CN207529923U - Anti high overload electron device package shell - Google Patents
Anti high overload electron device package shell Download PDFInfo
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- CN207529923U CN207529923U CN201721593895.XU CN201721593895U CN207529923U CN 207529923 U CN207529923 U CN 207529923U CN 201721593895 U CN201721593895 U CN 201721593895U CN 207529923 U CN207529923 U CN 207529923U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model gives a kind of anti high overload electron device package shell, and shell seat side wall is provided with slot cover, bonding slot and seal groove, and recess sidewall forms sealed step and bonding step；The sealed step of cover board and groove coordinates, and annular seal space is formed in cover board and groove, there is horizontal metal leg and vertical metal leg on shell seat, and each vertical metal leg includes horizontal part and vertical component effect；The slot cover of groove extends to the upper surface of shell seat；Vertical metal leg includes the first vertical leg and the second vertical leg, the vertical component effect of first vertical leg and the second vertical leg is on shell seat side wall, for the horizontal part of first vertical leg and the second vertical leg all on shell bottom plate, cover board is fixed with metal strip；Scolding tin wraps up the second vertical leg and metal strip.The vertical leg of this encapsulating package welds the pad of PCB by scolding tin；Scolding tin covers the first vertical leg, the second vertical leg and metal strip of shell comprehensively, and scolding tin height can impact electronic device resistance to mechanical.
Description
Technical field
The utility model is related to a kind of encapsulating package of electronic device, more particularly to a kind of anti high overload electron device package
Shell.
Background technology
Electron device package is to be electrically connected to each other one or more electronic component chips, is then encapsulated in a protection
In structure, the purpose is to provide electrical connection, mechanical protection, chemical attack protection etc. for electronic chip.The development of encapsulation technology becomes
Gesture, seeks to that packaging appearance is less and less, and function is more and more, and cost is lower and lower.Certain product sensors of commercial Application,
The considerations of the considerations of for Performance And Reliability, particularly reduction stress influence, using cavity package method, i.e., by electronic chip
It is mounted on by bonding die glue on the bottom plate of preforming encapsulating package, the electric signal of chip is drawn package tube by bond wire line
Shell, finally with cover plate hermetic package shell.For certain electronic products, particularly there is the micro sensing of direction requirement to those
Device, such as MEMS (Micro-Electro-Mechanical Systems, micro electronmechanical) device accelerometer, MEMS gyroscope, magnetic
Senser element, photo-sensing device etc., electronic component chip are sealed in a package cavity, need during use to be vertically mounted on
On the pcb board of user, so needing vertically arranged welding or pad；In addition, in order to ensure device in high mechanical impact force
It can be remained intact under environment, it is also necessary to have enough installation strengths with PCB.High mechanical impact force is also referred to as under high overload, example
Such as 1~50,000 G (G is terrestrial gravitation unit).Pervious method is with the ceramics with metal leg or can cut down metal-glass envelope
Tubulature shell, when being installed on PCB, if direct insertion metal leg, the mounting hole of PCB is inserted into welding；If bow out formula
Welding, then leg be connected on the PCB pads other than encapsulating housing projected area.Howsoever, the vertical envelope with metal leg
Tubulature shell has the problems such as leg is yielding during the test, volume is big, is not easy to automate installation, is being miniaturized now
The ceramic package shell of no pin replaces.The pad of the existing horizontal attachment of the ceramic cartridge vertically encapsulated of no pin, and have vertical
The pad directly mounted.
