JP2014060354A - Multi-piece wiring board and wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which inhibits the occurrence of mechanical destruction such as a chip and the like of an insulation layer at a part along an inner periphery of a through hole.SOLUTION: A multi-piece wiring board comprises: a mother board 1 on which a plurality of insulation layers are layered and a plurality of wiring board regions 2 are arranged; split grooves 3 provided on a top face of the mother board 1 and along boundaries of the wiring board regions 2; and through holes provided in the boundaries of the wiring board regions 2. An inner periphery of the through hole in one insulation layer is positioned inside the inner periphery of the through hole in another insulation layer and the inner periphery of the through hole in the one insulation layer protrudes outward. In the one insulation layer, because there is no protruding part to the inside the through hole and near the split groove 3, a chip and the like of an inner peripheral part of the insulation layer caused by a shock at the time of breaking the mother board 1 can be inhibited.

Description

  The present invention relates to a multi-piece wiring board in which a plurality of wiring board regions serving as wiring boards for mounting electronic components such as semiconductor elements are arranged vertically and horizontally on a mother board, and an individual wiring board. is there.

  Conventionally, as a wiring board used for mounting electronic components such as semiconductor elements and surface acoustic wave elements, an electronic component mounting portion is provided on the upper surface of a rectangular plate-shaped insulating substrate made of an aluminum oxide sintered body or the like. In many cases, a wiring conductor is provided from the mounting portion or its periphery to the side surface or the lower surface of the insulating substrate.

  The wiring board is generally manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area mother board. The multi-cavity wiring board is formed by arranging a plurality of wiring board regions serving as wiring boards in a vertical and horizontal arrangement on a flat mother board formed by laminating a plurality of insulating layers. Such a multi-cavity wiring board is provided with a dividing groove in advance at the boundary of the wiring board region. By breaking the mother board along the dividing groove, the multi-piece wiring board is divided into individual wiring boards.

  In the multi-cavity wiring substrate and the wiring substrate, a groove-like portion (groove portion) extending in the thickness direction may be provided on a part of the side surface of the insulating substrate. The groove portion is a portion for positioning the wiring board when the wiring board is set in various devices such as an electronic component mounting device. By fitting the groove into a predetermined convex portion of the device, the wiring board can be positioned and set at a predetermined position of the device. In the multi-cavity wiring board, a through hole is provided so as to straddle the boundary between adjacent wiring board regions, for example. This through hole becomes a groove in the individual wiring board.

JP-A-8-264946 JP 2003-273526 A

  In recent years, it has become necessary to increase the positioning accuracy of the wiring board. In order to cope with this, a means of setting the inner circumference of any one of the insulating layers inside the inner circumference of the other insulating layer in the through hole penetrating the plurality of insulating layers can be considered. In this case, it is possible to suppress variations in the inner peripheral position of the groove due to the stacking deviation of the plurality of insulating layers.

  However, in this case, in the one insulating layer, the inner peripheral portion in the through hole protrudes more inward than the other insulating layers. For this reason, a new problem arises in that the protruding portion is likely to be mechanically broken such as a chip due to an impact when the mother substrate is broken along the dividing groove.

The multi-piece wiring board according to one aspect of the present invention includes a mother board in which a plurality of insulating layers are stacked and a plurality of wiring board regions are arranged vertically and horizontally, on the upper surface of the mother board, A multi-piece wiring board provided with dividing grooves along a boundary of the wiring board region, and a through-hole penetrating the plurality of insulating layers is provided at the boundary of the wiring board region. In the through hole, an inner periphery of any one of the plurality of insulating layers is located on an inner side of an inner periphery of the other insulating layer, and the mother substrate is disposed on the mother substrate in a plan view. In the portion where the dividing groove is provided, a part of the inner periphery of the one insulating layer is convex outward.

  A wiring board according to one aspect of the present invention is obtained by dividing the multi-piece wiring board having the above-described configuration along the dividing groove.

  According to the multi-cavity wiring board of one aspect of the present invention, a part of the inner periphery of any one insulating layer protruding into the through hole is convex outward in the portion where the dividing groove is provided. Therefore, when the mother substrate is divided along the dividing groove, mechanical breakage such as chipping of a portion along the inner periphery of the through hole in the one insulating layer can be suppressed.

