this case, after pressing the blade that is the cutting blade at the desired location, and then pulling out the blade and pressing the blade on another adjacent boundary line (scheduled groove forming position), the previously formed split groove A force acts so as to reduce the width of the groove. At this time, not only the groove width of the previously formed dividing groove is narrowed, but in some cases, the groove inner surfaces of the dividing groove may come into contact with each other. Such a phenomenon becomes more prominent as the external dimension of the electronic component storage package 1A to be manufactured is smaller. Then, while the inner surfaces of the divided grooves are in contact with each other, they are baked into a multi-piece package, and when such a multi-piece package is broken along the divided grooves into divided pieces, individual electronic components are stored. There is an increased risk of damage to the conductive metal (castellation) that is disposed on the periphery (on the outer surface) of the package and functions as a conduction path.
Therefore, as in the electronic component storage package 1A according to the first embodiment, most of the conduction paths of the electronic components such as the piezoelectric elements 15 stored in the cavity 5 are on the outer surface of the electronic component storage package 1A. In addition, the non-defective product rate of the electronic component storage package 1A, which is the final product, can be increased by being disposed in the cavity 5 or the inside of the package body 3 (thick portion). The productivity of 1A can be improved.

In the one electronic component storing package 1A according to the first embodiment, the end surface shape 28 of the groove portion 9 on the horizontal surface 8 of the stepped portion 6 protruding from at least a part of the inner surface of the cavity 5 is one of the arbitrary annular shapes 27. When the arbitrary annular shape 27 and the end surface shape 28 of the groove 9 are overlapped with each other, the overlapping region is less than 50% of the entire circumference of the arbitrary annular shape 27. 2 is set, the depth B of the groove 9 shown in FIG. 2 can be made shorter than the diameter (diameter, major axis, or minor axis) of any annular shape 27. That is, the end face shape 28 of the groove 9 is always in a state where the diameter is increased from the bottom of the groove 9 toward the opening side.
In this case, in the horizontal plane 8 of the step portion 6, it is possible to secure a region necessary for bonding electrodes of electronic components such as the piezoelectric element 15 or a region necessary for bonding wire bonding.
In this case, since the depth B of the groove 9 formed in the stepped portion 6 becomes shallow, it is possible to reduce the risk of cracks in the stepped portion 6 starting from the periphery of the groove 9 during firing. Thereby, the risk that the vertical conductor portion 10 made of the conductor metal 12 deposited or filled in the groove portion 9 is cracked and divided can be reduced. Therefore, also from this point, the yield rate of the electronic component storage package 1A according to the first embodiment can be improved.

In the electronic component storage package 1A according to the first embodiment, the arbitrary annular shape 27 may be any shape as long as it is not indefinite, such as a circle, an ellipse, or a polygon. However, when the arbitrary annular shape 27 has a corner portion, the corner is likely to be a base point of a crack on the inner surface of the groove portion 9, and therefore the arbitrary annular shape 27 is desirably formed by a smooth curve. .
Further, as will be described in detail later, the groove 9 and the vertical conductor portion 10 formed in the step portion 6 have a through-hole whose planar shape is an arbitrary annular shape 27 in a sheet-like green ceramic sheet. After forming and depositing an unfired conductor metal on the inner surface of this through hole, or after filling this through hole with an unfired conductor metal, the remainder of the periphery of any annular shape 27 is less than 50% In this way, the arbitrary annular shape 27 is formed by cutting using a die, a cutting blade, a laser beam or the like.
Therefore, the smaller the remaining portion of the peripheral edge of the annular shape 27, that is, the smaller the end surface shape 28 of the groove portion 9 shown in FIG. 2 or the closer the end surface shape 28 of the groove portion 9 is to a straight line, the closer the inner surface of the groove portion 9 is. The risk of generating cracks based on is reduced, and the area of the first conductor pad portion can be widened. Therefore, the region where the end face shape 28 of the groove 9 and the optional annular shape 27 overlap needs to be less than 50%. Moreover, when the area | region where the end surface shape 28 of the groove part 9 and the arbitrary annular shapes 27 overlap is less than 20%, the said effect can be exhibited more notably. On the other hand, the smaller the remainder of the peripheral edge of the arbitrary annular shape 27 is, the more easily the conductor metal 12 deposited or filled in the groove portion 9 is damaged when the groove portion 9 is formed. In addition to an increase in the risk of occurrence, the electrical resistance of the vertical conductor portion 10 is increased. Therefore, the area where the end face shape 28 and the arbitrary annular shape 27 overlap needs to be at least 10% or more.