Fig. 1 to 3 shows the attaching method of the vertical attachment shell of the prior art, the Y of the shell 11 of electronic device 10
Direction is connected to by scolding tin 16 on PCB plates pad 17 perpendicular to pcb board 31, the vertical leg 15 of shell, the horizontal part of leg 15
15b is produced on the -Y direction 11d of shell 11, parallel with PCB plates pad 17；The vertical component effect 15a of leg 15 is produced on shell 11
+X direction 11a and -X direction 11b on, it is vertical with pcb board pad 17.Scolding tin 16 not only plays the role of electrical connection, but also plays solid
The effect of fixed tube shell 11.Horizontal leg 13 is used for test or horizontal attachment.Under high overload use environment, due to X side
It to the minimum dimension D1 for shell three-dimensional, is easiest to damage, that is, there is the high mechanical impact force in X direction conducted by PCB
When, shell 11 is detached from scolding tin 16 with PCB.According to physical knowledge, to resist the mechanical impact force of X-direction, the height of shell
H1 is the smaller the better, and the thickness D1 of shell is the bigger the better, scolding tin 16 it is more higher wider better；In practical application, electronic device 10 is made
For a component of user's electronic system, volume is the smaller the better, so shell thickness D1 is limited by stringent size；Similary road
Reason, the size of pcb board pad 17 are also restrained；Therefore, in the case where the size of X-direction is restricted, to increase anti-machine
Tool impact capacity Y-direction can only make improvements in Fig. 1, that is, reduce shell height H1, increase the height of scolding tin 16；Scolding tin 16
Height depend on vertical leg 15 vertical component 15a length.
But the length for reducing shell height H1 and the vertical leg 15a parts of increase is conflicting, as shown in Fig. 2, pipe
Shell 11 is made of shell seat 12 and cover board 18, and cover board 18 is located in shell opening 20, so the height H1 of shell is by shell top
The width 22a three of abutment wall 22 is formed under the width 21a of wall 21, the width 20a of opening 20, shell.It makes vertical leg 15a parts
Make on lower abutment wall 22, determine lower abutment wall width 22a.So in the prior art, increase the vertical component 15a of vertical leg 15
Length, necessarily increase the total height H 1 of shell；And increasing H1 means the center of gravity raising of shell, is unfavorable for increasing resistance to mechanical
Impact capacity.
In the other the two for forming shell height H1, upper abutment wall width 21a depends on the working ability of shell manufacturer, right
It is 0.2~0.3 millimeter minimum for ceramic cartridge；Opening width 22a depends on chip size, and Fig. 3 is the device 10 of the prior art
Along the sectional view of Y-direction, chip 30 is fixed on by load glue 28 on shell bottom plate 23, and electric signal is connected by metal wire 29
To positioned at bonding step 24 on shell bonding welding pad 25 on, shell bonding welding pad 25 in horizontal leg 13 or vertical leg 15
Portion is connected；Cover board 18 is fixed on by sealing material 27 in sealed step 26, and area is slightly less than shell opening 20, with shell seat
Surround an annular seal space 19.The bonding step 24 of shell, the size of sealed step 26 are fixed, so the size of chip 30 is determined
The width 20a of opening 20 is determined, can not reduce.In short, the prior art can not be kept while the height for increasing vertical leg
Or reduce the size of shell in the Y direction.
In short, the prior art can not be kept while the height for increasing vertical leg or reduce shell in Y directions
Size.
Patent EP0665438A1 describes a kind of accelerometer device vertically mounted, the MEMS chip of accelerometer
With ASIC (Application-Specific-Integrated-Circuit, application-specific integrated circuit) chip mounted on no lead
On the bottom plate of ceramic cartridge, electric signal is connected with each other by bond wire line, ceramic cartridge is sealed by that can cut down metal cover board, made pottery
There are two row's pads in one side of porcelain tube shell, by these pad solders to pcb board for position, has just reached the mesh of vertical attachment
's.But metal cover board conduction can be cut down, there must be certain spacing with the vertical component of side bonding pads to prevent short circuit, so shell hangs down
The height in straight attachment direction can not be made sufficiently small.In addition, if this encapsulating package wants anti high overload, it is necessary to will vertically mount
It is sufficiently wide that the pad in direction is made long or shell horizontal direction size, causes shell size big, can not meet client
The requirement less and less to device size.
Patent US9278851B2 describes the vertical attachment MEMS chip of wafer level packaging, i.e. MEMS chips do not need to
Ceramic cartridge is encapsulated and directly can be vertically mounted on pcb board, although device size is small, its shell is Si or glass material
Material, it is very fragile, stress cannot be isolated when being directly welded on PCB, in addition to device zero stability, the output varied with temperature
The device difference of the performance ratios such as signal drift ceramic cartridge encapsulation is outer, can not anti high overload.This class wrapper can be used in consumer level
In electronic product, high-end industrial circle can not be applied.