  In the portion where the dividing groove is provided in the one insulating layer, that is, the portion where chipping or the like is likely to occur, the protruding dimension of the portion protruding into the through hole is small. Or there is no protruding part. Therefore, it is possible to provide a multi-piece wiring substrate in which the occurrence of chipping of the insulating layer (insulating substrate) in the inner peripheral portion in the through hole is suppressed.

  In addition, according to the wiring board of one aspect of the present invention, since the multi-piece wiring board having the above-described configuration is divided into pieces, the insulation on the inner peripheral surface of the groove part in which the through hole is divided is provided. It is possible to provide a wiring board in which layer chipping or the like is suppressed.

It is a top view which shows the multi-piece wiring board of embodiment of this invention. (A) is an enlarged top view showing a main part of the multi-cavity wiring board shown in FIG. 1, (b) is a sectional view taken along line AA in (a), and (c) is (a). It is sectional drawing in the BB line of FIG. It is a top view which shows the wiring board of embodiment of this invention. It is a perspective view which shows the wiring board of embodiment of this invention. (A) And (b) is a perspective view which shows the principal part when the multi-piece wiring board shown in FIG. 1 is divided | segmented into a piece, respectively. (A) is a top view which shows the principal part in the modification of the multi-cavity wiring board shown in FIG. 1, (b) is sectional drawing in the AA of (a), (c) is ( It is sectional drawing in the BB line of a). It is sectional drawing which shows the modification in the principal part of the multi-cavity wiring board shown in FIG.6 (b). (A) And (b) is a top view which shows the principal part in the modification of the multi-cavity wiring board shown in FIG. 1, respectively. It is a perspective view which shows the principal part in the other modification of the multi-cavity wiring board shown in FIG.

  A multi-piece wiring board according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a top view showing an example of an embodiment of a multi-piece wiring board according to the present invention. Also,
FIG. 2A is a top view showing an enlarged main part of the multi-cavity wiring board shown in FIG. 1, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. FIG.2 (c) is sectional drawing in the BB line of Fig.2 (a). FIG. 3 is a top view showing the wiring board according to the embodiment of the present invention. Electronic components (not shown) are mounted on the wiring board, and electronic devices used in various electronic devices such as mobile phones, sensors, lighting fixtures, and cameras are manufactured.

  In FIG. 1 and FIG. 2, 1 is a mother board and 2 is a wiring board region. A plurality of wiring board regions 2 are arranged vertically and horizontally on the mother board 1, and a dividing groove 3 is provided at the boundary of the wiring board area 2 so that a multi-piece wiring board 9 is basically formed. Further, for example, the multi-piece wiring board 9 shown in FIG. 1 is divided to produce a piece of wiring board 19 shown in FIG. What is obtained by dividing the mother board 1 along the boundary of the wiring board region 2 is an insulating base 11 of the individual wiring board 19. Further, the through-hole 6 in the multi-piece wiring board 9 serves as a groove 16 on the side surface of the insulating base 11 of the piece of wiring board 19.

  The mother substrate 1 is a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a mullite sintered body. A plurality of insulating layers 1a, 1b, 1c (1a to 1c) made of In the following description, there is a case where the layer is simply referred to as an insulating layer (no symbol) without particularly specifying a stacking position.

  For example, if each of the insulating layers 1a to 1c is made of an aluminum oxide sintered body, the mother substrate 1 can be manufactured as follows.

  First, a raw material powder containing aluminum oxide as a main component and added with powders such as silicon oxide, magnesium oxide, and calcium oxide is kneaded with an organic solvent and a binder, and formed into a sheet by a molding method such as a doctor blade method or a lip coater method. Forming a plurality of ceramic green sheets. Next, a metal paste such as tungsten or molybdenum is kneaded with an organic solvent and a binder to produce a metal paste. Next, a metal paste is printed on a pattern of a predetermined wiring conductor 4 by a printing method such as a screen printing method in each region to be the wiring board region 2. Then, after laminating a plurality of ceramic green sheets to form a vertically laminated body, it is cut into the outer dimensions of the mother board 1, and this laminated body is fired at a firing temperature of about 1300-1500 ° C. 1 can be made.

  In the example shown in FIGS. 1 and 2, a wiring conductor 4 is provided in the wiring board region 2. For example, when an electronic component (not shown) is mounted on the wiring board region 2, the wiring conductor 4 functions as a connection conductor such as a pad that is electrically connected to the electronic component.

