CN107768323B - High overload resistant electronic device packaging tube shell - Google Patents
High overload resistant electronic device packaging tube shell Download PDFInfo
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- CN107768323B CN107768323B CN201711192261.8A CN201711192261A CN107768323B CN 107768323 B CN107768323 B CN 107768323B CN 201711192261 A CN201711192261 A CN 201711192261A CN 107768323 B CN107768323 B CN 107768323B
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- 238000004806 packaging method and process Methods 0.000 title description 12
- 239000002184 metal Substances 0.000 claims abstract description 41
- 238000005476 soldering Methods 0.000 claims abstract description 40
- 238000003466 welding Methods 0.000 claims abstract description 38
- 238000007789 sealing Methods 0.000 claims abstract description 33
- 238000004021 metal welding Methods 0.000 claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000002131 composite material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 20
- 239000000919 ceramic Substances 0.000 description 11
- 230000035939 shock Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- VAHKBZSAUKPEOV-UHFFFAOYSA-N 1,4-dichloro-2-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC(Cl)=CC=C1Cl VAHKBZSAUKPEOV-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention provides a package tube shell of an anti-high overload electronic device, wherein a cover plate groove, a bonding groove and a sealing groove are formed on the side wall of a tube shell seat, and a sealing step and a bonding step are formed on the side wall of the groove; the cover plate is matched with the sealing step of the groove, a sealing cavity is formed in the cover plate and the groove, a horizontal metal welding leg and a vertical metal welding leg are arranged on the tube housing seat, and each vertical metal welding leg comprises a horizontal part and a vertical part; the cover plate groove of the groove extends to the upper end surface of the tube housing seat; the vertical metal welding legs comprise a first vertical welding leg and a second vertical welding leg, the vertical parts of the first vertical welding leg and the second vertical welding leg are positioned on the side wall of the tube shell seat, the horizontal parts of the first vertical welding leg and the second vertical welding leg are positioned on the bottom plate of the tube shell, and the cover plate is fixed with a metal strip; the solder wraps the second vertical leg and the metal strip. The vertical soldering leg of the package tube shell is soldered with the soldering pad of the PCB through soldering tin; the soldering tin covers the first vertical soldering leg, the second vertical soldering leg and the metal strip of the tube shell completely, and the soldering tin can make the electronic device resist mechanical impact.
Description
Technical Field
The present invention relates to packaging cases for electronic devices, and more particularly to a packaging case for electronic devices with high overload resistance.
Background
Electronic device packages are those in which one or more electronic component chips are electrically connected to each other and then packaged in a protective structure, the purpose of which is to provide electrical connection, mechanical protection, chemical corrosion protection, etc. for the electronic chips. The development trend of packaging technology is to make the packaging shape smaller, the functions larger and more and the cost lower. For some sensor products of industrial application, in view of performance and reliability, especially in view of reducing stress effects, a cavity packaging method is adopted, namely, an electronic chip is mounted on a bottom plate of a preformed package tube through a bonding metal wire to lead an electric signal of the chip out of the package tube, and finally, the package tube is sealed by a cover plate. For some electronic products, especially for those Micro sensors with directional requirements, such as MEMS (Micro-Electro-Mechanical Systems, microelectromechanical) device accelerometers, MEMS gyroscopes, magnetic sensor devices, light sensor devices, etc., the electronic component chip is sealed in a packaging cavity, and when in use, the electronic component chip needs to be vertically mounted on a PCB board of a user, so that vertically mounted soldering or bonding pads are needed; in addition, sufficient mounting strength with the PCB is required in order to ensure that the device remains intact in environments of high mechanical impact. High mechanical impact forces are also known as high overload conditions, for example 1 to 5 ten thousand G (G being the unit of earth's attraction). The former method is to use ceramic or kovar metal-glass package tube with metal soldering leg, when it is installed on PCB, if it is the metal soldering leg of direct insertion type, it is welded and inserted into the installation hole of PCB; if the solder is a bend-out solder, the solder fillets are connected to the PCB pads outside the projected area of the package housing. Regardless, vertical package packages with metal pins have the problems of easy deformation, large volume, difficult automated installation, etc. of the solder pins during the test process, and are now being replaced by miniaturized leadless ceramic package packages. The leadless vertically packaged ceramic package has both horizontally mounted pads and vertically mounted pads.