Patent CN101247709A describes that electronic device is vertically fixed on pcb board by metal leg, volume
Greatly, not anti high overload.
The United States Patent (USP) US7536909 of Yang Zhao etc. describes to install Chip Vertical inside encapsulation, then notes
Modeling, is not cavity package, the external stress that MEMS chip is subject to is very big, and properties of product are poor, is generally used for consumer electronics
Product.
The United States Patent (USP) US7176478 of Lakshman S.Wathanawasam etc., which describes to form magnetic sensing chip, to hang down
The method of change-over panel needed for straight installation；Little Chi intelligence Japan Patent " the special flat 7-27641 of Open " describe a kind of pressure and pass
The packaging method of sensor Chip Vertical installation.They are all the methods installed about chip in encapsulation internal vertical, are not addressed
The method vertically pasted to shell, the method for more not addressing anti high overload.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of small volume, the anti high overload electronics of anti high overload
Device encapsulating package.
In order to solve the above technical problems, the utility model provides a kind of anti high overload electron device package shell, including
Shell seat and cover board, shell seat side wall are provided with the groove of three-stage structure, and lid is followed successively by from slot opening to shell seat interior direction
Board slot, bonding slot and seal groove, the sectional area of slot cover, bonding slot and seal groove are sequentially reduced, and recess sidewall forms sealing station
Rank and bonding step, bonding ledge surface are equipped with bonding welding pad, electric signal are connected on the corresponding metal leg of shell, be bonded
Bond wire line between pad and chip；The sealed step of cover board and groove coordinates and is sealed at slot opening, cover board and recessed
The annular seal space for accommodating electronic chip is formed in slot, if making the solid carbon dioxide for having conducting electric signal on the bottom surface of shell seat and each side
Flat metal leg and several vertical metal legs have electrical connection, each vertical metal weldering with the bonding welding pad of corresponding bonding step
Foot includes horizontal part and vertical component effect；
The slot cover of groove extends to the upper surface of shell seat；
Several vertical metal legs include the first vertical leg and the second vertical leg, and the first vertical leg vertical component effect is in
On the side wall of shell seat far from slot opening, the vertical component effect of the second vertical leg is in the shell with the same side of slot opening
On seat side wall, all on shell bottom plate, cover board corresponds to the horizontal part of the horizontal part of the first vertical leg and the second vertical leg
Second vertical welding placement of foot is fixed with metal strip；
First vertical leg and the second vertical leg are connected to by scolding tin on pcb board pad, and it is vertical each to fix second
The scolding tin of leg wraps up the second vertical leg and corresponding metal strip.
After such structure, this anti high overload electron device package shell is when vertical attachment is to pcb board, vertical welding
Foot welds the pad of PCB by scolding tin, and electric signal is linked on pcb board；Scolding tin cover comprehensively shell the first vertical leg,
Second vertical leg and cover board metal strip, electronic device is vertically fixed on pcb board.Scolding tin has enough height, can be with
The fixing intensity of sufficiently high resistance to mechanical impact is provided for electronic device.
The groove slot cover of this anti high overload electron device package shell extends to the upper surface of shell seat, that is, reaching does not have
The effect of upper abutment wall, lower abutment wall can also be shorter than the prior art, so the height of electronic device compares the prior art after vertical attachment
Significantly low namely center of gravity reduces, and resistance to mechanical impact capacity significantly improves.
For the clearer technology contents for understanding the utility model, below by this anti high overload electron device package shell
Referred to as this shell.
The metal strip lower end of this shell is extended on the downside of cover board, and metal strip projects vertical with second on shell seat side wall
The vertical component effect of leg overlaps；After such structure, metal strip can be increased and the second disposition welding connects with scolding tin
Contacting surface is accumulated, and in addition the mechanical connection between metal strip and scolding tin, provides additional mechanical impact resistance, ensure that electronic device
Resistance to mechanical impact capacity.
The metal strip of this shell leg vertical with second forms compound leg, and the first vertical leg vertical component upper end is horizontal
Highly it is not less than the level height of compound leg upper end；After such structure, the height of the first vertical leg is increased, into
One step enhances the impact capacity of this shell.