  The wiring conductor 4 is formed of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum. The wiring conductor 4 may be formed of an alloy of these metal materials. The wiring conductor 4 is attached to the mother board 1 in the form of a thin film layer such as a metallized layer, a plating layer or a vapor deposition layer. If the wiring conductor 4 is made of a metallized layer of tungsten, the wiring conductor 4 can be provided as follows. That is, a metal paste prepared by kneading tungsten powder with an organic solvent and a binder is manufactured, and then this metal paste is printed at a predetermined position on the ceramic green sheet to be the mother substrate 1, and then the ceramic green sheet and the metal By simultaneously baking the paste, the wiring conductor 4 can be provided on the mother board 1.

  The plurality of wiring board regions 2 arranged on the mother board 1 are areas that each become the individual wiring board 19. For example, a plurality of wiring boards 19 as shown in FIG. 3 are produced simultaneously and collectively by breaking the mother board 1 at the portion where the dividing grooves 3 are provided. A wiring conductor 4 is attached to an insulating substrate 11 to basically form a single wiring substrate 19.

When the individual wiring substrate 19 is used as an electronic component mounting substrate, an electronic component mounting portion (no symbol) is provided at the center of the upper surface of the wiring substrate region 2. For example, the mounting portion is shown in FIG.
And it is inside the frame-shaped broken line surrounding the wiring conductor 4 in FIG. The mother board 1 may have a recess (so-called cavity) that accommodates such electronic components on each of the upper surfaces of the plurality of wiring board regions 2. In this case, a part or all of the bottom surface of the concave portion becomes a mounting portion for the electronic component.

  Electronic components (not shown) mounted on the wiring board 19 (wiring board region 2) include semiconductor integrated circuit elements such as IC and LSI, LED (light emitting diode), PD (photodiode), CCD (charge coupled). A semiconductor device including an optical semiconductor element such as an element), a piezoelectric element such as a surface acoustic wave element or a crystal resonator, a capacitive element, a resistor, or a micromachine (so-called MEMS) in which a minute electromechanical mechanism is formed on the surface of a semiconductor substrate. Various electronic components such as an element) can be mentioned.

  Electronic components include, for example, resin adhesives such as epoxy resins, polyimide resins, acrylic resins, silicone resins, polyether amide resins, Au-Sn, Sn-Ag-Cu, Sn-Cu, Sn-Pb. It is joined to the mounting portion of the wiring board 19 with solder such as glass or glass.

  A dividing groove 3 is provided on the upper surface of the mother board 1 of the multi-piece wiring board 9. In the example of this embodiment, the dividing groove 3 is provided along the boundary of the wiring board region 2 in the uppermost insulating layer 1a among the plurality of insulating layers 1a to 1c. By applying a bending stress to the mother substrate 1 at the portion where the dividing grooves 3 are provided, the mother substrate 1 is broken along the dividing grooves 3. As a result, the multi-cavity wiring board 9 can be divided into a plurality of wiring board regions 2 as individual wiring boards 19.

  The dividing groove 3 can be provided by making a cut with a cutter blade or the like along the boundary of the wiring board region 2 in the main surface such as the upper surface of the laminate of ceramic green sheets to be the mother substrate 1.

The depth of the dividing groove 3 may be such that it reaches the second insulating layer 1b from the top beyond the uppermost insulating layer 1a. However, with the recent thinning of electronic devices, the thickness of the mother board 1 tends to be as thin as about 0.3 mm or less, so that if the dividing groove 3 is too deep, the mechanical strength of the mother board 1 is increased. May be reduced. In this case, there is a possibility that problems such as inadvertent cracking in the mother board 1 are likely to occur. As the mother substrate 1 becomes thinner, the number of insulating layers is reduced. Therefore, especially when the mother substrate 1 is made thin, it is preferable that the dividing groove 3 is provided only in the uppermost insulating layer 1a.

  In the example shown in FIG. 1, a dummy region 5 is provided on the outer peripheral portion of the mother board 1. The dummy area 5 is provided to facilitate handling of the multi-piece wiring board 9. The boundary between the wiring board regions 2 provided with the dividing grooves 3 is a boundary between the wiring board regions 2 and a boundary between the wiring substrate region 2 and the dummy region 5.

