JP2016134538A - Multilayer substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure capable of suppressing rotation of a multilayer substrate, produced by dividing a substrate, even upon occurrence of cracking or chipping in a cut-out portion.SOLUTION: A multilayer substrate 100 constituted by laminating a plurality of layers 130 is partially recessed in the side faces 121, 122 facing a direction parallel with the detection axis of a sensor chip 200, and has a cut-out 140 penetrating the plurality of layers 130 in a direction perpendicular to a surface 110. The cut-out 140 has a pair of first protrusion 141 and second protrusion 142 where one layer 131 out of the plurality of layers 130 protrudes from other layer 132 in a direction parallel with the detection axis out of the surface directions parallel with the surface 110. Furthermore, the ends 145, 146 on the side of the side faces 121, 122 are located away from the side faces 121, 122, when the protrusion 141, 142 are viewed from a direction perpendicular to the surface 110.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laminated substrate configured by laminating a plurality of layers.

  Conventionally, for example, Patent Document 1 proposes a multilayer substrate configured by laminating a plurality of layers. The multilayer substrate has a notch extending in the thickness direction of the multilayer substrate. In other words, the notch is a portion where the side surface of the laminated substrate is recessed.

  Usually, a multilayer substrate is manufactured by dividing a single substrate configured by laminating a plurality of layers into each multilayer substrate. For this reason, the notch part is previously formed in the board | substrate as a through-hole common to adjacent laminated substrates. Thereby, when a board | substrate is divided | segmented, a through-hole becomes a notch part of each laminated substrate.

  Then, the laminated substrate is positioned and fixed to the mounting apparatus by fitting the notch portion into a convex portion provided in the mounting apparatus.

JP 2014-157864 A

  Here, when an inertial sensor such as an acceleration sensor is mounted on a multilayer substrate, the multilayer substrate with respect to the mounting apparatus is provided by the above-described notch so that the inertial sensor is not inclined with respect to a specific direction. Positioning is performed.

  However, there is a problem that stress is concentrated on the corner of the notch due to the impact when the substrate is divided, and the corner is cracked or chipped. Thereby, since the contact range of the convex part with respect to a notch part becomes small, a laminated substrate becomes easy to rotate with respect to a convex part. Accordingly, the accuracy of the other axis sensitivity of the inertial sensor is lowered.

  In view of the above points, the present invention provides a structure capable of suppressing the rotation of the laminated substrate even if the cutout portion is cracked or chipped in the laminated substrate manufactured by dividing the substrate. Objective.

  In order to achieve the above object, according to the first aspect of the present invention, the substrate (160) on which the plurality of layers (130) are stacked is divided into a plurality of parts, and the surface (110) and the side surface are formed. (120) is a laminated substrate on which a sensor chip (200) on which a detection axis for detecting a physical quantity in a specific direction is set is mounted on a surface (110), and is characterized by the following points Yes.

  That is, a part of the side surface (120) is recessed and has a notch (140) penetrating a plurality of layers (130) in a direction perpendicular to the surface (110).

  The notches (140) are provided as a pair on the side surface (120), and at least one layer (131) of the plurality of layers (130) extends from the other layer (132) to the surface ( 110) and a pair of first protrusions (141) and second protrusions (142) that protrude in a direction parallel to the detection axis, and each of the protrusions (141, 142). The ribs (340) are fitted so as to come into contact with each other.

  Furthermore, each protrusion (141, 142) has an end (145, 146) on the side surface (120) side when the protrusion (141, 142) is viewed in a direction perpendicular to the surface (110). It is characterized by being located away from (120).

  According to this, since the pair of protrusions (141, 142) in the notch (140) is located away from the side surface (120), the stress when the substrate (160) is divided is a pair of each of the protrusions (141, 142). It can be prevented from being applied to the protrusions (141, 142). For this reason, even when a crack or a chip occurs in a corner formed by the side surface (120) and the wall surface of the notch (140) when the substrate (160) is divided, the pair of protrusions (141, 142) is not cracked or chipped. Therefore, since the pair of projecting portions (141, 142) is in reliable contact with the rib (340), the rotation of the multilayer substrate can be suppressed with respect to the rib (340).