Fig. 1 to 3 show a mounting method of a vertical mounting package of the prior art, in which a Y direction of a package 11 of an electronic device 10 is perpendicular to a PCB 31, package vertical solder feet 15 are connected to a PCB pad 17 through solder 16, and a horizontal portion 15b of the solder feet 15 is formed in a-Y direction 11d of the package 11 in parallel with the PCB pad 17; the vertical portions 15a of the solder fillets 15 are formed in the +x direction 11a and the-X direction 11b of the package 11 perpendicular to the PCB pads 17. The solder 16 serves both as an electrical connection and as a fixing for the envelope 11. The horizontal fillets 13 are for testing or horizontal mounting. In a high overload use environment, the package 11 is most easily damaged due to the minimum dimension D1 of the package in three dimensions in the X direction, i.e. in the presence of high mechanical impact forces in the X direction conducted by the PCB, the package 11 is detached from the PCB at the solder 16. According to the physical general knowledge, in order to resist the mechanical impact force in the X direction, the smaller the height H1 of the tube shell is, the better the thickness D1 of the tube shell is, and the higher the width of the soldering tin 16 is, the better the thickness D1 of the tube shell is; in practical applications, the smaller the volume, the better the electronic device 10 is as a component of the consumer electronic system, so the shell thickness D1 is severely limited in size; likewise, the size of the PCB pads 17 is limited; therefore, in the case where the size in the X direction is limited, only improvement in the Y direction in fig. 1, i.e., lowering the package height H1 and increasing the height of the solder 16 can be made to increase the mechanical shock resistance; the height of the solder 16 depends on the length of the vertical portion 15a of the vertical leg 15.
However, the decrease in the height H1 of the envelope and the increase in the length of the vertical leg 15a are contradictory, and as shown in fig. 2, the envelope 11 is composed of the envelope seat 12 and the cover 18, and the cover 18 is located in the envelope opening 20, so that the height H1 of the envelope is composed of the width 21a of the envelope upper side wall 21, the width 20a of the opening 20, and the width 22a of the envelope lower side wall 22. The vertical leg 15a is partially formed in the lower wall 22 to define the lower wall width 22a. So in the prior art, the length of the vertical portion 15a of the vertical leg 15 is increased, which necessarily increases the overall height H1 of the package; while increasing H1 means that the center of gravity of the envelope is raised, which is detrimental to increasing resistance to mechanical shock.
Of the other two constituting the envelope height H1, the upper sidewall width 21a is dependent on the processing capacity of the envelope manufacturer, a minimum of 0.2 to 0.3 mm for the ceramic envelope; the opening width 22a depends on the chip size, fig. 3 is a cross-sectional view of the prior art device 10 along the Y-direction, the chip 30 being secured to the package base 23 by means of a die attach adhesive 28, the electrical signal of which is connected by means of wires 29 to the package bond pads 25 located on the bond steps 24, the package bond pads 25 being connected internally to the horizontal bond pads 13 or the vertical bond pads 15; the cover plate 18 is fixed on the sealing step 26 by a sealing material 27, the area of the cover plate is slightly smaller than that of the tube shell opening 20, and a sealing cavity 19 is formed by the cover plate and the tube shell seat. The dimensions of the bonding step 24 and the sealing step 26 of the package are fixed, so the dimensions of the chip 30 determine the width 20a of the opening 20 and cannot be reduced.
In summary, the prior art fails to maintain or shrink the size of the package in the Y-direction while increasing the height of the vertical fillets.
Patent EP0665438A1 describes a vertically mounted accelerometer device in which the MEMS chip and ASIC (Application-Specific-Integrated-Circuit) chip of the accelerometer are mounted on the base plate of a leadless ceramic package, the ceramic package is sealed by a kovar metal cover plate by interconnecting electrical signals by bonding wires, two rows of bonding pads are provided on one side of the ceramic package, and the bonding pads are soldered to the PCB board for location, thus achieving the purpose of vertical mounting. However, the kovar metal cover plate is conductive and must have a certain distance from the vertical portion of the side bonding pad to prevent short circuit, so the height of the package in the vertical mounting direction cannot be made small enough. In addition, if the packaging tube shell is to resist high overload, the bonding pad in the vertical mounting direction must be made too long, or the size of the tube shell in the horizontal direction is wide enough, so that the size of the tube shell is large, and the requirement of customers on the smaller and smaller device size cannot be met.