  At the boundary of the wiring board region 2, a through hole 6 that continuously penetrates the plurality of insulating layers 1 a to 1 c is provided. In the example shown in FIG. 1, a through hole 6 is also provided at the boundary between the wiring board region 2 and the dummy region 5.

  The through-hole 6 is a part for positioning when the multi-piece wiring board 9 or the individual wiring board 19 is positioned and set on various processing devices. In the individual wiring substrate 19, a groove 16 formed by dividing the through hole 6 is provided on the side surface of the insulating substrate 11.

The apparatus is, for example, a mounting machine for mounting electronic components, a polishing machine, or a machine for various processing such as electrical characteristics, an inspection tool, or a jig. For example, as shown in FIG. 4, if the through hole 6 (groove portion 16) is fitted into the convex portion of the device or jig, the wiring board 19 can be positioned and set at a predetermined position with respect to the device or jig.

  The through hole 6 can be provided as follows, for example. That is, a through hole 6 (partial through hole) is provided in a predetermined portion of the boundary of the wiring board region 2 in each of the plurality of ceramic green sheets serving as the mother board 1. Next, the plurality of ceramic green sheets are stacked and fired so that the partial through holes provided in the respective ceramic green sheets are connected to each other vertically, whereby the through holes 6 can be provided in the mother substrate 1. Examples of the method of providing the partial through hole in the ceramic green sheet include mechanical punching using a punching die including a metal pin and the like, laser processing, and the like.

  In the plurality of insulating layers 1 a to 1 c, the inner periphery of any one of the insulating layers is located inside the inner periphery of the other insulating layer in the through hole 6. In the example shown in FIG. 1, the one insulating layer is the uppermost insulating layer 1a. That is, in the through hole 6, the inner circumference of the uppermost insulating layer 1a is located inside the inner circumference of the other insulating layers 1b and 1c. In other words, in the through hole 6, the inner circumference of any one of the insulating layers, for example, the inner circumference of the uppermost insulating layer 1a is located on the innermost side.

  Since the inner circumference of the uppermost insulating layer 1 a as one insulating layer is located on the innermost side, the position of the inner circumferential surface of the through hole 6 is always within the innermost insulating layer 1 a in the through hole 6. It becomes a circumferential position. Therefore, for example, even if a stacking position shift (stacking shift) or the like occurs between the plurality of insulating layers 1a to 1c, the inner peripheral position of the through-hole 6 is prevented from varying due to the stacking shift. Can be done. Therefore, the inner peripheral position of the through hole 6 is prevented from varying, and the positional accuracy of the inner periphery of the groove 16 in the individual wiring board 19 is high. As a result, the inner peripheral position of the groove portion 16 of the individual wiring board 19 can also ensure high positioning accuracy of the individual wiring board 19 with respect to the device or the like.

  Note that the effect on the positioning due to the fact that one insulating layer is the uppermost insulating layer 1a is the case where the other insulating layers 1b and 1c other than the uppermost insulating layer 1a are the one insulating layer. Can be obtained as well.

  The inner periphery of the uppermost insulating layer 1a in the through hole 6 protrudes into the through hole 6 in a convex shape according to the difference in the inner peripheral positions of the plurality of insulating layers 1a to 1c as described above. Further, in the portion where the dividing groove 3 is provided in the mother substrate 1 in a plan view, a part of the inner circumference in the uppermost insulating layer 1a is convex outward in the plan view.

  In a portion where the dividing groove 3 is provided in the mother substrate 1 in a plan view, a part of the inner periphery of the uppermost insulating layer 1 a is convex outward, so that the mother substrate 1 is formed along the dividing groove 3. When divided, mechanical breakage such as chipping in the portion 1aa protruding into the through hole 6 of the uppermost insulating layer 1a protruding into the through hole 6 can be suppressed.

  That is, the portion 1aa protruding from the inner periphery of the through hole 6 in the uppermost insulating layer 1a is a portion where the dividing groove 3 is provided, that is, a portion where chipping or the like is likely to occur, as shown in FIG. In addition, the protruding dimension of the protruding part 1aa is small or the protruding part 1aa does not exist. Therefore, for example, even if the mother substrate 1 is broken as shown in FIG. Therefore, it is possible to provide the multi-piece wiring board 9 in which the occurrence of such mechanical destruction is suppressed. FIGS. 5A and 5B are perspective views showing the main part when the multi-piece wiring board 9 shown in FIG. 1 is divided into pieces. In FIG. 5, parts similar to those in FIGS. 1 to 3 are denoted by the same reference numerals.