The cover board and shell seat of this shell are insulating materials；After such structure, meet the design of this shell and skill
Art requirement.
Description of the drawings
Fig. 1 is the vertical attachment schematic diagram of the electronic device of the prior art.
Fig. 2 is the encapsulating package stereoscopic schematic diagram vertically mounted of the prior art.
Fig. 3 is the diagrammatic cross-section of the electronic device vertically mounted of the prior art.
Fig. 4 is the stereoscopic schematic diagram of this shell embodiment.
Fig. 5 is the diagrammatic cross-section of this shell embodiment.
Fig. 6 is the vertical attachment schematic diagram of this shell embodiment.
Fig. 7 is the diagrammatic cross-section of this shell embodiment shell seat.
Reference sign：The electronic device vertically mounted of the 10- prior arts；The vertical attachment pipe of the 11- prior arts
Shell；Each face of the shell of 11a, 11b, 11c, 11d, 11e- prior art；12- shell seats；The horizontal legs of 13-；15- vertical weldings
Foot；The vertical leg vertical component effects of 15a-；The vertical leg horizontal parts of 15b-；16- scolding tin；17-PCB pads；18- cover boards；19- is sealed
Chamber；20- shells are open；20a- opening widths；Abutment wall on 21- shells；The upper abutment wall width of 21a-；Abutment wall under 22- shells；Under 22a-
Abutment wall width；23- shell bottom plates；24- shells are bonded platform；25- shell bonding welding pads；26- package closure platforms；27- sealing material
Material；28- bonding die glue；29- metallic bond zygonemas；30- chips；31-PCB plates；The electronic device that the small shapes of 100- vertically mount；108-
Metal strip, 108a- metal strip extensions；The small shapes of 111- vertically mount shell； 111a、111b、111c、111d、111e、
Each face of 111f- shells；112- shell seats；The horizontal legs of 113-；The first vertical legs of 115-；The first vertical legs of 115a-
Vertical component effect；The first vertical leg horizontal parts of 115b-；The second vertical legs of 215-；The second vertical leg vertical component effects of 115a-；215b-
First vertical leg horizontal part；118- cover boards；119- annular seal spaces；120- shells are open；120a- opening widths；Under 122- shells
Abutment wall；122 "-shell bottom plate part；Abutment wall width under 122a-；123- shell bottom plates；124- shells are bonded platform；125- shells
Bonding welding pad；126- the first package closure platforms；140- seal clearances；Compound the second package closures of the leg 226- platforms of 150-；H1-
The vertical attachment shell height of the prior art；The vertical attachment shell thickness of the D1- prior arts；The small shapes of H2- vertically mount pipe
Shell height；The small shapes of D2- vertically mount shell thickness；H- scolding tin height；W- scolding tin width.
Specific embodiment
It is the three-dimensional appearance schematic diagram of the anti high overload electron device package shell of the utility model shown in Fig. 4, X, Y in figure
Represent vertical two reference direction.
This shell 111 includes shell seat 112 and cover board 118, is made by ceramics or plastics material, is insulator；
Horizontal leg 113 is L-shaped, is distributed in the right side 111e, left side 111f, upper side 111c, Yi Jihou of shell
On the 111b of side, for test or horizontal attachment, the first vertical leg 115 is L-shaped, level (X-direction) part 115b distributions
In on the bottom plate 111d of shell, vertical (Y-direction) part 115a (not shown)s are distributed on the trailing flank 111b of shell, vertically
The length of part 115a is more than horizontal component 115b, and the first vertical leg both can be used for test or horizontal attachment, can also use
In vertical attachment.Second vertical leg 215 is L-shaped, and level (X-direction) part 215b is also at the bottom plate 111d of shell,
Vertically (Y-direction) part 215a is distributed on shell leading flank 111a, the recess edge in shell leading flank 111a to shell
The region of leading flank 111a is known as lower abutment wall 122, and the length (Y-direction size) of the second vertical 215 vertical component 215a of leg is no
Centainly it is more than horizontal component 215b, but is significantly less than the vertical component 115a of the first vertical leg 115, the second vertical leg is used for
Vertical attachment, the length of the vertical component 215a of the second vertical leg 215 are significantly less than hanging down for the vertical leg 15 of the prior art
Straight part 15a, so the width 112a of lower abutment wall 122 is significantly less than the lower abutment wall width 22a of the prior art.