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is the top view and side view of a laminated substrate which concern on 1st Embodiment of this invention. It is a partial perspective view of a multilayer substrate. It is the figure which showed one manufacturing process of the laminated substrate, and is the top view which showed the through-hole formed in the board | substrate. It is the top view which showed the part by which the multilayer substrate was arrange | positioned in the hole of the case. It is a top view of the notch which concerns on 2nd Embodiment of this invention. It is a top view of the notch which concerns on 3rd Embodiment of this invention. It is a top view of the notch which concerns on 4th Embodiment of this invention. It is a top view of the laminated substrate which concerns on 5th Embodiment of this invention. It is the top view which showed the laminated substrate fixed to the rib by rotating the detection-axis direction with respect to FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The multilayer substrate according to the present embodiment is mounted with a sensor chip of an inertial sensor that detects a physical quantity with a detection axis set such as acceleration and angular velocity, and is used as a component of the inertial sensor. .

  As shown in FIG. 1, the laminated substrate 100 has a plate shape having a surface 110 and side surfaces 120. In the present embodiment, the planar shape of the surface 110 of the multilayer substrate 100 is a square shape. In the multilayer substrate 100, the sensor chip 200, a circuit chip (not shown), a pad, and the like are mounted on the surface 110. In the side view of FIG. 1, the sensor chip 200 is omitted.

  The sensor chip 200 is a sensor device having a sensing unit in which a detection axis for detecting a physical quantity in a specific direction is set. In the present embodiment, the x direction in FIG. 1 is a specific direction. The sensing unit includes, for example, a comb-like movable electrode and a fixed electrode. With such a configuration, the capacitance between the movable electrode and the fixed electrode changes when a physical quantity such as acceleration is applied to the movable electrode. As a result, a physical quantity such as acceleration corresponding to the change in the capacitance is detected.

  As shown in FIGS. 1 and 2, the multilayer substrate 100 is configured by laminating a plurality of layers 130. Each layer 130 is, for example, a ceramic substrate. That is, the multilayer substrate 100 is a multilayer ceramic substrate. The multilayer substrate 100 has a wiring pattern (not shown) at the bonding portion of each layer 130. The wiring pattern is electrically connected to a pad (not shown) provided on the surface 110 of the multilayer substrate 100.

  In addition, the laminated substrate 100 has a notch 140 in which a part of the outer edge is cut off. In other words, the notch 140 is a recess in which a part of the outer edge of the multilayer substrate 100 is recessed inward, and is a so-called castellation.

  Specifically, the notch 140 has a part of the side surfaces 121 and 122 facing the direction parallel to the detection axis (x direction) of the side surface 120 of the multilayer substrate 100, and the multilayer substrate 100. This is a portion that penetrates the plurality of layers 130 in a direction (z direction) perpendicular to the surface 110 of the substrate. That is, the notch 140 penetrates in the thickness direction of the laminated substrate 100 and has a slit shape.

  Here, the notch portions 140 are provided as a pair corresponding to the pair of side surfaces 121 and 122 facing the direction parallel to the detection axis among the side surfaces 120. The plane direction is a direction parallel to the xy plane. In the present embodiment, two notches 140 are provided on one side surface 121. The side surface 122 opposite to the side surface 121 is provided with two notch portions 140 that are paired with the notch portion 140 provided on the side surface 121. That is, “a pair” refers to one notch portion 140 formed on the side surface 121 and one notch portion 140 formed on the side surface 122.

  Furthermore, in this embodiment, the notch 140 is provided as a pair corresponding to the other pair of side surfaces 123 and 124 adjacent to the pair of side surfaces 121 and 122 of the side surface 120. One cutout 140 is formed on each of the side surfaces 123 and 124. Therefore, in the present embodiment, the multilayer substrate 100 has the cutout portions 140 on all of the four side surfaces 121 to 124.

  In the notch 140, the size formed in one layer 131 of the plurality of layers 130 is smaller than the size formed in the other layer 132. In the present embodiment, the size of the notch 140 of the layer 131 constituting the back surface 150 of the multilayer substrate 100 among the plurality of substrates 160 is reduced. Thereby, when the cutout portion 140 is viewed in a direction perpendicular to the surface 110 of the multilayer substrate 100, a part of one layer 131 protrudes from the other layer 132 in the cutout portion 140.

  Specifically, the notch 140 is a pair in which at least one layer 131 of the plurality of layers 130 protrudes from the other layer 132 in a direction parallel to the detection axis in a plane direction parallel to the surface 110. The first protrusion 141 and the second protrusion 142 are provided. Further, the notch 140 has a depth at the bottom 143 in the depth direction of the notch 140 in the plane direction parallel to the surface 110, so that at least one layer 131 of the plurality of layers 130 has a depth from the other layer 132. It has the 3rd protrusion part 144 along the direction. In the present embodiment, the third protrusion 144 is connected to the first protrusion 141 and the second protrusion 142, and the protrusions 141, 142, and 144 are integrated. The protrusions 141, 142, and 144 have the same width.