The thickness of each insulating layer including the uppermost insulating layer 1a is, for example, about 50 to 500 μm. As an example of the thinning of the wiring board 19 corresponding to the thinning as an electronic device, the thickness of the insulating substrate 11 (mother board 1) may be about 0.5 mm (500 μm) or less. In this case, for example, when the number of laminated insulating layers is about 3 to 10, the thickness of each insulating layer is set to a range of about 50 to 100 μm. When the dividing groove 3 is too deep, the mother board 1 in the multi-piece wiring board 19 for producing such a thinned wiring board 19 is mechanical in the portion where the dividing groove 3 is provided and in the surrounding portion. There is a possibility that inadvertent cracking or the like is likely to occur due to a significant decrease in strength. For example, in such a case, the depth of the dividing groove 3 is set to a depth halfway in the thickness direction of the uppermost insulating layer 1a.

  In particular, when the depth of the dividing groove 3 is a depth halfway through the uppermost insulating layer 1a, the inner periphery of the through hole 6 in the uppermost insulating layer 1a is provided in the portion where the dividing groove 3 is provided. There is a great effect that a part of is convex outward in plan view. That is, in such a case, when the thin portion immediately below the dividing groove 3 of the protruding portion 1aa of the uppermost insulating layer 1a breaks, a defect such as a chip is likely to occur in the thin portion. In contrast, as described above, in the portion where the dividing groove 3 is provided, the protruding portion 1aa is shortened or does not exist, so that occurrence of chipping or the like is effectively suppressed.

  In order to make the inner periphery of the through-hole 6 in the uppermost insulating layer 1a into the above-described form, when a partial through-hole (not indicated) is provided in the ceramic green sheet to be the uppermost insulating layer 1a, the shape of the partial through-hole May be the shape of the through hole 6 in the uppermost insulating layer 1a as described above. In this case, for example, when the through-hole 6 is provided by processing using a mold, the punched shape by the mold is the shape of the through-hole 6 (partial through-hole) in the uppermost insulating layer 1a.

  6 (a) to 6 (c) are top views showing a main part in a modification of the multi-cavity wiring board 9 shown in FIG. 1, and FIG. 6 (b) is a sectional view taken along the line AA in FIG. (C) is a sectional view taken along line BB in (a). 6, parts similar to those in FIGS. 1 and 2 are denoted by the same reference numerals. FIGS. 6A to 6C correspond to FIGS. 2A to 2C, respectively, and show the same parts in the multi-piece wiring board 9 in an enlarged manner.

  In the example shown in FIG. 6, the inner periphery of the insulating layer 1b located in the central portion of the mother substrate 1 in the thickness direction is located inside the inner periphery of the other insulating layers 1a and 1c. Even in such a case, as described above, it is possible to increase the positioning accuracy of the individual wiring board 19 and the like.

  Further, a part of the inner periphery in the through hole 6 of the central insulating layer 1b as any one insulating layer is convex outward in a portion where the dividing groove 3 is provided in the mother substrate 1 in a plan view. For this reason, when the mother substrate 1 is divided along the dividing groove 3, mechanical breakage such as chipping in the portion 1bb protruding into the through hole 6 in the insulating layer 1b in the center can be suppressed.

  When the inner periphery of the insulating layer other than the uppermost insulating layer 1a such as the central insulating layer 1b protrudes into the through hole 6 as described above, the central insulating layer 1b or the like It is desirable that the dividing groove 3 is provided at a depth reaching up to.

  That is, for example, as shown in FIG. 7, when the dividing groove 3 is provided only in the uppermost insulating layer 1a, the inner periphery of the insulating layer 1b at the center is more than the inner periphery of the other insulating layers 1a and 1c. If it is also inside, even if a part of the inner periphery of the insulating layer 1b at the center is convex outward as described above, chipping or the like at the protruding portion 1bb of the insulating layer 1bb at the center is suppressed. May be less effective. This is because there is a possibility that the progress of the breakage of the mother substrate 1 proceeding from the bottom of the dividing groove 3 is directed to the protruding portion. FIG. 7 is a cross-sectional view showing the modification of FIG. 6B (the main part of another modification of the multi-cavity wiring board shown in FIG. 1).