Further, in the electronic component storage package 1A according to the first embodiment, when the arbitrary annular shape 27 and the end surface shape 28 of the groove 9 are overlapped, the overlapping region is 50 of the entire circumference of the arbitrary annular shape 27. By setting it to be less than%, the upper end surface region of the vertical conductor portion 10 extending on the horizontal surface 8 of the step portion 6 can be relatively narrowed.
In this case, as shown in FIG. 1, the electrodes of the electronic component (for example, the piezoelectric element 15) are connected to the upper end surface regions of the first conductor pad portion 11 and the vertical conductor portion 10 via a bonding material such as a conductive paste. Although bonded, in the electronic component storage package 1A according to the first embodiment, the upper end surface region of the vertical conductor portion 10 can be relatively narrowed, so that the occurrence of poor conduction can be suitably prevented.
Further, in the electronic component storage package 1A according to the first embodiment, although not shown in FIG. 1, the electronic component (for example, a semiconductor element) and the electronic component storage package 1A are electrically connected by a bonding wire. When used, the following effects can be exhibited. In other words, in the electronic component storage package 1A according to the first embodiment, the upper end surface region of the vertical conductor portion 10 is arranged in contact with the step surface 7 of the step portion 6, so that the bonding wire is flat on the surface. Therefore, it is possible to easily join the first conductor pad portion 11 that is difficult to cause poor conduction during joining. As described above, in the electronic component storage package 1A according to the first embodiment, since the bonding wire is not directly bonded to the upper end surface region of the vertical conductor portion 10, there is an inconvenience that occurs when these are directly bonded (occurrence of conduction failure). Etc.) can be avoided.
Therefore, according to the electronic component storage package 1A according to the first embodiment, when electronic components are mounted in the cavity 5, it is possible to greatly reduce the risk of occurrence of poor conduction. And the productivity of an electronic device using the electronic component storage package 1A can be improved.

Here, a modification of the vertical conductor portion 10 of the electronic component storage package 1A according to the first embodiment will be described in detail with reference to FIG.
FIG. 3 is a partially enlarged view of a step portion in which a groove portion is formed in an electronic component storage package according to a modification of the first embodiment of the present invention. The same parts as those described in FIGS. 1 and 2 are denoted by the same reference numerals, and description of the configuration is omitted.
In FIG. 2, the vertical conductor portion 10 provided in the step portion 6 has been described by taking as an example the case where the conductor metal 12 is deposited on the inner surface of the groove portion 9. As described above, the vertical conductor portion 10 may be one in which the entire hollow portion of the groove portion 9 is filled with the conductor metal 12.
As described above with reference to FIG. 10, the upper end surface of the vertical conductor portion 10 extending on the horizontal surface 8 of the step portion 6 has a flatness because it is recessed or uneven and has undulations. It is a very poor state. For this reason, the upper end surface of the vertical conductor portion 10 extending on the horizontal plane 8 is not suitable for joining electrodes of electronic components (for example, the piezoelectric element 15) or bonding wires. In the present invention, the end face shape of the groove portion on the horizontal plane 8 is a part of an arbitrary annular shape, and when the annular shape and the end face shape are overlapped, the overlapping area is configured to be less than 50%. Thus, the region of the upper end surface of the vertical conductor portion 10 that is not suitable for bonding of electrodes of electronic parts or connection of bonding wires is reduced.
In this case, since the horizontal cross-sectional area of the vertical conductor portion 10 in the horizontal plane 8 of the step portion 6 is larger than that of the vertical conductor portion 10 shown in FIG. As a result, the conductivity can be improved. Therefore, according to the electronic component storage package 1A ′ according to the modification, it is possible to provide a high-performance electronic component storage package as compared with the electronic component storage package 1A according to the first embodiment.