  Further, the first projecting portion 141 and the second projecting portion 142 are configured such that the end portions 145 and 146 on the side surfaces 121 to 124 side when the projecting portions 141 and 142 are viewed in the direction perpendicular to the surface 110 are the respective side surfaces 121 to 121. Located away from 124. That is, the end portion 145 of the first projecting portion 141 and the end portion 146 of the second projecting portion 142 are not connected to the side surfaces 121 to 124 and are located inside the notch portion 140 with a certain interval. ing.

  The end portions 145 and 146 of the first projecting portion 141 and the second projecting portion 142 have a tapered shape when the end portions 145 and 146 are viewed in a direction perpendicular to the surface 110. Specifically, the end portions 145 and 146 are all tapered so that the width in the direction parallel to the detection axis becomes smaller toward the side surfaces 121 to 124. It has become. The above is the overall configuration of the multilayer substrate 100 according to the present embodiment.

  Next, a method for manufacturing the multilayer substrate 100 will be described. First, a plurality of raw ceramic plates before firing on which a wiring pattern is formed are prepared and laminated to constitute one large substrate. One ceramic substrate corresponds to one layer 130. Further, the substrate includes a plurality of portions to be the laminated substrate 100.

  Subsequently, as shown in FIG. 3, in the substrate 160, a through-hole 161 is formed in a portion corresponding to the notch portion 140 of the adjacent laminated substrate 100 by a press machine. During this pressing, the through-hole 161 is formed so that the size of the notch 140 is reduced only by the lowermost layer 131. That is, the substrate 160 is pressed so that the protrusions 141, 142, and 144 are left on the layer 131. At this time, a line or the like that makes it easy to split the substrate 160 may be provided at the boundary between adjacent laminated substrates 100.

  In the above description, the through-hole 161 is provided after a plurality of raw ceramic substrates are stacked to form the substrate 160. However, the substrate 160 may be formed by other methods. For example, a plurality of raw ceramic substrates provided with through holes 161 in advance may be prepared, and a plurality of ceramic substrates may be stacked to form the substrate 160 so that the through holes 161 of each ceramic substrate communicate with each other.

  As described above, since the end portions 145 and 146 of the first protrusion portion 141 and the second protrusion portion 142 are separated from the side surfaces 121 to 124, the end of the first protrusion portion 141 of the one notch portion 140 is provided. There is a gap between the portion 145 and the end 146 of the second protruding portion 142 of the other notch 140. Similarly, there is a gap between the end 146 of the second protrusion 142 of the one notch 140 and the end 145 of the first protrusion 141 of the other notch 140. Then, the raw substrate 160 is fired. Thereafter, the substrate 160 is divided for each laminated substrate 100 along the broken line shown in FIG. Thus, the laminated substrate 100 is completed.

  Next, fixation of the multilayer substrate 100 to the case of the inertial sensor will be described. First, as shown in FIG. 4, the case 300 has a hole 310, for example, a resin material is molded. The hole portion 310 is a portion in which a part of the outer wall surface of the case 300 is recessed, and includes a wall portion 320 and a bottom portion 330.

  The case 300 has a rib 340. The rib 340 protrudes in a direction (Y direction) perpendicular to the detection axis (X direction) of the sensor chip 200 in a plane direction in which a part of the wall 320 of the hole 310 is parallel to the surface 110 of the multilayer substrate 100. This is a semi-cylindrical part. The rib 340 is fitted into the notch 140 of the multilayer substrate 100, so that the position of the multilayer substrate 100 is fixed at the bottom 330 of the case 300.

  The ribs 340 are provided in the case 300 as a pair corresponding to the pair of cutout portions 140. Further, the pair of ribs 340 are fitted into the pair of cutout portions 140 provided on the side surfaces 121 and 122 of the multilayer substrate 100. The pair of cutout portions 140 are in contact with a direction parallel to the detection axis of the sensor chip 200 among the portions formed in one layer 131. That is, the rib 340 is in contact with the first protrusion 141 and the second protrusion 142 of the notch 140. Thereby, the first protrusion 141 and the second protrusion 142 can regulate the relative movement of the rib 340 in a direction parallel to the detection axis of the sensor chip 200. In other words, the size from the first protrusion 141 to the second protrusion 142 is the same as the size of the rib 340 in the direction parallel to the detection axis of the sensor chip 200.

  Further, the tip of the rib 340 is in contact with the third protrusion 144 of the notch 140. Accordingly, the third protrusion 144 can restrict the relative movement of the rib 340 in the direction perpendicular to the detection axis of the sensor chip 200.