Patent US9278851B2 describes a wafer-level packaged vertical mounted MEMS chip, i.e. the MEMS chip can be directly and vertically mounted on a PCB without a ceramic package, and although the device is small in size, its housing is made of Si or glass material, is very fragile, and cannot isolate stresses when directly soldered on the PCB, and is less resistant to high overload except that the device zero point stability, temperature-dependent output signal drift, etc. are inferior to those of the ceramic package. Such packages may be used in consumer electronics and cannot be used in high-end industrial applications.
Patent CN101247709a describes the vertical fixing of electronic devices on PCB boards by means of metal fillets, which are bulky and not resistant to high overload.
US7536909 to Yang Zhao et al describes that the chip is mounted vertically inside the package and then injection molded, rather than cavity packaged, the MEMS chip is subjected to significant external stresses and has poor product performance, typically for consumer electronics.
U.S. patent No. 7176478 to Lakshman s, wathane, et al describes a method of forming a conversion plate for vertical mounting of a magnetic sensor chip; japanese patent No. 7-27641, small Chi Zhi, describes a packaging method for vertical mounting of a pressure sensor chip. All of them relate to the method of vertically mounting the chip inside the package, and do not refer to the method of vertically attaching the package, and do not refer to the method of resisting high overload.
Disclosure of Invention
The invention aims to solve the technical problem of providing a high overload resistant electronic device packaging tube shell which is small in size and resistant to high overload.
In order to solve the technical problems, the invention provides an anti-high overload electronic device packaging tube shell, which comprises a tube shell seat and a cover plate, wherein the side wall of the tube shell seat is provided with a groove with a three-section structure, the cover plate groove, the bonding groove and the sealing groove are sequentially arranged in the direction from the opening of the groove to the inner side of the tube shell seat, the sectional areas of the cover plate groove, the bonding groove and the sealing groove are sequentially reduced, the side wall of the groove forms a sealing step and a bonding step, the surface of the bonding step is provided with a bonding pad, an electric signal is communicated to a metal welding leg corresponding to the tube shell, and a metal wire is bonded between the bonding pad and a chip; the cover plate is matched with the sealing step of the groove and is sealed at the opening of the groove, a sealing cavity for accommodating the electronic chip is formed in the cover plate and the groove, a plurality of horizontal metal welding feet and a plurality of vertical metal welding feet for conducting electric signals are manufactured on the bottom surface and each side surface of the tube housing seat, the plurality of horizontal metal welding feet and the plurality of vertical metal welding feet are electrically connected with the bonding pads corresponding to the bonding steps, and each vertical metal welding foot comprises a horizontal part and a vertical part;
the cover plate groove of the groove extends to the upper end surface of the tube housing seat;
the plurality of vertical metal welding legs comprise a first vertical welding leg and a second vertical welding leg, the vertical part of the first vertical welding leg is positioned on the side wall of the tube housing seat far away from the opening of the groove, the vertical part of the second vertical welding leg is positioned on the side wall of the tube housing seat on the same side with the opening of the groove, the horizontal part of the first vertical welding leg and the horizontal part of the second vertical welding leg are positioned on the tube housing bottom plate, and the cover plate is fixedly provided with a metal strip corresponding to the position of the second vertical welding leg;
the first vertical soldering leg and the second vertical soldering leg are connected to the PCB board bonding pad through soldering tin, and each soldering tin for fixing the second vertical soldering leg wraps the second vertical soldering leg and the corresponding metal strip.
After the structure is adopted, when the package tube shell of the high overload-resistant electronic device is vertically attached to a PCB, the vertical welding pins are welded with the welding pads of the PCB through soldering tin, and electric signals are linked to the PCB; the soldering tin covers the first vertical soldering leg, the second vertical soldering leg and the cover plate metal strip of the tube shell completely, and the electronic device is vertically fixed on the PCB. The solder has a sufficient height to provide a sufficiently high mechanical shock resistant holding strength for the electronic device.
The groove cover plate groove of the high overload resistance electronic device packaging tube shell extends to the upper end face of the tube shell seat, namely, the effect that no upper side wall exists is achieved, and the lower side wall can be shorter than the prior art, so that the height of the electronic device after vertical mounting is obviously lower than that of the prior art, namely, the gravity center is reduced, and the mechanical impact resistance is obviously improved.
In order to more clearly understand the technical content of the present invention, the package case of the present high overload electronic device will be hereinafter simply referred to as the present case.