Returning again to FIG. 1, the electronic apparatus 2A according to the first embodiment will be described in detail.
The electronic device 2A according to the first embodiment is obtained by mounting the piezoelectric element 15 in the cavity 5 of the electronic component storage package 1A according to the first embodiment as described above.
More specifically, in the electronic device 2A according to the first embodiment, the piezoelectric element 15 is accommodated in the cavity 5 in the electronic component storage package 1A shown in FIGS. 16 is joined to the first conductor pad portion 11 deposited on the horizontal surface 8 of the step portion 6 via the conductive resin 14.
The electronic device 2 </ b> A according to the first embodiment includes an annular conductor metal 12 on the frame body 4 (outer peripheral portion of the cavity 5) disposed on the uppermost layer of the package body 3. The metal ring 17 is bonded via the bonding material 36, the upper end of the metal ring 17 is covered with a metal lid 18 for sealing the cavity 5, and the metal ring 17 and the metal lid 18 are seam welded, for example. Thus, the piezoelectric element 15 is sealed.

According to the electronic apparatus 2A according to the first embodiment, the upper end surface region of the vertical conductor portion 10 having extremely poor flatness is reduced, and is deposited on the horizontal surface 8 of the step portion 6 so that the flatness is extremely high. The electrode 16 of the piezoelectric element 15 can be joined to the first conductor pad portion 11.
Therefore, according to the electronic device 2A according to the first embodiment, the risk of a conduction failure occurring when the piezoelectric element 15 is mounted on the electronic component storage package 1A according to the first embodiment can be greatly reduced. The yield rate of 2A can be increased. Therefore, according to the electronic device 2A according to the first embodiment, the productivity can be improved.

Here, the manufacturing process of the electronic component storage package 1A according to the first embodiment will be described in detail with reference to FIG.
FIG. 4 is a flowchart showing manufacturing steps of the electronic component storage package according to the first embodiment of the present invention. The same parts as those described in FIGS. 1 to 3 are denoted by the same reference numerals, and description of the configuration is omitted.
The electronic component storage package 1A according to the first embodiment is manufactured by steps S01 to S09 illustrated in FIG. 4 (manufacturing method 29 of the electronic component storage package according to the first embodiment).
First, in the unfired ceramic sheet manufacturing process of step S01 shown in FIG. 4, alumina powder as a ceramic material (insulating material) before firing and other component powders (for example, silica, calcia, etc.) as necessary, A slurry is prepared by mixing an organic binder, a solvent, a plasticizer and the like. And this slurry is shape | molded by the conventionally well-known method (for example, a doctor blade method or a calender roll method), and the unbaking ceramic sheet | seat as an insulating sheet for many pieces is produced.

Further, in the through-hole forming step of the next step S02, punching (punching) processing is performed on the unfired ceramic sheet produced in the previous step S01, and the unfired ceramic sheet is formed at a desired portion of each unfired ceramic sheet. A through hole penetrating 11 in the thickness direction is formed. At this time, a through-hole whose planar shape is an arbitrary annular shape 27 is formed at the formation position of the groove 9.
As a method for forming these through holes, other methods such as laser drilling can be used besides punching.
Further, through holes are formed at positions where the green ceramic sheets coincide with each other so that a castellation 26 (see FIG. 1) is formed when a plurality of green ceramic sheets are laminated and integrated. May be.

Further, in the unfired conductor metal filling (or inner side surface coating) step of Step S03 shown in FIG. 4, the unfired conductor metal is deposited or filled in the through holes formed in the unfired ceramic sheet.
More specifically, a conductive paste containing metal powder such as tungsten or molybdenum is filled in the through-holes of the unfired ceramic sheet using a conventionally known paste printing apparatus, and the sintered ceramic body after firing. An unfired conductor metal is disposed as a conductor metal 12 (for example, the vertical conductor portion 10 shown in FIG. 3) disposed through 13.
In addition, in the case of applying the unfired conductor metal inner side surface coating step instead of the unbaked conductor metal filling step, the through hole of the unfired ceramic sheet (filling the conductive paste is filled) using a side surface printing machine having a suction mechanism. For example, a conductive paste containing metal powder such as tungsten or molybdenum is attached to the inner side surface of the one provided separately from the through hole, and the conductive part (for example, the vertical shown in FIGS. A green conductor metal to be the directional conductor part 10) is formed.
Therefore, the inside of the through-hole formed in the unfired ceramic sheet may not be completely filled with the conductive paste, and as shown in FIG. 2, the inner surface of the through-hole whose planar shape forms an arbitrary annular shape 27 The central portion of the unfired conductor metal formed on the top is hollow.