  As described above, in the present embodiment, in the cutout portion 140 of the multilayer substrate 100, the first protrusion 141, the second protrusion 142, and the third protrusion due to the layer 131 having a smaller size than the other layers 132. The structure provided with 144 is a feature. The pair of protrusions 141 and 142 in the notch 140 is characterized by being spaced apart from the side surfaces 121 and 122 by a certain distance. As a result, stress when the substrate 160 is divided, stress during conveyance of the laminated substrate 100, assembly to the case 300, and the like are not applied to the protrusions 141 and 142. That is, since the end portions 145 and 146 of the protrusions 141 and 142 have a structure that is resistant to external stress, it is possible to prevent the protrusions 141 and 142 from being cracked or chipped. Therefore, the rib 340 can be reliably brought into contact with the projecting portions 141 and 142 of the notch 140, and consequently, the rotation of the multilayer substrate 100 can be suppressed with respect to the rib 340.

  In particular, it is conceivable to increase the size of the cutout portion 140 by allowing cracks and cutouts in the cutout portion 140. However, the size of the cutout portion 140 is required in a situation where a reduction in the size of the laminated substrate 100 is required. Cannot be increased. However, as in the present embodiment, the protrusions 141 and 142 are provided and the end portions 145 and 146 are separated from the side surfaces 121 to 124 so that the rib 340 contacts the protrusions 141 and 142. There is an advantage that it is possible to secure the thickness and it is not necessary to increase the size of the notch 140.

  Furthermore, in this embodiment, since the 3rd protrusion part 144 is provided in the depth direction of the notch part 140, the movement of the laminated substrate 100 in the depth direction of the notch part 140 can also be restrict | limited.

  In the present embodiment, since the two notches 140 are provided on the side surfaces 121 and 122, the rib 340 can be fitted into both the notches 140. As a result, even if any problem occurs in one of the cutout portions 140 and the ribs 340, the laminated substrate 100 can be kept fixed by the other cutout portions 140 and the ribs 340. Therefore, by providing a plurality of notches 140 on the side surfaces 121 and 122, redundancy can be improved.

(Second Embodiment)
In the present embodiment, parts different from the first embodiment will be described. As shown in FIG. 5, the end portions 145 and 146 of the first protrusion portion 141 and the second protrusion portion 142 correspond to the end portions when the end portions 145 and 146 are viewed in a direction perpendicular to the surface 110. Part of 145, 146 is tapered. Each end 145, 146 may have such a shape.

(Third embodiment)
In the present embodiment, parts different from the first and second embodiments will be described. As shown in FIG. 6, the end portions 145 and 146 of the first projecting portion 141 and the second projecting portion 142 have an arc shape. That is, when the end portions 145 and 146 are viewed in the direction perpendicular to the surface 110, the end portions 145 are arranged such that the width in the direction parallel to the detection axis decreases toward the side surfaces 121 and 122. 146 has an arc shape. Each end 145, 146 may have such a shape.

(Fourth embodiment)
In the present embodiment, parts different from the first to third embodiments will be described. As shown in FIG. 7, the end portions 145 and 146 of the first projecting portion 141 and the second projecting portion 142 have a right-angled shape. That is, when the end portions 145 and 146 are viewed in the direction perpendicular to the surface 110, the portions facing each other have a right-angled shape. In other words, each of the end portions 145 and 146 is configured by connecting a wall surface along each of the side surfaces 121 to 124 and a wall surface along the depth direction of the cutout portion 140 at a right angle. Each end 145, 146 may have such a shape.

(Fifth embodiment)
In the present embodiment, parts different from the above embodiments will be described. As shown in FIG. 8, the surface 110 of the laminated substrate 100 is octagonal. Further, one notch portion 140 is provided on each of the side surfaces 121 to 128 corresponding to the octagonal sides. Thereby, each notch part 140 is paired. The laminated substrate 100 is fixed to the case 300 by being fitted into the pair of ribs 340.

  Here, as shown in FIG. 9, the direction of the detection axis of the sensor chip 200 can be rotated to fix the multilayer substrate 100 to the rib 340. Thus, the direction of the detection axis can be freely changed with respect to the case 300 by providing the notches 140 on the respective side surfaces 121 to 128 of the multilayer substrate 100. In order to prevent the multilayer substrate 100 from interfering with the case 300 by rotating the multilayer substrate 100, the surface 110 of the multilayer substrate 100 is preferably a regular octagon.