The lower end of the metal strip of the tube shell extends out of the lower side of the cover plate, and the projection of the metal strip on the side wall of the tube shell seat is partially overlapped with the vertical part of the second vertical welding leg; after adopting such structure, can increase metal strip and second and handle welding and soldering tin area of contact, in addition the mechanical connection between metal strip and the soldering tin provides extra mechanical shock resistance, has guaranteed electronic device's anti mechanical shock ability.
The metal strip and the second vertical welding leg of the tube shell form a composite welding leg, and the horizontal height of the upper end of the vertical part of the first vertical welding leg is not smaller than that of the upper end of the composite welding leg; after the structure is adopted, the height of the first vertical welding leg is increased, and the impact capability of the tube shell is further enhanced.
The cover plate and the tube housing seat of the tube housing are both made of insulating materials; after the structure is adopted, the design and technical requirements of the tube shell are met.
Drawings
Fig. 1 is a schematic view of a vertical mounting of a prior art electronic device.
Fig. 2 is a schematic perspective view of a packaged package of a vertical mount of the prior art.
Fig. 3 is a schematic cross-sectional view of a prior art vertically mounted electronic device.
Fig. 4 is a schematic perspective view of an embodiment of the present cartridge.
Fig. 5 is a schematic cross-sectional view of an embodiment of the present cartridge.
Fig. 6 is a schematic view of a vertical mounting of the present embodiment of the package.
Fig. 7 is a schematic cross-sectional view of a cartridge holder of the present cartridge embodiment.
Reference numerals illustrate: 10-prior art vertically mounted electronic devices; 11-vertical mounting tube shells in the prior art; 11a, 11b, 11c, 11d, 11 e-faces of the prior art cartridge; 12-a tube housing seat; 13-horizontal fillets; 15-vertical fillets; 15 a-vertical fillet vertical; 15 b-vertical fillet horizontal; 16-soldering tin; 17-PCB pads; 18-cover plate; 19-sealing the cavity; 20-opening the tube shell; 20 a-opening width; 21-a shell upper side wall; 21 a-upper sidewall width; 22-a shell lower side wall; 22 a-lower sidewall width; 23-a shell bottom plate; 24-a tube shell bonding table; 25-package bond pads; 26-a tube shell sealing table; 27-a sealing material; 28-sticking adhesive; 29-metal bond wires; 30-chip; 31-a PCB board; 100-low profile vertically mounted electronic devices; 108-metal strips, 108 a-metal strip extensions; 111-vertical mounting of a tube shell with a small shape; each face of the 111a, 111b, 111c, 111d, 111e, 111 f-envelope; 112-a tube housing; 113-horizontal fillets; 115-first vertical fillets; 115 a-a first vertical leg vertical portion; 115 b-a first vertical leg horizontal portion; 215-a second vertical leg; 115 a-a second vertical leg vertical portion; 215 b-a first vertical leg horizontal portion; 118-cover plate; 119-sealing the cavity; 120-opening the tube shell; 120 a-opening width; 122-a shell lower side wall; 122 "-shell floor part; 122 a-lower sidewall width; 123-a shell bottom plate; 124-a tube shell bonding station; 125-package bond pads; 126-a first tube-shell sealing station; 140-sealing the gap; 150-composite welding leg 226-second tube shell sealing table; h1-vertical mounting tube shell height in the prior art; d1-vertical pasting pipe shell thickness in the prior art; h2-low profile vertical mounting tube shell height; d2-vertical pasting of the shell thickness of the tube with small appearance; h-soldering tin height; w-solder width.
Description of the embodiments
Fig. 4 is a schematic perspective view of the package for high overload electronic device according to the present invention, wherein X, Y represents two reference directions perpendicular to each other.
The tube shell 111 comprises a tube shell seat 112 and a cover plate 118, is made of ceramic or plastic materials, and is an insulator;
the horizontal soldering leg 113 is L-shaped and is distributed on the right side 111e, the left side 111f, the upper side 111c and the rear side 111b of the tube shell for testing or horizontal mounting, the first vertical soldering leg 115 is L-shaped, the horizontal (X-direction) portion 115b thereof is distributed on the bottom plate 111d of the tube shell, the vertical (Y-direction) portion 115a (not shown) thereof is distributed on the rear side 111b of the tube shell, the length of the vertical portion 115a is greater than that of the horizontal portion 115b, and the first vertical soldering leg can be used for testing or horizontal mounting as well as vertical mounting. The second vertical leg 215 is L-shaped, with its horizontal (X-direction) portion 215b also being at the bottom 111d of the package, with its vertical (Y-direction) portion 215a being distributed over the front side 111a of the package, the area from the edge of the recess in the front side 111a of the package to the front side 111a of the package being referred to as the lower sidewall 122, the length (Y-direction dimension) of the vertical portion 215a of the second vertical leg 215 being not necessarily greater than the horizontal portion 215b, but significantly less than the vertical portion 115a of the first vertical leg 115, the second vertical leg being for vertical mounting, the length of the vertical portion 215a of the second vertical leg 215 being significantly less than the vertical portion 15a of the vertical leg 15 of the prior art, so the width 112a of the lower sidewall 122 is significantly less than the width 22a of the lower sidewall of the prior art.