  In the case where the uppermost insulating layer 1a is the one insulating layer described above, a part of the inner periphery of the through hole 6 in the uppermost insulating layer 1a that is convex outwardly (the protruding portion 1aa Of these, the outermost part) is preferably at the same position as the inner periphery of the through hole 6 in the other insulating layers 1b and 1c. In this case, the protruding portion 1aa does not exist in the portion where the dividing groove 3 is provided. Therefore, as described above, defects such as chipping in the uppermost insulating layer 1a are more effectively suppressed. In this case, it is assumed that the dividing groove 3 passes through the tip of the convex portion.

  It is accurate that the inner periphery of the through hole 6 of the uppermost insulating layer 1a is located at the same position as the inner periphery of the through hole 6 in the other insulating layers 1b and 1c in a part where the inner periphery is convex outward. In addition to the case where the positions are the same, the case where there is a slight deviation between the positions of the two is also included. The inner periphery of the uppermost insulating layer 1a may be located outside the inner periphery of the other insulating layers 1b and 1c. If the positional deviation between the two is, for example, about 20 μm or less in plan view, it can be considered that the protruding portion 1aa does not exist, and an effect of suppressing the above-described chipping or the like can be obtained.

  In the example shown in FIGS. 1 and 2, a part of the uppermost insulating layer 1 a that is the convex shape on the inner periphery of the through hole 6 has a trapezoidal shape in plan view. In such a case, the process which makes the inner periphery of the through-hole 6 convex is easy. Further, the portion 1aa that protrudes into the through hole 6 in the uppermost insulating layer 1a is adjacent to the inner peripheral portion where a larger impact is more likely to be applied when the mother substrate 1 breaks along the dividing groove 3. The distance between the layers is large. Therefore, defects such as chipping in the uppermost insulating layer 1a can be more effectively suppressed.

  Note that a part of the through hole 6 of the uppermost insulating layer 1a that is convex does not necessarily have a trapezoidal shape in plan view, but a rectangular shape, an arc shape (fan shape), an elliptical arc shape, or the like. Other shapes or a combination of these shapes may also be used.

  Moreover, in the example shown in FIG. 1 and FIG. 2, the shape of the through hole 6 in plan view is a quadrangular shape. Further, the dividing groove 3 is provided at a position passing through the center of two sides of the through hole 6 facing each other. Moreover, the corner | angular part of the through-hole 6 is shape | molded in circular arc shape. When the shape of the through-hole 6 in plan view is the above shape, for example, it is easy to provide the through-hole 6, and destruction of the mother substrate 1 in a portion adjacent to the through-hole 6 is more effective. The effect that it can be prevented automatically is acquired. Further, since the width of the groove portion 16 provided on the side surface of the individual wiring board 19 is easily secured, it is easy to position the groove portion 16 by fitting a convex portion such as a device. In other words, the multi-piece wiring board 9 is capable of producing the wiring board 19 having higher workability when mounting electronic components.

  In this case, in order to make the dimensions, shapes, and positions of the groove portions 16 in the respective wiring boards 19 the same, the dividing grooves 3 are provided at positions passing through the centers of the two opposite sides of the through hole 6. .

  As described above, the multi-piece wiring board 9 having any one of the above-described configurations is divided along the dividing groove 3 to produce a piece of wiring board 19 which is the wiring board according to the embodiment of the present invention. . The wiring substrate 19 is provided with the wiring conductor 4 on the upper surface of the insulating substrate 11 and the groove 16 on the side surface of the insulating substrate 11.

  According to the wiring board 19 of such an embodiment, since the multi-piece wiring board 9 having the above-described configuration is divided into pieces, the inner peripheral surface of the groove portion 16 in which the through hole 6 is divided, It is possible to provide the wiring board 19 in which the chipping of the insulating layer 1a is suppressed.