(Other embodiments)
The configuration of the multilayer substrate 100 shown in each of the above embodiments is an example, and the present invention is not limited to the configuration shown above, and other configurations that can realize the present invention can be used. For example, the first projecting portion 141, the second projecting portion 142, and the third projecting portion 144 do not have to be formed on the same layer 131, and may be formed on different layers 130. Further, the third protrusion 144 may not be connected to the first protrusion 141 and the second protrusion 142. Furthermore, at least the first protrusion 141 and the second protrusion 142 may be provided, and the third protrusion 144 may not be provided.

  In each of the above embodiments, each of the protrusions 141, 142, and 144 is formed in one of the plurality of layers 130, but may be formed in the plurality of layers 130. For example, each protrusion 141, 142, 144 may be formed in two layers 130 of the plurality of layers 130.

  In each of the above embodiments, the notch 140 is provided on the side surfaces 121 and 122 facing the direction parallel to the detection axis among the side surfaces 120, but this is an example. Therefore, the notch 140 is not provided on the side surfaces 121 and 122 facing in the direction parallel to the detection axis, but may be provided on the side surfaces 123 and 124.

  In each of the above embodiments, a square or octagonal shape is shown as the planar shape of the surface 110 of the multilayer substrate 100, but the planar shape of the surface 110 is not limited to these. For example, a triangle, pentagon, or hexagon may be used. And the cutout part 140 should just be provided in the side surfaces 121-128 corresponding to each side of a polygonal shape. On the other hand, the planar shape of the surface 110 of the multilayer substrate 100 may be circular or elliptical. Even in this case, since the notches 140 are provided as a pair on the side surface 120, the rotation of the laminated substrate 100 can be suppressed.

  In the first embodiment, two notches 140 are provided on the side surfaces 121 and 122 corresponding to the ribs 340, but one may be used. Further, the pair of notches 140 may not be provided on the side surfaces 123 and 124. That is, the notch 140 may not be provided on all of the side surfaces 120. Also in the fifth embodiment, one notch 140 is provided on each of the side surfaces 121 to 128 corresponding to each side of the octagon, but a plurality of notches 140 are provided on one side of the octagon. May be. Of course, the same applies to polygons other than octagons.

120-128 Side surface 130, 131, 132 Layer 140 Notch part 141, 142, 144 Protrusion part 143 Bottom part 145, 146 End part 160 Substrate 200 Sensor chip

Claims (7)

A substrate (160) on which a plurality of layers (130) are laminated is divided into a plurality of plates, and is a plate having a front surface (110) and a side surface (120). A sensor chip (200) on which a detection axis to be detected is set is a laminated substrate mounted on the surface (110),
A portion of the side surface (120) is recessed and has a notch (140) penetrating the plurality of layers (130) in a direction perpendicular to the surface (110);
The notch (140) is provided as a pair on the side surface (120), and at least one layer (131) of the plurality of layers (130) is separated from the other layer (132). It has a pair of first protrusions (141) and second protrusions (142) protruding in a direction parallel to the detection axis among the surface directions parallel to the surface (110), and each of the protrusions (141 142) the ribs (340) are fitted so as to be in contact with each other,
Further, the protrusions (141, 142) are end portions (145, 146) on the side surface (120) side when the protrusions (141, 142) are viewed in a direction perpendicular to the surface (110). Is located away from the side surface (120).   The end (145, 146) has a width in a direction parallel to the detection axis when the end (145, 146) is viewed in a direction perpendicular to the surface (110). 2. The multilayer substrate according to claim 1, wherein a part or all of the end portions (145, 146) are tapered so as to become smaller toward the) side.   The end (145, 146) has a width in a direction parallel to the detection axis when the end (145, 146) is viewed in a direction perpendicular to the surface (110). The laminated substrate according to claim 1, wherein the end portions (145, 146) have an arc shape so as to become smaller toward the side.   The end portions (145, 146) are formed such that, when the end portions (145, 146) are viewed in a direction perpendicular to the surface (110), the portions facing each other have a right-angled shape. The multilayer substrate according to claim 1.   The notch (140) includes at least one of the plurality of layers (130) at the bottom (143) in the depth direction of the notch (140) in the plane direction parallel to the surface (110). One layer (131) has a third protrusion (144) along the depth direction from the other layer (132), and the rib (340) is in contact with the third protrusion (144). The laminated substrate according to claim 1, wherein the laminated substrate is fitted. The surface (110) has a polygonal shape in plan view.
The said notch (140) is provided in the side surface (121-128) corresponding to each side of the said polygonal shape at least 1 piece, The one of Claim 1 thru | or 5 characterized by the above-mentioned. Laminated substrate. The surface (110) has a polygonal shape in plan view.
The multilayer substrate according to any one of claims 1 to 6, wherein a plurality of the notches (140) are provided on side surfaces (121 to 128) corresponding to the sides of the polygonal shape. .

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