Then, in the green metal conductor printing step of step S04 shown in FIG. 4, a layer made of green conductor metal is formed at a desired position on the surface of each green ceramic sheet by screen printing. Here, the conductive conductor metal is printed on the surface of each unfired ceramic sheet using a mask to pattern the unfired conductor metal. When the package body 3 is a ceramic multilayer substrate (see FIG. 1B), these unfired conductor metals are arranged in parallel to the planar direction of the ceramic sintered body 13 on the inner layer, main surface, and back surface. This is a portion to be the first conductor pad portion 11 and the conductor metal 12 (metallized conductor layer).
In the electronic component storage package manufacturing method 29 according to the first embodiment, the above-described steps S02 to S04 are collectively referred to as an unfired conductor metal application step.
Further, after applying the unfired conductor metal to the unfired ceramic sheet as described above, the unfired conductor metal filled, deposited or printed on each unfired ceramic sheet is dried by heating to a predetermined temperature, and conductive The solvent component in the conductive paste is volatilized, and the unfired conductor metal is stably held on the unfired ceramic sheet.

Next, the cavity hole forming step in step S05 will be described in detail with reference to FIG. FIG. 5A is a plan view showing a cavity hole forming position in the cavity hole forming step when an unfired conductor metal is deposited in the through hole, and FIG. 5B is an unfired conductor metal in the through hole. It is a top view which shows the cavity hole formation position in the cavity hole formation process at the time of filling. The same parts as those described in FIGS. 1 to 4 are denoted by the same reference numerals, and description of the configuration is omitted.
In the cavity hole forming step of step S05 shown in FIG. 4, punching is performed using a punching jig (not shown), and the cavity 5 (on the unfired ceramic sheet provided with the unfired metal conductor (conductive paste) is formed. Cavity holes to be formed (see FIGS. 1 to 3) are formed.
In order to form the stepped portion 6 in the cavity 5 in the package body 3 which is a ceramic multilayer substrate as shown in FIG. 3, it is formed on each unfired ceramic sheet in the cavity hole forming step of step S05 shown in FIG. The hole diameter (or hole width) of the cavity hole may be adjusted as appropriate. That is, the hole diameter (or hole width) of the cavity hole formed in each unfired ceramic sheet forming the stepped portion 6 in the cavity 5 may be made smaller than the others.
By the cavity hole forming step in step S05, portions that become the groove 9 and the vertical conductor 10 are formed in the step portion 6 of the electronic component storage package 1A after firing.
More specifically, as shown in FIGS. 5 (a) and 5 (b), a through-hole 33 whose planar shape is an arbitrary annular shape 27 is formed, and an unfired conductive metal 34 is deposited or deposited on the inside thereof. In the filled unfired ceramic sheet 32, the distance B from the position where the cavity hole 20 is formed to the outermost edge of the through hole 33 is a position that does not overlap the center line 19 passing through the center point 35 of the through hole 33. By forming the cavity hole 20 so as to be smaller than the radius, major axis, or minor axis of the annular shape 27, the groove 9 and the vertical conductor 10 as shown in FIGS. 1 to 3 can be formed. it can.
At this time, the remaining region D (see FIGS. 5A and 5B) after cutting in the entire circumferential length of the through-hole 33 whose planar shape is an arbitrary annular shape 27 is the entire circumferential length of the through-hole 33. It can be in a state of less than 50%.

Then, in the unfired ceramic sheet laminating step of step S06 shown in FIG. 4, a plurality of unfired ceramic sheets provided with unfired conductor metal at desired locations are laminated and integrated. Then, by applying a predetermined load in the thickness direction while heating the unfired ceramic sheet using a conventionally known laminating apparatus, they are thermocompression-bonded and integrated to form an unfired ceramic sheet laminate.
In the electronic component storage package manufacturing method 29 according to Example 1, the unsintered ceramic sheet laminate includes a product region in which a plurality of electronic component storage packages 1A are disposed in a grid pattern after firing, And a dummy area formed so as to surround the product area (not shown). In addition, alignment green holes are formed at the four corners of the dummy area, the positions of the alignment through holes are image-recognized by a camera, and each green ceramic sheet 11 is aligned to thereby align each green ceramic. You may align a sheet | seat.