As shown in Figure 7,112 side wall of shell seat is provided with three sections of groove 120, is open from groove 120 to 112 inside of shell seat
Direction (-X direction) is followed successively by slot cover 120b, bonding slot 120c and seal groove 120d, slot cover 120b, bonding slot 120c and close
The sectional area of sealing groove 120d is sequentially reduced, and recess sidewall forms sealed step 126 and bonding step 124,124 surface of bonding step
Equipped with bonding welding pad 125, electric signal is connected on the corresponding metal leg of shell, the linkage of bonding welding pad 124 and chip 30
Close metal wire.
Cause the decrease of resistance to mechanical impact capacity, this shell in order to compensate for the second vertical leg vertical component effect 215a length reduction
111 on cover board 118 make have metal strip 108, metal strip 108 is not electrically connected with shell pad 125 or other legs；Lid
Plate 118 is fixed on 120 opening of shell groove, and the position of metal strip 108 corresponds to the position of the second vertical leg, metal strip
Extension 108a vertical with second leg 215 of projection of shell leading flank 111a vertical component effect 215a in shell leading flank
The projection section overlapping of 111a, the two can be contacted, can not also be contacted, but spacing very little, usually in 0~0.2mm.
When this shell 111 vertically mounts, 108 and second vertical leg 215 of metal strip forms compound leg 150, compound
The height (Y-direction size) of leg 150 is suitable with the vertical component 115a of the first leg 115.
This shell 111 is without upper abutment wall, so its height H2 is by 120 opening width of lower abutment wall width 122a and groove
Bis- parts of 120a are formed；Correspondingly, in the prior art the height H1 of shell 11 by lower abutment wall width 22a, opening width 20a and on
Abutment wall width 21a forms three parts and forms；And the length of the lower abutment wall width 122a of this shell of the utility model 111 is less than
The lower abutment wall 22a of the shell 11 of the prior art, so, the size of the vertical attachment shell of the utility model in the Y direction is significantly small
In the prior art.
Fig. 5 shows section of the vertical mount electronic device 100 of the small shape of the utility model anti high overload along Y-direction,
Chip 30 is packed into this shell 111 and forms electronic device 100, and chip 30 is fixed on by bonding die glue 28 on shell bottom plate 123,
Electric signal is connected to by metal wire 29 on the bonding welding pad 125 on bonding step 124, bonding welding pad 125 and horizontal welding
Foot 113, the first vertical leg 115, the second vertical leg 215 have to be connected inside corresponding shell, in this way, the electric signal of chip 30
It is connected on shell leg.The material of cover board 118 be insulator, such as ceramics or plastics, in 120 upside lower wall of groove
Sealed step be divided into the first sealed step 126 and the second sealed step 226, the first sealing is fixed on by sealing material 27
In 126 and second sealed step 226 of step, an annular seal space 119 is surrounded with shell seat 112；Sealing material 27 is also insulation material
Material, such as epoxy resin；Level (X-direction) part 115b of first vertical leg 115 is made on the bottom plate 111d of shell, vertically
Part 115a is made on the trailing flank 111b of shell；Horizontal part (X-direction) part 215b of second vertical leg 215 is made in
On the bottom plate 111d of shell, vertical component 115a is made in 122 position of lower abutment wall on the shell leading flank 111a of shell；Lid
The metal strip 108 of plate 118, extension 108a is across seal clearance 140, and in X directions, leg 215 vertical with second hangs down
Straight portion 215a partly overlaps, and the leg 215 vertical with second of metal strip 108 forms compound leg 150, the length of compound leg 150
It is equal with the first vertical leg vertical component 115a or close to equal.