The wiring board 19 is used as an electronic component mounting board on which electronic parts are mounted.
The electronic components to be mounted are various electronic components including, for example, the semiconductor elements described above. An electronic component is mounted on the wiring board 19, and the electronic component and the wiring conductor 4 are electrically connected via a conductive connection such as a bonding wire or solder. If necessary, this electronic component is hermetically sealed with a lid or a sealing resin to produce an electronic device such as a semiconductor device, a sensor device, or an imaging device. The manufactured electronic device is mounted as a component on the various electronic devices.

  The groove portion 16 is used as a positioning portion when mounting an electronic component on the wiring board 19, hermetically sealing the mounted electronic component, or mounting an electronic device. As described above, the processing device or the convex portion of the jig is fitted into the groove portion 16, and the wiring board 19 or the electronic device is positioned. In this case, if the groove 16 has a quadrangular shape in plan view (the long side is a rectangular shape along the length direction of the outer side of the insulating substrate 11), the groove 16 is wide so that the convex portion can be easily fitted. is there. Further, when the corner portion of the rectangular groove portion 16 is arcuate in plan view, the possibility of mechanical breakage such as a crack from the corner portion toward the inside of the insulating substrate 11 is reduced.

  The multi-cavity wiring board and the wiring board of the present invention are not limited to the multi-cavity wiring board 9 and the wiring board 19 of the above-described embodiment, and various modifications are possible. For example, as shown in FIGS. 8A and 8B, the through hole 6 may have a circular shape or an elliptical shape in plan view. 8 (a) and 8 (b) are plan views showing a main part in a modification of the multi-piece wiring board 9 shown in FIG. In FIG. 8, the same parts as those in FIG. If the through-hole 6 is circular or elliptical, there is no corner portion that is likely to be a starting point for mechanical breakage such as cracks in the mother substrate 1, which is effective in reducing the possibility of such cracks. is there.

  For example, as shown in FIG. 9, in the form in which the inner periphery of the uppermost insulating layer 1a protrudes into the through hole 3, the depth of the dividing groove 3 is larger than the thickness of the uppermost insulating layer 1a. Also good. That is, the dividing groove 3 may enter the second insulating layer 1b from the top or the lower side. When the mother substrate 1 is thick, providing the dividing grooves 3 with such a depth is effective in securing the dividing property of the mother substrate 1. Also in this case, mechanical destruction such as chipping in the portion 1aa protruding into the through hole 6 of the uppermost insulating layer 1a protruding into the through hole 6 can be suppressed. FIG. 9 is a perspective view showing a main part in another modification of the multi-cavity wiring board 9 shown in FIG. 9, parts similar to those in FIG. 1 are denoted by the same reference numerals.

DESCRIPTION OF SYMBOLS 1 ... Mother board | substrates 1a-1c .. Insulating layer 1aa. Protruding part 1bb. Protruding part 2 ... Wiring board area | region 3 ... Dividing groove 4 ... Wiring conductor 5 ... Dummy area | region 6. ..Through hole 9 ... Multiple wiring board
11 ... Insulated substrate
16 ... groove
19 ... wiring board

Claims (6)

A plurality of insulating layers are stacked, and a plurality of wiring board regions are provided with a mother board arranged vertically and horizontally, and a dividing groove is provided on the upper surface of the mother board along a boundary of the wiring board regions. A large number of wiring boards,
At the boundary of the wiring board region, a through-hole that continuously penetrates the plurality of insulating layers is provided,
In the through-hole, the inner circumference of any one of the plurality of insulating layers is located inside the inner circumference of the other insulating layer, and
A multi-piece wiring board, wherein a part of the inner periphery of the one insulating layer is convex outward in a portion where the dividing groove is provided in the mother board in plan view . 2. The tip of the part of the inner periphery of the one insulating layer that is convex outward is at the same position as the inner periphery of the other insulating layer. Multi-cavity wiring board. 2. The multi-piece wiring board according to claim 1, wherein the part of the inner periphery of the one insulating layer that is convex outward has a trapezoidal shape in plan view. In plan view, the through hole has a quadrangular shape, and the corner portion of the quadrangular through hole has an arc shape,
2. The multi-piece wiring board according to claim 1, wherein the dividing groove is provided at a position passing through the center of two opposing sides of the rectangular through hole. The multi-piece wiring board according to any one of claims 1 to 4, wherein the one insulating layer is an uppermost insulating layer. A wiring board obtained by dividing the multi-cavity wiring board according to claim 1 along the dividing groove.

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