As shown in fig. 7, the side wall of the tube housing 112 is provided with three grooves 120, and the cover plate groove 120b, the bonding groove 120c and the sealing groove 120d are sequentially arranged in the (-X direction) direction from the opening of the groove 120 to the inner side of the tube housing 112, the cross sections of the cover plate groove 120b, the bonding groove 120c and the sealing groove 120d are sequentially reduced, the side wall of the groove forms a sealing step 126 and a bonding step 124, the surface of the bonding step 124 is provided with a bonding pad 125, and an electric signal is communicated to a metal soldering leg corresponding to the tube housing, and a bonding metal wire is arranged between the bonding pad 124 and the chip 30.
To compensate for the reduction in the length of the second vertical leg vertical portion 215a resulting in reduced mechanical shock resistance, the present package 111 is fabricated with a metal strip 108 on the cover plate 118, the metal strip 108 not being electrically connected to the package pads 125 or other legs; the cover plate 118 is fixed at the opening of the groove 120 of the tube shell, the position of the metal strip 108 corresponds to the position of the second vertical welding leg, the projection of the metal strip extending part 108a on the front side 111a of the tube shell is overlapped with the projection part of the vertical part 215a of the second vertical welding leg 215 on the front side 111a of the tube shell, and the two parts can be contacted or not contacted, but the distance is very small, and is usually 0-0.2 mm.
When the present package 111 is vertically mounted, the metal strip 108 and the second vertical leg 215 constitute a composite leg 150, and the height (Y-direction dimension) of the composite leg 150 is equivalent to the vertical portion 115a of the first leg 115.
The tube shell 111 has no upper side wall, so the height H2 of the tube shell is composed of two parts of the width 122a of the lower side wall and the width 120a of the opening of the groove 120; accordingly, the height H1 of the envelope 11 in the prior art is constituted by three parts of the lower wall width 22a, the opening width 20a, and the upper wall width 21 a; the length of the lower wall width 122a of the present cartridge 111 of the present invention is smaller than the lower wall 22a of the prior art cartridge 11, so that the vertical mounting cartridge of the present invention has a significantly smaller dimension in the Y-direction than the prior art.
Fig. 5 shows a cross section of the vertical mounted electronic device 100 with a small outline against high overload in the Y direction, the chip 30 is mounted on the package 111 to form the electronic device 100, the chip 30 is fixed on the package base 123 by the adhesive 28, the electric signal of the chip 30 is connected to the bonding pad 125 on the bonding step 124 by the metal wire 29, and the bonding pad 125 is connected with the corresponding package inner parts of the horizontal soldering leg 113, the first vertical soldering leg 115 and the second vertical soldering leg 215, so that the electric signal of the chip 30 is connected to the package soldering leg. The cover plate 118 is made of an insulator, such as ceramic or plastic, and the sealing steps on the upper side and the lower side wall of the groove 120 are divided into a first sealing step 126 and a second sealing step 226, and are fixed on the first sealing step 126 and the second sealing step 226 through the sealing material 27 to form a sealing cavity 119 with the tube housing 112; the sealing material 27 is also an insulating material such as epoxy; a horizontal (X-direction) portion 115b of the first vertical leg 115 is formed on the bottom plate 111d of the package, and a vertical portion 115a is formed on the rear side 111b of the package; a horizontal (X-direction) portion 215b of the second vertical leg 215 is formed on the bottom plate 111d of the envelope, and a vertical portion 115a is formed on the front side 111a of the envelope at the lower side wall 122; the metal strip 108 of the cover plate 118, the extension portion 108a of which spans the sealing gap 140, is partially overlapped with the vertical portion 215a of the second vertical leg 215 in the X direction, the metal strip 108 and the second vertical leg 215 form a composite leg 150, and the length of the composite leg 150 is equal or nearly equal to that of the first vertical leg vertical portion 115 a.