Further, in the split groove forming step of step S07 shown in FIG. 4, a cutting blade (blade) (not shown) is used to divide the non-fired ceramic sheet laminate into a substantially V-shaped cross section on the boundary line of each electronic component storage package 1A. Grooves are formed. In addition, this division groove is formed so that it may make a pair with the main surface and back surface in which the cavity 5 is formed in a non-baking ceramic sheet laminated body.
Moreover, you may form the said division | segmentation groove | channel by irradiating a laser beam using a laser processing apparatus (not shown).
Furthermore, the dividing groove formed on either the main surface or the back surface of the unfired ceramic sheet laminate is formed by a cutting blade (blade), and the dividing groove formed on the other is formed by irradiating laser light. May be.

In the firing step of step S08 shown in FIG. 4, a predetermined temperature (for example, about 1500 ° C. to 1800 ° C.) at which alumina can be sintered in a reducing atmosphere composed of nitrogen, hydrogen and water vapor in the unfired ceramic sheet laminate. And then firing. After this firing, each unfired ceramic sheet in the unfired ceramic sheet laminate is sintered, and a multi-package 30 comprising a ceramic multilayer substrate formed by laminating ceramic sintered bodies (see FIG. 4) Is obtained. Further, the multi-package 30 is a product in which a plurality of product regions to be the electronic component storage package 1A are arranged in a grid pattern vertically and horizontally along the plane direction.
Further, in the multi-cavity package 30, the conductor metal 12 is formed at desired locations in the package body 3 made of the ceramic multilayer substrate, the main surface, the back surface, and the cavity 5 by sintering the unfired conductor metal (conductive paste). (Including the vertical conductor portion 10 and the first conductor pad portion 11) is formed.

  Further, in the split-separation process of step 09 shown in FIG. 4, the multi-package 30 is divided into individual pieces along the split grooves, whereby the electronic component storage package 1 </ b> A as shown in FIG. 1 is obtained. Are obtained simultaneously.

Next, the electronic device 2B according to the second embodiment will be described in detail with reference to FIG.
FIG. 6 is a cross-sectional view of an electronic device according to Embodiment 2 of the present invention. The same parts as those described in FIGS. 1 to 5 are denoted by the same reference numerals, and description of the configuration is omitted.
The electronic device 2B according to the second embodiment includes an IC chip 23 in addition to the piezoelectric element 15 in the cavity 5 of the electronic device 2A according to the first embodiment.
More specifically, the electronic device 2B according to the second embodiment includes the second conductor pad portion 21 (conductor metal 12) formed of a wiring pattern for mounting the IC chip 23 on the bottom surface of the cavity 5 of the package body 3. The IC chip 23 is mounted on the second conductor pad portion 21 via the bonding material 36.
According to the electronic device 2B according to the second embodiment, since the operation of the piezoelectric element 15 is controlled by the function of the IC chip 23 mounted in the cavity 5, it is compared with the electronic device 2A according to the first embodiment. Thus, a higher performance electronic device can be provided.
In the electronic device 2B according to the second embodiment, a temperature sensor (not shown) may be mounted on the second conductor pad portion 21 instead of the IC chip 23. In this case, since temperature data necessary for controlling the operation of the piezoelectric element 15 can be acquired from the temperature sensor, an electronic device with higher functionality can be provided in this case as compared with the electronic device 2A according to the first embodiment. .