When electronic device 100 vertically mounts, see Fig. 6, the bottom plate 111d of shell is towards pcb board 31, and the two
It is parallel；Since scolding tin can be only paid in metal surface, so scolding tin 16 covers the first vertical 115 and second vertical leg of leg
215th, the surface of pcb board pad 17 and metal strip 108, the length of pcb board pad 17 just determine the width W of scolding tin, and
The length of first vertical leg vertical component effect 115a and compound leg 150 just determines the height h of scolding tin；Since metal strip 108 is made
Make on cover board 118, so cover board, which also assists in, bears some mechanical impact force；Horizontal leg 113 is only tested in product export
Or used during level attachment, at this time vacantly；A component of the electronic device 100 as user's electronic system, volume is the smaller the better,
So shell thickness D2 is limited by stringent size；As a same reason, the size of PCB plates pad 17 is also restrained, therefore,
The height H2 of the electronic device 100 and height h of scolding tin determines the resistance to mechanical impact capacity of device；Utilize the utility model
The electronic device 100 for encapsulating the encapsulation of this shell 111 compared with prior art, in the case where keeping scolding tin height h constant, reduces
It element height H2 namely reduces device center of gravity, is effectively improved resistance to mechanical impact capacity.
Above-described is only a kind of embodiment of the utility model, it is noted that for the ordinary skill of this field
For personnel, under the premise of the utility model principle is not departed from, several variations and modifications can also be made, these also should be regarded as
Belong to the scope of protection of the utility model.
Claims (4)
1. a kind of anti high overload electron device package shell, including shell seat and cover board, shell seat side wall is provided with three-stage structure
Groove, is followed successively by slot cover, bonding slot and seal groove from slot opening to shell seat interior direction, slot cover, bonding slot and close
The sectional area of sealing groove is sequentially reduced, and recess sidewall forms sealed step and bonding step, and bonding ledge surface is equipped with bonding welding pad,
Electric signal is connected on the corresponding metal leg of shell, bond wire line between bonding welding pad and chip；Cover board and groove
Sealed step coordinates and is sealed at slot opening, and the annular seal space for accommodating electronic chip is formed in cover board and groove, shell seat
Several horizontal metal legs for having conducting electric signal and several vertical metal legs are made on bottom surface and each side, with corresponding keys
Closing the bonding welding pad of step has electrical connection, and each vertical metal leg includes horizontal part and vertical component effect；
It is characterized in that：
The slot cover of groove extends to the upper surface of shell seat；
Several vertical metal legs include the first vertical leg and the second vertical leg, and the first vertical leg vertical component effect is in separate
On the side wall of the shell seat of slot opening, the vertical component effect of the second vertical leg is in the shell seat side with the same side of slot opening
On wall, for the horizontal part of the horizontal part of the first vertical leg and the second vertical leg all on shell bottom plate, cover board corresponds to second
Vertical welding placement of foot is fixed with metal strip；
First vertical leg and the second vertical leg are connected to by scolding tin on pcb board pad, each fix the second vertical leg
Scolding tin wrap up the second vertical leg and corresponding metal strip.
2. anti high overload electron device package shell according to claim 1, it is characterized in that：
The metal strip lower end is extended on the downside of cover board, and metal strip projects hanging down for leg vertical with second on shell seat side wall
Straight portion overlaps.
3. anti high overload electron device package shell according to claim 1, it is characterized in that：
Metal strip leg vertical with second forms compound leg, and the first vertical leg vertical component upper end level height is not small
Level height in compound leg upper end.
4. anti high overload electron device package shell according to claim 1, it is characterized in that：
The cover board and shell seat are insulating materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721593895.XU CN207529923U (en) | 2017-11-24 | 2017-11-24 | Anti high overload electron device package shell |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721593895.XU CN207529923U (en) | 2017-11-24 | 2017-11-24 | Anti high overload electron device package shell |
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| Publication Number | Publication Date |
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| CN207529923U true CN207529923U (en) | 2018-06-22 |
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| CN201721593895.XU Active CN207529923U (en) | 2017-11-24 | 2017-11-24 | Anti high overload electron device package shell |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768323A (en) * | 2017-11-24 | 2018-03-06 | 安徽北方芯动联科微系统技术有限公司 | Anti high overload electron device package shell |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768323A (en) * | 2017-11-24 | 2018-03-06 | 安徽北方芯动联科微系统技术有限公司 | Anti high overload electron device package shell |
| CN107768323B (en) * | 2017-11-24 | 2023-12-05 | 安徽芯动联科微系统股份有限公司 | High overload resistant electronic device packaging tube shell |
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