When the electronic device 100 is mounted vertically, please refer to fig. 6, the bottom plate 111d of the package faces the PCB 31 and is parallel to the PCB; since the solder is only adhered to the metal surface, the solder 16 covers the surfaces of the first vertical leg 115 and the second vertical leg 215, the PCB pad 17, and the metal strip 108, the length of the PCB pad 17 determines the width W of the solder, and the length of the first vertical leg vertical portion 115a and the composite leg 150 determines the height h of the solder; since the metal strip 108 is fabricated on the cover plate 118, the cover plate also participates in withstanding part of the mechanical impact force; the horizontal welding leg 113 is only used in the factory test or the horizontal mounting of the product, and is suspended at the moment; the smaller and better the volume of the electronic device 100 as a component of the consumer electronics system, the more critical the dimensional constraints the shell thickness D2 are; likewise, the size of the PCB pads 17 is limited, and thus the height H2 of the electronic device 100 and the height H of the solder determine the mechanical shock resistance of the device; compared with the prior art, the electronic device 100 packaged by the package shell 111 has the advantages that the device height H2 is reduced under the condition that the soldering tin height H is kept unchanged, namely, the gravity center of the device is lowered, and the mechanical shock resistance is effectively improved.
The foregoing is merely one embodiment of the invention, and it should be noted that variations and modifications could be made by those skilled in the art without departing from the principles of the invention, which would also be considered to fall within the scope of the invention.
Claims (1)
1. The package tube shell of the high overload resistant electronic device comprises a tube shell seat and a cover plate, wherein the side wall of the tube shell seat is provided with a groove with a three-section structure, the direction from the opening of the groove to the inner side of the tube shell seat is sequentially provided with a cover plate groove, a bonding groove and a sealing groove, the sectional areas of the cover plate groove, the bonding groove and the sealing groove are sequentially reduced, the side wall of the groove is provided with a sealing step and a bonding step, the surface of the bonding step is provided with a bonding pad, an electric signal is communicated to a metal welding leg corresponding to the tube shell, and a metal wire is bonded between the bonding pad and a chip; the cover plate is matched with the sealing step of the groove and is sealed at the opening of the groove, a sealing cavity for accommodating the electronic chip is formed in the cover plate and the groove, a plurality of horizontal metal welding feet and a plurality of vertical metal welding feet for conducting electric signals are manufactured on the bottom surface and each side surface of the tube housing seat, the plurality of horizontal metal welding feet and the plurality of vertical metal welding feet are electrically connected with the bonding pads corresponding to the bonding steps, and each vertical metal welding foot comprises a horizontal part and a vertical part;
the method is characterized in that:
the cover plate groove of the groove extends to the upper end surface of the tube housing seat;
the plurality of vertical metal welding legs comprise a first vertical welding leg and a second vertical welding leg, the vertical part of the first vertical welding leg is positioned on the side wall of the tube housing seat far away from the opening of the groove, the vertical part of the second vertical welding leg is positioned on the side wall of the tube housing seat on the same side with the opening of the groove, the horizontal part of the first vertical welding leg and the horizontal part of the second vertical welding leg are positioned on the tube housing bottom plate, and the cover plate is fixedly provided with a metal strip corresponding to the position of the second vertical welding leg;
the first vertical soldering leg and the second vertical soldering leg are connected to a PCB bonding pad through soldering tin, and each soldering tin for fixing the second vertical soldering leg wraps the second vertical soldering leg and the corresponding metal strip;
the lower end of the metal strip extends out of the lower side of the cover plate, and the projection of the metal strip on the side wall of the tube housing seat is partially overlapped with the vertical part of the second vertical welding leg;
the metal strip and the second vertical welding leg form a composite welding leg, and the horizontal height of the upper end of the vertical part of the first vertical welding leg is not smaller than that of the upper end of the composite welding leg;
the cover plate and the tube housing seat are both made of insulating materials.
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| CN111599790B (en) * | 2020-05-13 | 2021-12-24 | 中国电子科技集团公司第十三研究所 | Ceramic leadless chip type packaging shell |
| CN113555326A (en) * | 2021-06-03 | 2021-10-26 | 珠海越亚半导体股份有限公司 | Packaging structure capable of wetting side face, manufacturing method thereof and vertical packaging module |
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