Next, the electronic device 2C according to the third embodiment will be described in detail with reference to FIG.
FIG. 7 is a cross-sectional view of an electronic device according to Embodiment 3 of the present invention. The same parts as those described in FIGS. 1 to 6 are denoted by the same reference numerals, and description of the configuration is omitted.
The electronic device 2C according to the third embodiment specifies an electronic component other than the piezoelectric element 15 mounted in the cavity 5 of the electronic device 2B according to the above-described second embodiment as the IC chip 23, and the IC chip 23 and the package body 3 is specified by the bonding wire 24.
More specifically, in the electronic device 2C according to the third embodiment, in addition to the step portion 6a for mounting the piezoelectric element 15 in the cavity 5 (corresponding to the step portion 6 of the electronic device 2B according to the second embodiment). A third conductor pad made of, for example, a solid pattern, formed on the bottom of the cavity 5, further including a step portion 6 b including a groove portion 9, a vertical conductor portion 10, and a first conductor pad portion 11. The IC chip 23 is bonded onto the portion 22 via the bonding material 36, and the IC chip 23 and the first conductor pad portion 11 deposited on the horizontal surface 8 b of the stepped portion 6 b are electrically connected by the bonding wire 24. Connected.

Also in the electronic device 2C according to the third embodiment, since the electronic component storage package 1A according to the first embodiment is used, the horizontal surface 8a of the step portion 6a (the electronic component storage package 1A according to the first embodiment) Similar to the first conductor pad portion 11 deposited on the horizontal plane 8a), the flatness of the surface of the first conductor pad portion 11 deposited on the horizontal plane 8b of the step portion 6b is also extremely high ( See FIG. Therefore, since the area of the first conductor pad portion 11 having excellent flatness suitable for the connection of the bonding wire 24 can be increased, the package body 3 and the IC can be formed at the time of manufacturing the electronic device 2C according to the third embodiment. It is possible to greatly reduce the risk of a conduction failure occurring at the joint portion of the bonding wire 24 that electrically connects the chip 23.
As a result, it is possible to improve the yield rate at the time of manufacturing the electronic device 2C according to the third embodiment, thereby improving the productivity.

Next, an electronic device 2D according to the fourth embodiment will be described in detail with reference to FIG.
FIG. 8 is a cross-sectional view of an electronic device according to Embodiment 4 of the present invention. The same parts as those described in FIGS. 1 to 7 are denoted by the same reference numerals, and description of the configuration is omitted.
The electronic device 2D according to the fourth embodiment has the same performance as the electronic device 2B according to the second embodiment described above, but the structure is different.
Specifically, as shown in FIG. 8, the electronic device 2D according to the fourth embodiment has a first cavity 5a (corresponding to the cavity 5 in the electronic device 2B according to the second embodiment) on the main surface 31a side of the package body 3. ) Is provided with a second cavity 5b on the back surface 31b side of the package body 3, and a piezoelectric element 15 is mounted on the first cavity 5a and an IC chip 23 is mounted on the second cavity 5b. is there.
In the electronic device 2D shown in FIG. 8, the electronic component mounted in the second cavity 5b may be a temperature sensor (not shown) instead of the IC chip 23.
The electronic device 2D according to the fourth embodiment has the same effect as that obtained by the electronic device 2B according to the second embodiment.
Furthermore, according to the electronic device 2D according to the fourth embodiment, the process of housing the piezoelectric element 15 and the process of housing the IC chip 23 (or temperature sensor) can be set separately. Even when a defective product occurs, it can be avoided that both the piezoelectric element 15 and the IC chip 23 are wasted.

In FIG. 8, a second conductor pad portion 21 made of, for example, a wiring pattern is provided at the bottom of the second cavity 5b, and the IC chip 23 is placed on the second conductor pad portion 21 via a bonding material 36. Alternatively, although a case where a temperature sensor (not shown) is mounted is described as an example, a step portion 6 including a groove portion 9, a vertical conductor portion 10, and a first conductor pad portion 11 is provided in the second cavity 5b. An electronic component (for example, an IC chip 23 or a temperature sensor) housed in the second cavity 5b and a first conductor deposited on the horizontal surface 8 of the step portion 6 provided in the second cavity 5b. The pad portion 11 may be electrically connected by a bonding wire 24 (not shown). In this case, the conductor metal 12 serving as a base for joining electronic components in the second cavity 5b is Data pattern (third conductor pad portion 22 in FIG. 7) may be used.
In this case, as in the case of the electronic device 2C according to the third embodiment, the risk of causing a conduction failure between the first conductor pad portion 11 and the bonding wire 24 is reduced, and the electronic device 2D according to the fourth embodiment is reduced. The yield of non-defective products during production can be increased, thereby improving the productivity.

Next, the electronic device 2E according to the fifth embodiment will be described in detail with reference to FIG.
FIG. 9 is a cross-sectional view of an electronic device according to Embodiment 5 of the present invention. The same parts as those described in FIGS. 1 to 8 are denoted by the same reference numerals, and description of the configuration is omitted.
As shown in FIG. 9, the electronic device 2E according to the fifth embodiment is different from the electronic device 2C according to the third embodiment previously shown in FIG. 7 in that the piezoelectric element 15 provided in the cavity 5 and a step for mounting the same. The configuration relating to the part 6a is removed.
Therefore, according to the electronic device 2E according to the fifth embodiment, when the bonding wire 24 is connected to the first conductor pad portion 11 that is deposited on the horizontal surface 8 of the step portion 6, the risk of poor conduction is greatly increased. As a result, the non-defective product rate at the time of manufacturing the electronic device 2E according to the fifth embodiment can be significantly increased. As a result, the productivity of the electronic device 2E according to the fifth embodiment can be improved.

Finally, the technical contents of the electronic devices 2C and 2E according to the third and fifth embodiments will be described in further detail.
Usually, the electronic component (for example, IC chip 23) accommodated in the cavity 5 and the first conductor pad portion 11 deposited on the horizontal surface 8 (or horizontal surface 8b) of the step portion 6 (or step portion 6b) Is electrically connected by the bonding wire 24, the connection position of the bonding wire 24 on the first conductor pad portion 11 is determined by performing image processing on an image obtained by photographing the package body 3 from directly above the cavity 5. The
More specifically, the position of the upper end surface of the vertical conductor portion 10 is specified in an image obtained by imaging the package body 3 from directly above, and the first conductor pad having higher flatness is avoided by avoiding the position of the upper end surface. The connection position of the bonding wire 24 is set on the part 11.
However, the entire hollow portion of the groove portion 9 formed in the step portion 6 (or the step portion 6b) is a conductor metal like the electronic component storage package 1A ′ according to the modification of the first embodiment shown in FIG. In the case where the conductor metal 25 (equivalent to the conductor metal 12) is disposed up to the vicinity of the base of the stepped portion 6 (or the stepped portion 6b) In addition, it becomes difficult to specify the position of the upper end surface of the vertical conductor portion 10 in the image obtained by imaging the package body 3 from directly above, and as a result, the connection position of the bonding wire 24 cannot be determined.
On the other hand, as shown in FIG. 2, the vertical conductor portion 10 is formed by the conductor metal 12 being deposited on the inner surface of the groove portion 9 formed in the step portion 6 (or the step portion 6b). In this case, that is, when the surface of the vertical conductor portion 10 extending on the step surface 7 (or the step surface 7b) of the step portion 6 (or the step portion 6b) falls inside the groove portion 9 and is recessed, In the image of the main body 3 viewed from directly above, there is a recess on the end surface of the stepped portion 6 (or stepped portion 6b), and the position of the upper end surface of the vertical conductor portion 10 is specified by detecting this recess. can do.
Since the detected position of the upper end surface of the vertical conductor portion 10 can be avoided and the connection position of the bonding wire 24 can be determined, the electronic devices 2C and 2E according to the third and fifth embodiments can be produced efficiently. can do.
Therefore, when the electronic component housed in the cavity 5 and the package body 3 are electrically connected by the bonding wire 24, the electronic component is extended to the step surface 7 (or the step surface 7b) of the step portion 6 (or the step portion 6b). By leaving the entire surface of the vertical conductor portion 10 provided in the groove portion 9 in a depressed state, that is, a conductor on the inner surface of the groove portion 9 formed in the step portion 6 (or step portion 6b). By employing the vertical conductor portion 10 on which the metal 12 is deposited, the productivity of the electronic device (for example, the electronic devices 2C and 2E according to Examples 3 and 5) can be improved.
In the electronic device 2D according to the fourth embodiment, the step portion 6 is provided in the second cavity 5b, and the electronic component housed in the second cavity 5b is electrically connected by the package body 3 and the bonding wire 24. In the case of being connected to, the entire surface extending from the step surface 7 of the vertical conductor portion 10 provided in the step portion 6 formed in the second cavity 5b falls into the groove portion 9 and is depressed. By doing so, the same effect can be exhibited.

Also, all the electronic component storage packages used in the electronic devices 2B to 2E shown in FIGS. 6 to 9 are manufactured by the same procedure as the electronic component storage package manufacturing method 29 shown in FIG. Can do.
The present invention can also be applied to ceramics other than alumina ceramics, such as alumina-zirconia ceramics, aluminum nitride, and glass ceramics. In this case, it is necessary to appropriately set manufacturing conditions, conductor metals, etc. according to the respective ceramics.

  As described above, the present invention is used in a technical field related to an electronic component storage package capable of reducing the outer dimensions of a product while improving electrical conductivity when an electronic component is mounted in a cavity, and an electronic device using the same. Is possible.

  1A, 1A ', 1B-1E ... Electronic component storage package 2A-2E ... Electronic device 3 ... Package body 4 ... Frame 5 ... Cavity 5a ... First cavity 5b ... Second cavity 6, 6a, 6b ... Step 7, 7 a, 7 b, step surface 8, 8 a, 8 b, horizontal surface 9, groove portion 10, vertical conductor portion 11, first conductor pad portion 12, conductor metal 13, ceramic sintered body 14, conductive resin 15,. Piezoelectric element 16 ... Electrode 17 ... Metal ring 18 ... Metal lid 19 ... Center line 20 ... Cavity hole 21 ... Second conductor pad part 22 ... Third conductor pad part 23 ... IC chip 24 ... Bonding wire 25 ... Conductor Metal 26 ... Castellation 27 ... Arbitrary annular shape 28 ... End face shape 29 ... Manufacturing method of electronic component storage package 30 ... Multiple picking Package 31a ... principal surface 31b ... back surface 32 ... unfired ceramic sheet 33 ... through hole 34 ... unfired conductor metal 35 ... center point 36 ... bonding material

Claims (6)

An electronic component storage package comprising a ceramic sintered body that is an insulator and a conductor metal,
A package body in which a cavity for storing electronic components is formed, at least one stepped portion projecting from at least a part of the inner side surface of the cavity, and a stepped surface of the stepped portion is cut out in the vertical vertical direction. At least one groove portion, a vertical conductor portion made of the conductive metal deposited or filled in the groove portion, and electrically connected to the vertical conductor portion made of the conductive metal deposited on the horizontal surface of the stepped portion. A first conductor pad portion to be
The end face shape of the groove on the horizontal plane is a part of an arbitrary annular shape,
When the annular shape and the end face shape are overlapped, the area where both overlap is less than 50%,
The package for storing electronic parts, wherein the vertical conductor portion can be electrically connected to the outside through the conductor metal disposed on the inside and outside or lower surface of the package body. The electronic component storage package according to claim 1;
A piezoelectric element housed in the cavity,
An electronic device, wherein an electrode of the piezoelectric element is bonded to at least one of the first conductor pad portions via a conductive resin. An electronic device according to claim 2;
A second conductor pad portion deposited on the bottom surface of the cavity;
An electronic device comprising: an IC chip or a temperature sensor mounted on the second conductor pad portion. An electronic device according to claim 2;
A second cavity formed on a surface of the package body where the first cavity is not formed when the cavity is a first cavity;
A second conductor pad portion deposited on the bottom surface of the second cavity;
An electronic device comprising: an IC chip or a temperature sensor mounted on the second conductor pad portion. The electronic component storage package according to claim 1, comprising at least a first step portion disposed on the upper stage side and a second step portion disposed on the lower stage side,
A third conductor pad portion deposited on the bottom surface of the cavity;
A piezoelectric element housed in the cavity;
An IC chip mounted on the third conductor pad portion,
The electrode of the piezoelectric element is bonded to the first conductor pad portion of the first step portion via a conductive resin,
The electronic device, wherein the first conductor pad portion of the second step portion and the IC chip are electrically connected by a bonding wire. The electronic component storage package according to claim 1;
An IC chip housed in the cavity,
At least one of the first conductor pad portions and the IC chip are electrically connected by a bonding wire.